Infineon Technologies IRFS31N20DPBF
- Part No.:
- IRFS31N20DPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRFS31N20DPBF.pdf
- Description:
- MOSFET N-CH 200V 31A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:4,209
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFS31N20DPBF from Infineon Technologies is a 200V, 31A N-channel enhancement-mode Power MOSFET in TO-220AB package, optimized for high-frequency DC-DC converters including active-clamp forward topologies. It features 0.082Ω RDS(on) at VGS = 10V, 70nC total gate charge, and fully characterized Coss (170pF effective) to simplify snubberless design in telecom 48V input systems.
For engineers reviewing the IRFS31N20DPBF datasheet, IRFS31N20DPBF pinout, IRFS31N20DPBF application, or IRFS31N20DPBF equivalent, key selection criteria include avalanche energy rating (420mJ), diode reverse recovery time (200–300ns), gate threshold voltage (3.0–5.5V), and thermal resistance (RθJC = 0.75°C/W) for thermally constrained power stages.
Technical Context
This HEXFET device uses planar stripe cell structure with low gate-drain charge (Qgd = 33–65nC) and minimized Miller effect to enable fast switching at >500kHz in isolated DC-DC converters. Its fully characterized Coss vs. VDS curve and effective output capacitance (170pF) support accurate zero-voltage switching (ZVS) timing analysis.
The integrated body diode exhibits 1.3V forward drop at 18A and 200–300ns reverse recovery time under di/dt = 100A/µs, enabling reliable synchronous rectification or active-clamp reset operation without external diode supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 200V - supports 48V telecom input with ≥4× safety margin against transient overvoltage |
| RDS(on) max | 0.082Ω @ VGS = 10V, ID = 18A - enables ≤5W conduction loss at 31A continuous drain current |
| Qg | 70–107nC - determines gate driver power requirement and switching speed in hard-switched topologies |
| Coss,eff | 170pF - defines resonant tank behavior during ZVS transitions in active-clamp forward converters |
| EAS | 420mJ - ensures single-pulse unclamped inductive switching survivability in fault conditions |
| trr | 200–300ns - limits diode commutation losses and EMI generation during body-diode conduction |
| RθJC | 0.75°C/W - allows direct heatsink mounting with predictable junction temperature rise under 200W dissipation |
Pinout & Package
IRFS31N20DPBF is housed in a TO-220AB package with isolated tab (drain-connected), standardized for mechanical mounting and thermal interface to heatsinks. Lead assignments follow JEDEC outline: Pin 1 = Gate, Pin 2 = Drain, Pin 3 = Source, Pin 4 = Drain (dual-drain configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control electrode | Receives 10V logic-level drive; threshold 3.0–5.5V enables compatibility with standard PWM controllers |
| 2 (Drain) | Main high-side current path | Connected to primary winding or bus rail; electrically tied to metal tab for low-inductance heat sinking |
| 3 (Source) | Reference node for gate drive | Serves as return path for load current and gate drive loop; critical for minimizing dv/dt-induced shoot-through |
| 4 (Drain) | Secondary drain connection | Provides redundant current path and lower package inductance; used for Kelvin drain sensing in precision designs |
Key Features
| Feature | Design Value |
|---|---|
| Lead-free construction | RoHS-compliant plating and soldering profile compatible with 300°C reflow (10s) |
| Low Qgd/Qg ratio | 33–65nC / 70–107nC - reduces Miller-induced switching delay and improves controllability at high dV/dt |
| Fully characterized Coss | 170pF effective value across 0–160V - enables precise soft-switching timing without iterative prototyping |
| Avalanche-rated | 420mJ single-pulse energy - eliminates need for external clamping in inductive load transients |
| Optimized body diode | 200–300ns trr, 1.3V VSD - supports bidirectional current flow in active-clamp and synchronous rectifier modes |
Applications
| Telecom DC-DC Converters | Active-Clamp Forward Converters |
|---|---|
Use Scenario: 48V input to 12V/30A isolated power supply in base station RF modules. IC Role / Device Role / Timing Role: Primary-side switch operating at 300–500kHz with ZVS enabled by Coss,eff and dual-drain layout. Use Value: 0.082Ω RDS(on) and 70nC Qg reduce conduction + switching losses to <8W, enabling natural convection cooling. | Use Scenario: High-efficiency 200W server PSU using active-clamp forward topology with 200V bus. IC Role / Device Role / Timing Role: Main switch clamped by auxiliary FET; body diode conducts during reset phase. Use Value: 420mJ EAS and 200–300ns trr ensure reliable clamp energy absorption and minimal recovery overshoot. |
| Industrial Motor Drives | UPS Inverter Stages |
Use Scenario: 3-phase IGBT gate driver auxiliary supply with 200V DC link input. IC Role / Device Role / Timing Role: High-side switch in flyback or forward converter powering isolated gate drivers. Use Value: Dual-drain (Pins 2 & 4) lowers package inductance, reducing voltage spikes during 124A pulsed drain current. | Use Scenario: Online UPS inverter stage requiring robust 200V switching with fault tolerance. IC Role / Device Role / Timing Role: Low-side switch in half-bridge output stage handling battery backup loads. Use Value: RθJC = 0.75°C/W and 21A continuous current at 100°C case enable 98% efficiency at full load without forced air. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP31N20 | RDS(on) = 0.085Ω, Qg = 75nC, no dual-drain pinout | Lacks Pin 4; higher gate charge increases driver loss in >300kHz designs | Preferred where cost sensitivity outweighs ZVS optimization and thermal margin |
| IXTH30N20L | RDS(on) = 0.075Ω, Qg = 82nC, TO-247 package | Higher thermal mass but larger footprint; better for >100W continuous conduction | Chosen when RθJA < 40°C/W is required and board space permits TO-247 |
Compared with STP31N20 and IXTH30N20L, IRFS31N20DPBF offers superior ZVS enablers (lower Qgd, dual-drain, 170pF Coss,eff) in a compact TO-220AB form factor-ideal for space-constrained telecom and industrial SMPS where switching frequency and thermal density are prioritized.
Availability
IRFS31N20DPBF is available at Aetrix Electronics and suitable for telecom DC-DC converters, active-clamp forward power supplies, and industrial motor drive auxiliary supplies requiring stable component supply and long-term lifecycle assurance.
Supply support for IRFS31N20DPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
This device belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-frequency switching in telecom, server, and industrial power conversion systems where reliability under repetitive avalanche stress is mandatory.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRFS31N20DPBF supports 21A continuous drain current at TC = 100°C with VGS = 10V, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-220AB package and must be validated against actual PCB copper area and heatsink interface resistance in final layout.
Does the device require a negative gate turn-off voltage?
No, IRFS31N20DPBF operates with 0V to +10V gate drive and does not require negative turn-off bias. Its gate threshold voltage range (3.0–5.5V) and ±30V VGS rating allow safe use with standard 12V logic-level drivers; negative voltage is unnecessary and not recommended per datasheet guidelines.
Can it replace IRFB31N20DPbF in existing designs?
Yes-IRFS31N20DPBF shares identical electrical specs, thermal performance, and pinout with IRFB31N20DPbF (TO-220AB variant), differing only in packaging detail (no "B" suffix). Both are lead-free, share same die, and are functionally interchangeable without layout or thermal redesign.
Is the body diode suitable for synchronous rectification?
The integrated body diode has 200–300ns reverse recovery time and 1.3V forward drop at 18A, making it usable in low-duty-cycle synchronous rectification but not optimal for high-frequency, high-current secondary-side applications. External Schottky diodes or dedicated SR controllers are preferred for >100kHz, >20A secondary-side use.
IRFS31N20DPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 31A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 82mOhm @ 18A, 10V
- Vgs(th) (Max) @ Id:
- 5.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 107 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2370 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.1W (Ta), 200W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRFS31N20DPBF FAQ
1.How can I place an order for IRFS31N20DPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFS31N20DPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFS31N20DPBF reliable?
The price and inventory of IRFS31N20DPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFS31N20DPBF is usually 5 days.
3.What payment methods are accepted for IRFS31N20DPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFS31N20DPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFS31N20DPBF?
IRFS31N20DPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFS31N20DPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFS31N20DPBF?
For technical support, including IRFS31N20DPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFS31N20DPBF requirements.
6.How does Aetrix verify that IRFS31N20DPBF is sourced from the original manufacturer or authorized distributors?
All IRFS31N20DPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFS31N20DPBF meets industry standards.
7.What is the process for return or replacement of IRFS31N20DPBF?
All IRFS31N20DPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFS31N20DPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFS31N20DPBF part is unused and in its original packaging.
Return procedure for IRFS31N20DPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFS31N20DPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

