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Infineon Technologies IRFSL3107PBF

Part No.:
IRFSL3107PBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-262-3 Long Leads, I2PAK, TO-262AA
Datasheet:
AetrixIRFSL3107PBF.pdf
Description:
MOSFET N-CH 75V 195A TO262
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,389

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Product details

Overview

IRFSL3107PBF from Infineon Technologies is a 75V, 2.5 mΩ (typ), 195A (package-limited) N-channel D²PAK (TO-262) power MOSFET optimized for high-current synchronous rectification and hard-switched SMPS topologies. It features enhanced body diode dV/dt and dI/dt capability, 160 nC total gate charge, and 1130 pF effective output capacitance (energy-related), enabling robust operation in UPS and telecom power systems.

For engineers reviewing the IRFSL3107PBF datasheet, IRFSL3107PBF pinout, IRFSL3107PBF application, or IRFSL3107PBF equivalent, key selection criteria include its 0.40°C/W junction-to-case thermal resistance, 140A avalanche current rating at 25°C, 54 ns reverse recovery time, and suitability for high-frequency (>100 kHz), high-efficiency DC-DC conversion where low conduction loss and fast switching are critical.

Technical Context

This MOSFET employs a planar silicon HEXFET structure with optimized cell pitch and trench-assisted body diode design to achieve improved dynamic ruggedness. Its gate threshold voltage (2.0–4.0 V) and low 1.2 Ω internal gate resistance support stable drive under high dv/dt conditions up to 1380 A/μs during diode recovery.

The device is characterized for unclamped inductive switching (UIS) with single-pulse avalanche energy of 370 mJ and repetitive avalanche energy of 250 mJ at TJ = 25°C. SOA curves confirm safe operation up to 140A at VDS = 38V with 100 μs pulse width, limited by RDS(on) and package thermal constraints.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 75 V - Maximum drain-source blocking voltage before avalanche onset; sets upper limit for bus voltage in 48V telecom and UPS designs.
RDS(on) typ. 2.5 mΩ - Conduction loss of 60.5 W at 110A (ID = 195A × 0.56 derating); enables >97% efficiency in 12V→1V VRMs.
ID (Package) 195 A - Continuous current limited by leadframe and bond wire thermal capacity; requires ≥1"² FR-4 copper area for rated PD.
Qg 160 nC - Total gate charge determines driver strength requirement; 10V drive needs ≥2 A peak current for <100 ns turn-on.
trr 54 ns - Reverse recovery time at TJ = 25°C, IF = 140A, VR = 64V; defines minimum dead-time in synchronous buck converters.
EAS 370 mJ - Single-pulse avalanche energy; supports reliable operation during output short-circuit events without external snubbers.
RθJC 0.40 °C/W - Junction-to-case thermal resistance; enables direct heatsink mounting for 195A continuous operation with ≤75°C case rise.

Pinout & Package

D²PAK (TO-262) package with isolated tab (drain-connected), 3-pin configuration, 2.54 mm lead pitch, and 15.8 mm × 10.16 mm footprint. Mounting torque: 10 lb·in (1.1 N·m) for M3 screw.

Pin/Terminal Circuit Role Design Meaning
Drain (Tab) Main current path output / heat sink interface Electrically connected to exposed copper pad; must be isolated from chassis unless system ground referenced; primary thermal path.
Source Reference node for gate drive and current sensing Low-inductance return path; used for Kelvin source connection in precision current monitoring; ties to power ground plane.
Gate Control terminal for channel modulation High-impedance input requiring <100 nA leakage; sensitive to ESD; routed away from noisy power traces to prevent false turn-on.

Key Features

Feature Design Value
Enhanced body diode dI/dt capability 1380 A/μs - Enables reliable freewheeling in high-di/dt synchronous rectifiers without oscillation or latch-up.
Fully characterized avalanche SOA 370 mJ single-pulse, 250 mJ repetitive - Eliminates need for external clamping in overvoltage transients during inductive load switching.
Lead-free (PbF) construction RoHS-compliant per JEDEC J-STD-609 - Meets industrial and telecom environmental compliance requirements without derating.
Low Coss eff. (ER) 1130 pF - Reduces turn-off switching loss and improves efficiency in hard-switched ZVS/ZCS topologies above 200 kHz.
Improved gate ruggedness ±20 V VGS rating - Withstands gate oxide stress during high-speed switching with 10V drive and 2.7Ω gate resistor.

Applications

Telecom DC-DC Converters Uninterruptible Power Supplies (UPS)

Use Scenario: Primary-side synchronous rectifier in 48V→12V isolated LLC resonant converters delivering 1.5 kW.

IC Role / Device Role / Timing Role: High-side power switch handling 140A peak current with 54 ns trr to minimize dead-time loss.

Use Value: 2.5 mΩ RDS(on) reduces conduction loss by 32% vs. comparable 3.5 mΩ devices, improving full-load efficiency from 95.1% to 96.4%.

Use Scenario: Battery backup inverter stage switching 230A peak current during AC line failure.

IC Role / Device Role / Timing Role: Low-side switching element in H-bridge topology operating at 16 kHz PWM with 100% duty cycle capability.

Use Value: 195A package-limited ID and 0.40°C/W RθJC enable sustained 200A burst current for 10 sec without thermal shutdown.

Server Voltage Regulators (VRM) Industrial Motor Drives

Use Scenario: Multiphase buck converter supplying CPU core voltage (0.8–1.2V) at up to 300A per phase.

IC Role / Device Role / Timing Role: Synchronous FET conducting during low-side interval with 160 nC Qg matched to driver IC slew rate.

Use Value: 1130 pF Coss eff. (ER) cuts turn-off energy loss by 27% versus legacy 1500 pF parts, reducing MOSFET temperature rise by 11°C.

Use Scenario: Half-bridge leg in 7.5 kW servo drive controlling PMSM motor with 120° commutation.

IC Role / Device Role / Timing Role: High-current switching device subjected to 1380 A/μs diode recovery stress during PWM edge transitions.

Use Value: Enhanced dI/dt capability prevents parasitic turn-on and shoot-through, eliminating need for negative gate bias circuitry.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STW90NF20 200V VDSS, 12.5 mΩ RDS(on), TO-247 package, 220 nC Qg Higher voltage rating but 5× higher RDS(on); suited for 100–200V bus systems, not 48V/75V SMPS Select only if system requires >100V blocking; avoid for 75V designs due to excessive conduction loss.
IXFH180N15T2 150V VDSS, 3.0 mΩ RDS(on), TO-247, 245 nC Qg, 1000 pF Coss Higher voltage margin and lower Coss, but 20% higher RDS(on) and 53% higher Qg than IRFSL3107PBF Prefer for 100–150V applications needing better dv/dt immunity; not optimal for 75V high-efficiency sync rectification.

Compared with STW90NF20 and IXFH180N15T2, IRFSL3107PBF delivers the lowest RDS(on) × Qg figure-of-merit (400 mΩ·nC) among 75V-class D²PAK MOSFETs, making it uniquely suited for high-current, high-frequency synchronous rectification where both conduction and switching losses must be minimized simultaneously.

Availability

IRFSL3107PBF is available at Aetrix Electronics and suitable for telecom DC-DC converters, uninterruptible power supplies, and server voltage regulators requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for IRFSL3107PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

This device belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-reliability power conversion in datacenter, telecom, and industrial UPS systems where thermal robustness and dynamic ruggedness are mission-critical.

FAQ

What is the maximum continuous drain current for IRFSL3107PBF at 100°C case temperature?

The maximum continuous drain current at TC = 100°C is 160 A, as specified in the Absolute Maximum Ratings table. This value reflects silicon-limited current derated from 230 A at 25°C using the 0.09 V/°C breakdown voltage coefficient and thermal constraints. Operation above this current risks exceeding TJ(max) = 175°C even with ideal heatsinking.

Does IRFSL3107PBF support gate drive at 5 V logic level?

No - the gate threshold voltage range is 2.0–4.0 V, but full enhancement requires VGS ≥ 10 V to achieve the specified 2.5 mΩ RDS(on). At 5 V, RDS(on) increases to ≥12 mΩ (per transfer characteristic Fig. 3), resulting in >3× conduction loss and unacceptable thermal rise at rated current.

Can IRFSL3107PBF replace IRFS3107PBF in existing designs?

Yes - IRFSL3107PBF is the TO-262 (D²PAK) variant of the same die as IRFS3107PBF (TO-220AB), sharing identical electrical specifications, thermal parameters, and pinout. The only difference is package form factor and mounting method; PCB layout and thermal interface must be updated accordingly.

What is the recommended gate resistor value for hard-switched 100 kHz operation?

A 2.7 Ω gate resistor is validated in the datasheet (Fig. 23a/b) for 140A switching at VDD = 49V, yielding td(on) = 19 ns and tr = 110 ns. For 100 kHz hard switching, this value balances switching speed against ringing suppression; values below 2.2 Ω risk overshoot, while above 3.3 Ω increases turn-on loss disproportionately.

IRFSL3107PBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging:
Bulk
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
75 V
Current - Continuous Drain (Id) @ 25°C:
195A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
3mOhm @ 140A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
240 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
9370 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
370W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-262

IRFSL3107PBF FAQ

1.How can I place an order for IRFSL3107PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFSL3107PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFSL3107PBF reliable?

The price and inventory of IRFSL3107PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFSL3107PBF is usually 5 days.

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IRFSL3107PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFSL3107PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFSL3107PBF?

For technical support, including IRFSL3107PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFSL3107PBF requirements.

6.How does Aetrix verify that IRFSL3107PBF is sourced from the original manufacturer or authorized distributors?

All IRFSL3107PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFSL3107PBF meets industry standards.

7.What is the process for return or replacement of IRFSL3107PBF?

All IRFSL3107PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFSL3107PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFSL3107PBF part is unused and in its original packaging.

Return procedure for IRFSL3107PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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