Infineon Technologies IRFS4010PBF
- Part No.:
- IRFS4010PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRFS4010PBF.pdf
- Description:
- MOSFET N-CH 100V 180A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:8,379
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFS4010PBF from Infineon Technologies (formerly International Rectifier) is a 100V, 180A N-channel enhancement-mode HEXFET Power MOSFET in D2PAK (TO-262) package, optimized for high-current synchronous rectification and hard-switched SMPS topologies. It features 3.9 mΩ typical RDS(on), 143 nC total gate charge, and enhanced body diode dV/dt and dI/dt capability for robust unclamped inductive switching.
For engineers reviewing the IRFS4010PBF datasheet, IRFS4010PBF pinout, IRFS4010PBF application, or IRFS4010PBF equivalent, key selection criteria include its 720 W maximum power dissipation at TC = 25°C, 0.40 °C/W junction-to-case thermal resistance, 106 A avalanche current rating, and validated performance in UPS and high-frequency DC-DC converters requiring low conduction loss and fast recovery.
Technical Context
This MOSFET employs planar silicon-gate technology with optimized cell layout to achieve low RDS(on) while maintaining rugged avalanche performance. Its dynamic parameters-including 50 nC Miller charge, 86 ns rise time, and 77 ns fall time-are characterized at VDD = 65 V, ID = 106 A, and RG = 2.7 Ω, supporting operation up to several hundred kHz in resonant and phase-shifted topologies.
The integrated body diode exhibits 72 ns reverse recovery time and 210 nC reverse recovery charge at TJ = 25°C, with VSD = 1.3 V at IS = 106 A, enabling efficient bidirectional current handling in synchronous buck and LLC configurations without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 100 V - Maximum drain-source blocking voltage; supports 48 V and 60 V bus systems with 20% margin. |
| RDS(on) typ. | 3.9 mΩ - Enables ≤0.7 W conduction loss at 135 A DC, critical for high-efficiency server VRMs. |
| ID @ TC = 25°C | 180 A - Continuous drain current rating under ideal heatsink conditions; defines PCB copper area requirements. |
| Qg max. | 215 nC - Gate drive energy demand; determines gate driver peak current (≥8 A) and loop inductance sensitivity. |
| EAS | 318 mJ - Single-pulse avalanche energy; allows safe operation during transient overvoltage events in industrial motor drives. |
| RθJC | 0.40 °C/W - Junction-to-case thermal resistance; enables direct mounting to cold plates for >300 W thermal management. |
| trr | 72 ns - Body diode reverse recovery time at TJ = 25°C; limits switching frequency in synchronous rectifiers. |
Pinout & Package
IRFS4010PBF uses the D2PAK (TO-262) surface-mount package with exposed drain pad for thermal and electrical connection. The three terminals are arranged in standard G-D-S order on the leadframe.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Gate (G) | Control input | Receives 10 V gate drive to fully enhance channel; threshold voltage 2.0–4.0 V ensures TTL/CMOS compatibility. |
| Drain (D) | High-side power output | Connected to PCB thermal pad; carries full load current and must be routed with ≥3 oz copper for 180 A DC. |
| Source (S) | Reference node / return path | Provides low-impedance source return; ties to power ground plane and gate driver reference to minimize shoot-through risk. |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced avalanche ruggedness | Rated for 318 mJ single-pulse EAS and 106 A IAR; eliminates need for external snubbers in UPS inverters. |
| Low Coss eff. (TR) | 1112 pF - Time-related effective output capacitance reduces turn-off losses in ZVS circuits above 200 kHz. |
| Improved body diode dI/dt capability | 1319 A/μs - Supports fast current reversal in synchronous rectification without oscillation or latch-up. |
| Lead-free and RoHS-compliant | Pb-free plating and halogen-free molding compound; meets IPC-J-STD-020 moisture sensitivity level 3 (MSL3). |
| Characterized SOA curves | Full Safe Operating Area defined up to 100 μs pulse width; enables reliable design of peak-current-limited protection schemes. |
Applications
| Server Voltage Regulator Modules | Uninterruptible Power Supply Inverters |
|---|---|
|
Use Scenario: High-density 48 V–12 V step-down conversion delivering up to 300 A per phase in AI accelerator racks. IC Role / Device Role / Timing Role: Primary synchronous rectifier switch operating at 300–500 kHz with forced-air cooling. Use Value: 3.9 mΩ RDS(on) reduces conduction loss by 35% versus 6.0 mΩ alternatives, directly improving system efficiency from 92% to 94.2% at 200 A. |
Use Scenario: Bidirectional DC-AC inversion stage in 5–10 kVA online UPS systems with battery backup. IC Role / Device Role / Timing Role: High-side switching element in full-bridge topology handling 106 A pulsed currents during line-to-battery transfer. Use Value: 318 mJ EAS and 106 A IAR enable reliable operation during 10 ms grid dropout events without derating or parallel devices. |
| Industrial Motor Drive Half-Bridges | High-Frequency Induction Heating |
|
Use Scenario: 3-phase inverter driving 7.5 kW permanent magnet motors in CNC spindles with field-oriented control. IC Role / Device Role / Timing Role: Low-side switch in IGBT/MOSFET hybrid half-bridge, commutating at 16 kHz with 100% duty cycle capability. Use Value: 0.40 °C/W RθJC allows direct cold-plate mounting, sustaining 127 A continuous current at TC = 100°C without thermal throttling. |
Use Scenario: Resonant tank switching in 100–300 kHz induction heating generators for metal forging and brazing. IC Role / Device Role / Timing Role: Zero-voltage switching (ZVS) main switch in series-resonant LLC topology with 65 V bus and 180 A peak current. Use Value: 72 ns trr and 210 nC Qrr minimize diode recovery losses, reducing total switching loss by 22% compared to standard trench MOSFETs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW90NF10 | 100 V, 90 A, RDS(on) = 10.5 mΩ, TO-247 package, higher RDS(on) and lower ID. | Requires paralleling for 180 A loads; larger footprint and higher thermal resistance (RθJC = 0.55 °C/W). | Select when legacy TO-247 socket compatibility is required and board space permits dual devices. |
| IXFH180N10L2 | 100 V, 180 A, RDS(on) = 3.2 mΩ, TO-247 package, lower RDS(on) but no avalanche rating published. | Lacks documented EAS specification; unsuitable for unclamped inductive loads without external clamping. | Select only in ZVS or soft-switched designs where avalanche stress is absent and lowest possible conduction loss is prioritized. |
Compared with STW90NF10 and IXFH180N10L2, IRFS4010PBF uniquely balances ultra-low RDS(on), industry-leading avalanche energy, and D2PAK thermal performance-making it optimal for space-constrained, high-reliability SMPS where both efficiency and fault tolerance are non-negotiable.
Availability
IRFS4010PBF is available at Aetrix Electronics and suitable for high-efficiency synchronous rectification in SMPS, uninterruptible power supply inverters, and high-speed power switching in industrial motor drives requiring stable component supply across multi-year production cycles.
Supply support for IRFS4010PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
IRFS4010PBF belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-current, high-ruggedness switching in telecom rectifiers, server VRMs, and industrial UPS systems demanding low RDS(on) and guaranteed avalanche performance.
FAQ
What is the maximum recommended gate voltage for IRFS4010PBF?
The absolute maximum gate-to-source voltage (VGS) is ±20 V. Operation above +20 V risks oxide breakdown, while sustained negative gate voltage below –20 V may cause gate damage. For reliable enhancement, apply 10 V to achieve full RDS(on) spec; 12–15 V is common in high-speed drivers to reduce switching time, provided gate ringing is controlled.
Can IRFS4010PBF be used in parallel configurations?
Yes-its positive temperature coefficient of RDS(on) (0.10 %/°C) enables inherent current sharing. Parallel operation requires matched gate drive impedance (<5% variation), symmetrical PCB layout, and shared thermal interface. Derate total current by 15% for two devices and 25% for three or more to account for thermal coupling and parameter spread.
Does IRFS4010PBF require a gate resistor for stability?
A gate resistor (RG) is mandatory to dampen gate oscillation and limit peak gate current. With 215 nC Qg and typical driver peak current of 2–4 A, a 5–10 Ω surface-mount resistor placed adjacent to the gate pin is recommended. Values <3 Ω increase risk of overshoot; >22 Ω excessively slows switching and raises losses.
Is the body diode suitable for continuous freewheeling in synchronous rectifiers?
Yes-the body diode is fully characterized for continuous conduction mode (CCM) operation with IS = 180 A at TC = 25°C and trr = 72 ns at 25°C. However, VSD = 1.3 V at 106 A means conduction loss exceeds that of an external Schottky at light loads; best practice is to actively drive the MOSFET during freewheeling to minimize forward drop.
IRFS4010PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 180A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 4.7mOhm @ 106A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 215 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 9575 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 375W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRFS4010PBF FAQ
1.How can I place an order for IRFS4010PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFS4010PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFS4010PBF reliable?
The price and inventory of IRFS4010PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFS4010PBF is usually 5 days.
3.What payment methods are accepted for IRFS4010PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFS4010PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFS4010PBF?
IRFS4010PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFS4010PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFS4010PBF?
For technical support, including IRFS4010PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFS4010PBF requirements.
6.How does Aetrix verify that IRFS4010PBF is sourced from the original manufacturer or authorized distributors?
All IRFS4010PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFS4010PBF meets industry standards.
7.What is the process for return or replacement of IRFS4010PBF?
All IRFS4010PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFS4010PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFS4010PBF part is unused and in its original packaging.
Return procedure for IRFS4010PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFS4010PBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

