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Infineon Technologies IRFR7540TRLPBF

Part No.:
IRFR7540TRLPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixIRFR7540TRLPBF.pdf
Description:
MOSFET N-CH 60V 90A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,767

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Product details

Overview

IRFR7540TRLPBF from Infineon Technologies (formerly International Rectifier) is a 60V N-channel D-Pak power MOSFET optimized for high-current switching in motor drives and DC/DC converters. It delivers 4.0 mΩ typical RDS(on) at VGS = 10 V, supports 90 A continuous drain current (package-limited), and features enhanced body diode dV/dt capability up to 11 V/ns - enabling robust operation in BLDC motor half-bridge and synchronous rectifier topologies.

For engineers reviewing the IRFR7540TRLPBF datasheet, IRFR7540TRLPBF pinout, IRFR7540TRLPBF application, or IRFR7540TRLPBF equivalent, key selection criteria include its 1.05 °C/W junction-to-case thermal resistance, 86 nC total gate charge, avalanche energy rating of 160 mJ (single-pulse), and RoHS-compliant lead-free construction - all critical for thermally constrained, high-reliability power stage designs.

Technical Context

This MOSFET employs a trench-gated HEXFET® structure with optimized cell pitch and source bonding to achieve low on-resistance while maintaining high avalanche ruggedness. Its gate threshold voltage (2.1–3.7 V) ensures stable turn-on across temperature, and the fully characterized Ciss (4360 pF), Coss (410 pF), and Crss (260 pF) support accurate switching loss modeling in hard-switched and resonant topologies.

The device integrates a fast, soft-recovery body diode with trr = 34 ns (TJ = 25°C) and Qrr = 36 nC, enabling efficient freewheeling in bridge configurations without external Schottky supplementation. Its SOA is validated up to 100 µs pulse width at 66 A, supporting unclamped inductive switching per JEDEC JESD24-11.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS60 V - Maximum blocking voltage for 12–48 V bus applications including automotive and industrial DC/DC stages.
RDS(on) typ.4.0 mΩ @ VGS = 10 V, ID = 66 A - Enables <1.5 W conduction loss at 60 A, reducing heatsink requirements in compact inverters.
ID (Package)90 A @ TC = 25°C - Determined by D-Pak leadframe thermal and current-carrying capacity, not silicon limit.
EAS160 mJ (single-pulse) - Supports reliable unclamped inductive switching in motor drive fault conditions without failure.
Qg86 nC typ. - Defines gate driver power requirement; enables 100 kHz switching with ≤2 A peak gate current using standard drivers.
tr/tf38 ns / 32 ns - Fast edge rates minimize overlap loss in half-bridge operation when paired with matched complementary FETs.
RθJC1.05 °C/W - Allows direct thermal interface to heatsink; enables 140 W dissipation at ΔT = 148°C above case temperature.

Pinout & Package

D-Pak (TO-252AA) package with exposed drain pad for low-inductance, high-current PCB mounting and thermal conduction. Standard 3-pin configuration: Drain (tab + Pin 2), Source (Pin 1), Gate (Pin 3).

Pin/Terminal Circuit Role Design Meaning
Pin 1 (Source)Source terminal (S)Low-side reference node; connects to ground or low-side switch node; carries full load current in low-side configuration.
Pin 2 (Drain)Drain terminal (D)High-current output node; electrically connected to exposed metal tab; must be soldered to large copper pour for thermal and current handling.
Pin 3 (Gate)Control input (G)High-impedance MOSFET control node; requires <2.4 Ω series gate resistor to damp ringing and limit dv/dt-induced shoot-through risk.

Key Features

Feature Design Value
Enhanced body diode dV/dt capability11 V/ns at TJ = 175°C - Prevents false turn-on during high-speed commutation in bridge legs without snubbers.
Fully characterized avalanche SOAValidated single-pulse EAS = 160 mJ and repetitive EAR = 273 mJ - Enables design margin for inductive fault transients in motor control.
Low Coss energy-related valueCoss(ER) = 410 pF - Reduces capacitive turn-off loss in resonant LLC and ZVS converters operating above 200 kHz.
Lead-free, RoHS-compliant constructionMeets IPC/JEDEC J-STD-020D reflow profile - Supports lead-free assembly without derating or process modification.
Improved dynamic dV/dt ruggednessRated for >50 V/ns transient immunity - Ensures noise immunity in high-di/dt environments like BLDC phase-leg switching.

Applications

Brushed Motor Drive BLDC Motor Inverter

Use Scenario: H-bridge driver for 24–48 V cordless power tools with PWM-controlled torque and direction.

IC Role / Device Role / Timing Role: Low-side switching element in dual half-bridge topology; handles bidirectional current up to 90 A peak.

Use Value: 4.0 mΩ RDS(on) reduces I²R losses by >30% vs. legacy 6.5 mΩ MOSFETs, extending battery runtime per charge cycle.

Use Scenario: Upper and lower switches in 3-phase inverter for e-bike controller with sensorless FOC.

IC Role / Device Role / Timing Role: High- and low-side power switch in each leg; operates at 16–20 kHz PWM with dead-time control.

Use Value: 34 ns reverse recovery time and 11 V/ns diode dV/dt rating suppress shoot-through risk and reduce gate driver stress.

Synchronous Rectification OR-ing Power Switch

Use Scenario: Secondary-side switch in isolated 48 V → 12 V DC/DC converter for telecom shelf power.

IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode; driven by transformer-coupled or controller-synchronized signal.

Use Value: 1.2 V body diode forward drop and low Qrr (36 nC) cut conduction loss by 45% versus 40 V Schottky, improving efficiency from 92% to 94.5%.

Use Scenario: Redundant 24 V power supply OR-ing in industrial PLC backplane with hot-swap capability.

IC Role / Device Role / Timing Role: Low-loss power path selector; conducts only when upstream voltage exceeds downstream by >50 mV.

Use Value: 90 A package rating and 1.05 °C/W RθJC enable parallel operation with minimal thermal derating, supporting >100 A system-level current.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRF7470PbFRDS(on) = 5.2 mΩ (max), 80 A package rating, same D-Pak footprintLower current handling and higher on-resistance - suitable only for <70 A average loadsSelect when cost sensitivity outweighs efficiency targets and thermal margin is ample.
STL220N6F760 V, 4.0 mΩ typ., 110 A (silicon-limited), TO-220FP packageLarger through-hole package with higher RθJA (50 °C/W) - requires larger heatsink and manual assemblyChoose for legacy board compatibility where D-Pak rework is prohibited and thermal mass compensates for poorer RθJC.

Compared with IRF7470PbF, IRFR7540TRLPBF delivers 12% lower conduction loss and 12.5% higher current rating in identical D-Pak layout; versus STL220N6F7, it offers superior thermal performance (1.05 vs. 2.5 °C/W RθJC) and surface-mount scalability but lacks through-hole mechanical retention.

Availability

IRFR7540TRLPBF is available at Aetrix Electronics and suitable for brushed motor drives, BLDC inverters, and synchronous rectifier circuits requiring stable component supply, consistent parametric performance, and long-term industrial lifecycle support.

Supply support for IRFR7540TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control ICs and discrete devices, with core expertise in silicon and wide-bandgap power semiconductors.

This device belongs to the StrongIRFET™ HEXFET® family, engineered specifically for high-efficiency, high-reliability power conversion in motor drives, server PSUs, and renewable energy systems where ruggedness and low conduction loss are critical.

FAQ

What is the maximum allowable junction temperature for IRFR7540TRLPBF?

The absolute maximum operating junction temperature is +175°C, as specified in the Absolute Maximum Ratings table. Continuous operation at this temperature requires strict thermal design - including minimum 100 mm² exposed copper area under the drain tab and ≤1.05 °C/W total thermal resistance from junction to ambient - to avoid exceeding TJmax under 90 A load.

Does IRFR7540TRLPBF support gate drive at 5 V logic level?

No - the gate threshold voltage range is 2.1–3.7 V, but RDS(on) is not guaranteed below VGS = 6 V. At VGS = 5 V, RDS(on) rises to ~5.2 mΩ (typ.), increasing conduction loss by 30%. Full 4.0 mΩ performance requires ≥10 V gate drive, making it incompatible with 5 V-only microcontrollers without level-shifting.

Can IRFR7540TRLPBF be used in parallel configurations?

Yes - its positive temperature coefficient of RDS(on) (normalized to 2.5× at 175°C) enables inherent current sharing. Successful paralleling requires matched gate drive impedance (<5% variation), symmetrical PCB layout, and shared source inductance <10 nH. Derate total current by 15% for 2-device parallel operation per AN-1140 guidelines.

Is the body diode suitable for continuous reverse conduction in synchronous rectification?

Yes - the body diode is rated for 110 A continuous source current (IS) and exhibits soft, low-Qrr recovery (36 nC). However, sustained reverse conduction above 66 A requires active gate control (e.g., adaptive dead-time adjustment) to prevent thermal runaway, as forward voltage increases to 1.2 V at 66 A and TJ = 25°C.

IRFR7540TRLPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®, StrongIRFET™
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
90A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
6V, 10V
Rds On (Max) @ Id, Vgs:
4.8mOhm @ 66A, 10V
Vgs(th) (Max) @ Id:
3.7V @ 100µA
Gate Charge (Qg) (Max) @ Vgs:
130 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4360 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
140W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-252AA (DPAK)

IRFR7540TRLPBF FAQ

1.How can I place an order for IRFR7540TRLPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFR7540TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFR7540TRLPBF reliable?

The price and inventory of IRFR7540TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR7540TRLPBF is usually 5 days.

3.What payment methods are accepted for IRFR7540TRLPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR7540TRLPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFR7540TRLPBF?

IRFR7540TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFR7540TRLPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFR7540TRLPBF?

For technical support, including IRFR7540TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR7540TRLPBF requirements.

6.How does Aetrix verify that IRFR7540TRLPBF is sourced from the original manufacturer or authorized distributors?

All IRFR7540TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR7540TRLPBF meets industry standards.

7.What is the process for return or replacement of IRFR7540TRLPBF?

All IRFR7540TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFR7540TRLPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFR7540TRLPBF part is unused and in its original packaging.

Return procedure for IRFR7540TRLPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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