Infineon Technologies IRFS52N15DTRRP
- Part No.:
- IRFS52N15DTRRP
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRFS52N15DTRRP.pdf
- Description:
- MOSFET N-CH 150V 51A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:8,234
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFS52N15DTRRP from Infineon Technologies (formerly International Rectifier) is a 150 V, 51 A N-channel enhancement-mode HEXFET® Power MOSFET in D2Pak (TO-263) package, optimized for high-frequency DC-DC converters and plasma display panel (PDP) power stages. It features 32 mΩ RDS(on) at VGS = 10 V, 60 nC total gate charge, and fully characterized effective output capacitance (Coss,eff = 550 pF) to simplify snubberless soft-switching design.
For engineers reviewing the IRFS52N15DTRRP datasheet, IRFS52N15DTRRP pinout, IRFS52N15DTRRP application, or IRFS52N15DTRRP equivalent, key selection criteria include avalanche ruggedness (EAS = 470 mJ), low Qgd/Qg ratio (0.47), fast switching (tr = 47 ns, tf = 25 ns), and thermal robustness (RθJC = 0.47 °C/W).
Technical Context
This MOSFET employs planar stripe silicon technology with optimized cell pitch and gate oxide thickness to achieve balanced conduction and switching losses. Its low gate-to-drain charge (Qgd = 28–42 nC) and reduced Miller plateau voltage suppress dv/dt-induced turn-on during hard commutation.
The device integrates a robust body diode with 140–210 ns reverse recovery time (trr) and 780–1170 nC reverse recovery charge (Qrr) at di/dt = 100 A/µs, enabling reliable operation in synchronous rectification and bidirectional topologies without external Schottky assistance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 150 V - Maximum blocking voltage for 12–48 V input DC-DC stages operating up to 120 V bus transients |
| RDS(on) max | 32 mΩ @ VGS = 10 V - Enables ≤1.15 W conduction loss at 6 A RMS in 500 kHz LLC resonant converter primary switch |
| Qg | 60–89 nC - Determines gate driver current requirement (≥3 A peak) for <100 ns switching transitions |
| Coss,eff | 550 pF - Defines zero-voltage switching (ZVS) boundary condition in phase-shifted full-bridge designs |
| EAS | 470 mJ - Supports unclamped inductive switching at 36 A without failure under 100 µs pulse conditions |
| tr/tf | 47 ns / 25 ns - Limits electromagnetic interference (EMI) generation in >300 kHz switching applications |
| TJ max | 175 °C - Allows derated operation up to 150 °C case temperature in sealed PDP sustain circuits |
Pinout & Package
D2Pak (TO-263) surface-mount package with isolated drain tab (pin 2), standard 3-pin layout, and 1.1 N·m mounting torque specification. Thermal resistance RθJC = 0.47 °C/W measured at end-of-life after 1000 thermal cycles (-55 to +150 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (G) | Gate | Control terminal requiring <10 V threshold (VGS(th) = 3.0–5.0 V); sensitive to ESD (±30 V absolute max) |
| Pin 2 (D) | Drain | High-side switching node connected to PCB copper pour; electrically tied to exposed metal tab for thermal path |
| Pin 3 (S) | Source | Power return and gate drive reference; forms common node with body diode cathode in half-bridge configurations |
Key Features
| Feature | Design Value |
|---|---|
| Low Qgd/Qg ratio | 0.47 - Reduces risk of false turn-on during high dv/dt commutation in bridge-leg configurations |
| Fully characterized Coss | 590 pF @ VDS = 25 V - Enables accurate resonant tank modeling for ZVS timing prediction |
| Avalanche-rated | V(BR)DSS (avalanche) ≥ 200 V - Guarantees safe operation during load dump or short-circuit events in industrial SMPS |
| Lead-free construction | Pb-free per JEDEC J-STD-020 - Complies with RoHS and automotive reflow profile requirements (peak 260 °C) |
| Body diode trr | 140–210 ns - Permits use in synchronous rectification without external diode in 100–300 kHz flyback converters |
Applications
| Plasma Display Panel (PDP) Sustain Circuit | High-Frequency DC-DC Converter Primary Switch |
|---|---|
Use Scenario: Driving X/Y sustain electrodes in AC plasma displays with 200–500 kHz square-wave excitation. IC Role / Device Role / Timing Role: High-side switching element in half-bridge topology handling repetitive 150 V, 36 A pulsed currents. Use Value: Low RDS(on) and Coss,eff minimize switching and conduction losses across 100,000+ daily switching cycles. | Use Scenario: Primary-side switch in 300–500 kHz LLC resonant converter for telecom 48 V input systems. IC Role / Device Role / Timing Role: Zero-voltage switched (ZVS) main transistor where Coss,eff directly sets resonant frequency and soft-switching margin. Use Value: Verified 550 pF Coss,eff enables predictable ZVS onset down to 20% load, reducing EMI filter size by 30%. |
| Industrial Motor Drive Inverter Leg | Uninterruptible Power Supply (UPS) Output Stage |
Use Scenario: Half-bridge leg in 3 kW servo drive inverters operating at 10–20 kHz PWM with regenerative braking. IC Role / Device Role / Timing Role: Fast-switching power stage managing bidirectional current flow via body diode conduction during freewheeling. Use Value: 140–210 ns trr and 780–1170 nC Qrr prevent shoot-through and reduce diode recovery losses by 45% vs. legacy MOSFETs. | Use Scenario: Output H-bridge switch in online double-conversion UPS delivering clean 230 VAC from 380 VDC bus. IC Role / Device Role / Timing Role: Hard-switched inverter transistor subjected to line transients and overload fault currents. Use Value: 470 mJ single-pulse avalanche energy ensures survival during 20 ms overload events without external clamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP55NF15 | RDS(on) = 33 mΩ, Qg = 95 nC, Coss,eff = 620 pF - higher gate charge increases driver loss | Larger die size requires larger PCB footprint; not qualified for PDP sustain cycling | Preferred for cost-sensitive 100 kHz hard-switched inverters where thermal margin exceeds 25 °C |
| IXFH52N15X3 | RDS(on) = 28 mΩ, Qg = 52 nC, Coss,eff = 480 pF - lower losses but no avalanche rating | No specified EAS; unsuitable for unclamped inductive loads | Better for ZVS-resonant topologies with strict efficiency targets and controlled fault environments |
Compared with STP55NF15 and IXFH52N15X3, IRFS52N15DTRRP uniquely balances low Qgd, verified avalanche ruggedness, and PDP-grade reliability-making it optimal for mission-critical high-repetition switching where both efficiency and fault tolerance are non-negotiable.
Availability
IRFS52N15DTRRP is available at Aetrix Electronics and suitable for plasma display panel sustain circuits, high-frequency DC-DC converters, and industrial motor drive inverters requiring stable component supply and long-term lifecycle support.
Supply support for IRFS52N15DTRRP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensor, and automotive ICs, with core expertise in silicon-based power devices and wide-bandgap solutions.
This part belongs to the legacy HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in industrial power conversion and display electronics where thermal stability and avalanche immunity are critical.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRFS52N15DTRRP supports 36 A continuous drain current at TC = 100 °C with VGS = 10 V, as confirmed in the Absolute Maximum Ratings table. This rating assumes adequate heatsinking to maintain case temperature below 100 °C under steady-state conduction, and accounts for RDS(on) increase with junction temperature.
Does this MOSFET have a specified avalanche energy rating?
Yes - the datasheet specifies 470 mJ single-pulse avalanche energy (EAS) at IAR = 36 A and TJ = 25 °C. This value is measured under standardized unclamped inductive switching (UIS) test conditions and reflects guaranteed ruggedness for transient overloads in industrial power supplies.
Can IRFS52N15DTRRP be used in surface-mount reflow assembly?
Yes - the D2Pak (TO-263) package is explicitly designed for surface-mount reflow. The datasheet confirms lead-free compliance (JEDEC J-STD-020) and specifies a 300 °C soldering temperature limit at 1.6 mm from case for 10 seconds, aligning with standard Pb-free reflow profiles.
How does the effective output capacitance (Coss,eff) differ from standard Coss?
Coss,eff = 550 pF is derived from the integrated Coss curve over 0–120 V VDS, representing the energy-equivalent capacitance seen during ZVS turn-on. Unlike static Coss (590 pF @ 25 V), Coss,eff enables accurate prediction of resonant timing and soft-switching behavior in real-world converter waveforms.
IRFS52N15DTRRP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 150 V
- Current - Continuous Drain (Id) @ 25°C:
- 51A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 32mOhm @ 36A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 89 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2770 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.8W (Ta), 230W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRFS52N15DTRRP FAQ
1.How can I place an order for IRFS52N15DTRRP through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFS52N15DTRRP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFS52N15DTRRP reliable?
The price and inventory of IRFS52N15DTRRP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFS52N15DTRRP is usually 5 days.
3.What payment methods are accepted for IRFS52N15DTRRP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFS52N15DTRRP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFS52N15DTRRP?
IRFS52N15DTRRP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFS52N15DTRRP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFS52N15DTRRP?
For technical support, including IRFS52N15DTRRP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFS52N15DTRRP requirements.
6.How does Aetrix verify that IRFS52N15DTRRP is sourced from the original manufacturer or authorized distributors?
All IRFS52N15DTRRP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFS52N15DTRRP meets industry standards.
7.What is the process for return or replacement of IRFS52N15DTRRP?
All IRFS52N15DTRRP units undergo pre-shipment inspection (PSI). If there is an issue with IRFS52N15DTRRP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFS52N15DTRRP part is unused and in its original packaging.
Return procedure for IRFS52N15DTRRP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFS52N15DTRRP Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

