Infineon Technologies IRFS4510TRLPBF
- Part No.:
- IRFS4510TRLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRFS4510TRLPBF.pdf
- Description:
- MOSFET N-CH 100V 61A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:4,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFS4510TRLPBF from Infineon Technologies is a 100 V, 61 A (TC = 25°C), N-channel enhancement-mode HEXFET® Power MOSFET in D2Pak (TO-263) package, optimized for high-frequency hard-switched SMPS and synchronous rectification with 11.3 mΩ typical RDS(on), 58 nC total gate charge, and enhanced body diode dV/dt ruggedness. It operates reliably up to 175°C junction temperature.
For engineers reviewing the IRFS4510TRLPBF datasheet, IRFS4510TRLPBF pinout, IRFS4510TRLPBF application, or IRFS4510TRLPBF equivalent, key selection criteria include its 100 V VDSS, low 13.9 mΩ max RDS(on), 32 ns rise time, 54–81 ns reverse recovery time (trr), and avalanche-rated 300 mJ single-pulse energy - critical for UPS, telecom DC/DC, and high-efficiency server power supplies.
Technical Context
This MOSFET employs planar silicon-gate technology with optimized cell pitch and trench-assisted drift region design to achieve simultaneous low RDS(on) and high dV/dt immunity. Its body diode is engineered for fast, soft recovery (Qrr = 95–140 nC) and robust dI/dt capability (≤1550 A/μs), enabling reliable operation in synchronous buck and LLC resonant topologies without external snubbers.
The device features fully characterized dynamic parameters including Ciss = 3180 pF, Coss(eff, TR) = 325 pF, and Qgd = 18 nC - enabling accurate switching loss modeling. Thermal resistance RθJC is 1.05°C/W, supporting high-power density designs when mounted on 1"² FR-4 PCB with recommended footprint per AN-994.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 100 V - Maximum blocking voltage before avalanche; supports 48 V input bus with 2× safety margin in telecom PSUs. |
| RDS(on) typ. | 11.3 mΩ - Enables ≤0.4 W conduction loss at 61 A, critical for <95% efficiency targets in 1 kW server PSUs. |
| Qg | 58 nC - Determines gate drive power requirement; compatible with standard 1 A peak drivers at 300 kHz switching. |
| tr / tf | 32 ns / 28 ns - Supports >500 kHz hard-switched operation with minimal overlap loss in phase-shifted full-bridge. |
| EAS | 300 mJ - Single-pulse avalanche energy rating ensures robustness against inductive turn-off transients in UPS inverters. |
| trr | 54–81 ns - Fast body diode recovery reduces shoot-through risk and EMI in synchronous rectifiers. |
| RθJC | 1.05°C/W - Allows 250 W continuous dissipation with 26°C case-to-ambient ΔT, enabling compact heatsink integration. |
Pinout & Package
IRFS4510TRLPBF is housed in a surface-mount D2Pak (TO-263) package with copper leadframe, exposed drain pad for thermal and electrical connection, and RoHS-compliant matte tin plating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Tab (Drain) | Main current path output / heat sink interface | Electrically connected to internal drain; must be soldered to large copper pour for thermal management and low-inductance return path. |
| Lead 1 (Source) | Power return node / reference for gate drive | Low-impedance source connection; critical for minimizing common-source inductance in high-dI/dt switching. |
| Lead 2 (Gate) | Control terminal for channel modulation | High-impedance input requiring <100 nA leakage control; sensitive to layout-induced ringing due to 0.6 Ω internal RG. |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced body diode dV/dt capability | Rated for ≥1550 A/μs di/dt with VDD ≤ V(BR)DSS>, eliminating need for external diode in many synchronous rectifier designs. |
| Fully characterized SOA and avalanche curves | Validated safe operating area up to 100 μs pulse width and 37 A current, enabling confident use in unclamped inductive switching. |
| Lead-free and RoHS-compliant construction | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL-1); suitable for lead-free reflow without popcorn cracking. |
| Low Coss(eff, ER) = 260 pF | Reduces turn-off energy loss in high-voltage clamping circuits, improving efficiency in active clamp forward converters. |
Applications
| Telecom DC/DC Converters | Server VRMs |
|---|---|
Use Scenario: 48 V input to 12 V/54 A output step-down converter in 48 V intermediate bus architecture. IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 400 kHz with 30 ns dead-time control. Use Value: 11.3 mΩ RDS(on) and 54 ns trr minimize conduction + recovery losses, achieving >95.2% peak efficiency per phase. | Use Scenario: Multiphase buck converter supplying CPU core voltage (0.8–1.2 V @ 300 A) in AI accelerator servers. IC Role / Device Role / Timing Role: Low-side FET in interleaved 6-phase topology with 1 MHz switching and adaptive dead-time. Use Value: 61 A continuous rating and 1.05°C/W RθJC enable 30 A per phase without forced air, reducing system cooling cost. |
| Uninterruptible Power Supplies | Industrial Motor Drives |
Use Scenario: Bidirectional DC link switch in online double-conversion UPS with 380 V DC bus. IC Role / Device Role / Timing Role: Inverter leg switch handling 100 V blocking and 43 A continuous current at 100°C case temperature. Use Value: 175°C TJ rating and 300 mJ EAS ensure reliability during grid fault-induced overcurrent events. | Use Scenario: Half-bridge driver in 2 kW servo amplifier for CNC motion control. IC Role / Device Role / Timing Role: High-frequency PWM switch controlling IGBT gate drive supply with 100 kHz burst mode. Use Value: 13.9 mΩ max RDS(on) and 100 V VDSS support 24–48 V logic supply regulation with <0.5% output ripple. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | 100 V, 110 A, RDS(on) = 9.5 mΩ typ., Qg = 92 nC, TO-220FP package | Higher current rating but larger package and higher gate charge; requires stronger gate driver. | Preferred for lower RDS(on) needs where board space allows TO-220FP and thermal mass supports higher PD. |
| IXTH110N10L2 | 100 V, 110 A, RDS(on) = 9.0 mΩ typ., Qg = 105 nC, TO-247 package | Superior conduction loss but significantly higher Qg and cost; not surface-mountable. | Select when maximum efficiency at high load (>80%) is prioritized over switching loss and assembly cost. |
Compared with STP110N10F7 and IXTH110N10L2, IRFS4510TRLPBF offers optimal balance of low gate charge (58 nC), surface-mount D2Pak packaging, and proven avalanche ruggedness - making it preferred for space-constrained, high-frequency SMPS where driver strength and thermal cycling reliability are critical.
Availability
IRFS4510TRLPBF is available at Aetrix Electronics and suitable for telecom DC/DC converters, server VRMs, and uninterruptible power supplies requiring stable component supply, long-lifecycle support, and traceable sourcing for industrial and datacenter deployments.
Supply support for IRFS4510TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and industrial sensors, with global manufacturing and quality certification to ISO 9001 and IATF 16949.
This device belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-reliability power conversion in enterprise infrastructure, renewable energy inverters, and industrial motor controls.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRFS4510TRLPBF supports 43 A continuous drain current at TC = 100°C with VGS = 10 V, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the D2Pak package and ensures junction temperature remains ≤175°C under steady-state conduction.
Does this MOSFET require a negative gate voltage for reliable turn-off?
No - the IRFS4510TRLPBF has a gate threshold voltage (VGS(th)) range of 2.0–4.0 V and is fully enhanced at 0 V gate-source bias. A 0 V turn-off is sufficient; applying negative voltage is unnecessary and not required for noise immunity in typical SMPS layouts.
Can IRFS4510TRLPBF replace IRFSL4510PbF in existing designs?
Yes - IRFS4510TRLPBF and IRFSL4510PbF share identical electrical specifications, thermal performance, and D2Pak mechanical outline. The "TRL" suffix denotes tape-and-reel packaging; all parametric and reliability data are identical per Infineon's datasheet revision 1.4.
What is the recommended gate resistor value for 500 kHz switching?
For 500 kHz operation with minimal overshoot, a 5.6 Ω series gate resistor is recommended based on Qg = 58 nC and typical driver output impedance. This yields ~25 ns gate rise/fall time, balancing switching speed against ringing and EMI - verified in Infineon's AN-1001 application note.
IRFS4510TRLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 61A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 13.9mOhm @ 37A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 100µA
- Gate Charge (Qg) (Max) @ Vgs:
- 87 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3180 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 140W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3
IRFS4510TRLPBF FAQ
1.How can I place an order for IRFS4510TRLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFS4510TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFS4510TRLPBF reliable?
The price and inventory of IRFS4510TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFS4510TRLPBF is usually 5 days.
3.What payment methods are accepted for IRFS4510TRLPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFS4510TRLPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFS4510TRLPBF?
IRFS4510TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFS4510TRLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFS4510TRLPBF?
For technical support, including IRFS4510TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFS4510TRLPBF requirements.
6.How does Aetrix verify that IRFS4510TRLPBF is sourced from the original manufacturer or authorized distributors?
All IRFS4510TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFS4510TRLPBF meets industry standards.
7.What is the process for return or replacement of IRFS4510TRLPBF?
All IRFS4510TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFS4510TRLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFS4510TRLPBF part is unused and in its original packaging.
Return procedure for IRFS4510TRLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFS4510TRLPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

