Infineon Technologies IRFSL31N20D
- Part No.:
- IRFSL31N20D
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
IRFSL31N20D.pdf
- Description:
- MOSFET N-CH 200V 31A TO262
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IRFSL31N20D from Infineon Technologies is a 200 V, 31 A N-channel enhancement-mode power MOSFET in TO-220AB package, optimized for high-frequency DC-DC converters with low gate-to-drain charge (Qgd = 33–49 nC) and RDS(on) = 0.082 Ω at VGS = 10 V. It delivers 124 A pulsed drain current and supports telecom 48 V input forward converter topologies.
For engineers reviewing the IRFSL31N20D datasheet, IRFSL31N20D pinout, IRFSL31N20D application, or IRFSL31N20D equivalent, key selection criteria include avalanche energy rating (EAS = 420 mJ), diode reverse recovery time (trr = 200–300 ns), thermal resistance (RθJC = 0.75 °C/W), and gate charge profile for hard-switched SMPS design.
Technical Context
This MOSFET employs HEXFET® silicon technology with fully characterized output capacitance (Coss = 390 pF at VDS = 25 V; Coss,eff = 170 pF over 0–160 V), enabling accurate soft-switching loss estimation. Its transconductance (gfs = 17 S) and threshold voltage (VGS(th) = 3.0–5.5 V) support stable gate drive across temperature.
The device integrates a robust body diode with VSD = 1.3 V at IS = 18 A and dV/dt immunity up to 2.1 V/ns, making it suitable for unclamped inductive switching where diode recovery behavior directly impacts system reliability and EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 200 V - Withstands 200 V drain-source blocking voltage before avalanche conduction begins. |
| RDS(on) | 0.082 Ω - On-resistance at VGS = 10 V and ID = 18 A; determines conduction loss in continuous operation. |
| Qgd | 33–49 nC - Miller charge governing turn-off delay and dv/dt-induced false triggering risk. |
| trr | 200–300 ns - Body diode reverse recovery time affecting cross-conduction loss and snubber sizing. |
| EAS | 420 mJ - Single-pulse avalanche energy rating; defines safe operating area under inductive fault conditions. |
| RθJC | 0.75 °C/W - Junction-to-case thermal resistance; enables direct heatsink interface thermal modeling. |
| ID @ TC = 100°C | 21 A - Continuous drain current derated for case temperature; sets practical current limit in thermally constrained layouts. |
Pinout & Package
IRFSL31N20D uses the standard TO-220AB package with isolated tab (drain-connected), 3-pin through-hole mounting, and mechanical dimensions compliant with JEDEC outline TO-220AB. Mounting torque: 10 lbf·in (1.1 N·m); soldering temperature: 300 °C for 10 s at 1.6 mm from case.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - Gate | Control electrode | Receives 10 V logic-level gate drive; requires <110 nC total charge for full enhancement. |
| 2 - Drain | High-side power terminal | Internally connected to metal tab; must be electrically isolated from heatsink unless referenced to same potential. |
| 3 - Source | Power return / reference node | Serves as common return path for load current and gate drive reference; critical for low-inductance layout. |
Key Features
| Feature | Design Value |
|---|---|
| Low Qgd/Qg ratio | ~47% typical - Reduces Miller-induced turn-off delay and improves controllability in high-dv/dt environments. |
| Fully characterized Coss,eff | 170 pF over 0–160 V - Enables precise calculation of resonant tank energy and zero-voltage switching feasibility. |
| Avalanche-rated structure | EAS = 420 mJ - Guarantees ruggedness against inductive switching faults without external clamping. |
| Optimized body diode | trr = 200–300 ns, Qrr = 1.7–2.6 µC - Minimizes recovery-related losses and EMI in synchronous rectifier and freewheeling applications. |
Applications
| Telecom Forward Converters | Server VRMs |
|---|---|
Use Scenario: 48 V input, 12 V/30 A output telecom forward converter operating at 250 kHz. IC Role / Device Role / Timing Role: Primary-side switching transistor handling high-frequency PWM with low conduction and switching loss. Use Value: RDS(on) = 0.082 Ω and Qgd = 33 nC reduce both I²R loss and gate drive power, improving efficiency above 92%. | Use Scenario: Multiphase buck converter in AI accelerator server supplying 0.8 V @ 600 A to GPU cores. IC Role / Device Role / Timing Role: High-current, low-VDS synchronous rectifier in secondary-side topology. Use Value: Low RDS(on) and fast trr minimize conduction loss and dead-time penalty, supporting >95% phase efficiency at 1 MHz. |
| Industrial Motor Drives | Renewable Energy Inverters |
Use Scenario: 400 V DC bus inverter driving 3 kW PMSM via six-pack TO-220-based half-bridge modules. IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in low-cost, medium-power motor control. Use Value: Avalanche rating (EAS = 420 mJ) withstands inductive kickback during short-circuit events without desaturation protection. | Use Scenario: String-level DC-DC optimizer in photovoltaic systems with 1000 V max input and 400 V output. IC Role / Device Role / Timing Role: High-voltage, high-reliability switch in non-isolated boost stage. Use Value: VDSS = 200 V with 150 °C TJ rating ensures margin for 1000 V string transients per UL 1703 surge requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP30NF20 | RDS(on) = 0.085 Ω, Qgd = 42 nC, EAS = 380 mJ | Lower avalanche energy and slightly higher on-resistance; identical TO-220AB footprint | Acceptable for non-fault-tolerant designs where cost sensitivity outweighs ruggedness needs. |
| IXTH30N20L | RDS(on) = 0.075 Ω, Qgd = 28 nC, no specified EAS | Superior switching performance but uncharacterized avalanche capability; TO-247 package | Preferred for high-efficiency, high-frequency SMPS where thermal headroom allows TO-247 heatsinking. |
Compared with STP30NF20 and IXTH30N20L, IRFSL31N20D offers the highest single-pulse avalanche energy (420 mJ) and best balance of RDS(on), Qgd, and package compatibility for cost-sensitive industrial and telecom power supplies requiring field reliability.
Availability
IRFSL31N20D is available at Aetrix Electronics and suitable for telecom forward converters, server VRMs, and industrial motor drives requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IRFSL31N20D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
This device belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching power supplies operating above 100 kHz with demanding thermal and ruggedness requirements.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRFSL31N20D supports 21 A continuous drain current at TC = 100°C with VGS = 10 V, reflecting linear derating from 31 A at 25°C using the 1.3 W/°C factor. This value assumes adequate heatsinking and is validated per Infineon's SOA curves in Figure 8 of the datasheet.
Is the TO-220AB package electrically isolated?
No - the metal tab of the IRFSL31N20D TO-220AB package is internally connected to the drain terminal. Electrical isolation from the heatsink requires a mica or polymer insulator plus shoulder washer, and thermal compound must remain dielectric to prevent shorting.
Does this MOSFET have a specified gate threshold voltage range?
Yes - VGS(th) is specified as 3.0–5.5 V at ID = 250 µA and VDS = VGS. This range ensures reliable turn-on with standard 5 V or 10 V gate drivers while avoiding unintended conduction due to noise near the lower threshold boundary.
Can IRFSL31N20D be used in synchronous rectification?
Yes - its body diode has characterized trr (200–300 ns) and Qrr (1.7–2.6 µC), and RDS(on) remains low when actively driven. However, external gate control timing must account for diode recovery to avoid shoot-through; dedicated synchronous rectifier controllers are recommended.
IRFSL31N20D Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 31A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 82mOhm @ 18A, 10V
- Vgs(th) (Max) @ Id:
- 5.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 110 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2370 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.1W (Ta), 200W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-262
IRFSL31N20D FAQ
1.How can I place an order for IRFSL31N20D through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFSL31N20D on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFSL31N20D reliable?
The price and inventory of IRFSL31N20D are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFSL31N20D is usually 5 days.
3.What payment methods are accepted for IRFSL31N20D?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFSL31N20D transactions.
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4.How is shipping managed for IRFSL31N20D?
IRFSL31N20D orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFSL31N20D order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFSL31N20D?
For technical support, including IRFSL31N20D datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFSL31N20D requirements.
6.How does Aetrix verify that IRFSL31N20D is sourced from the original manufacturer or authorized distributors?
All IRFSL31N20D products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFSL31N20D meets industry standards.
7.What is the process for return or replacement of IRFSL31N20D?
All IRFSL31N20D units undergo pre-shipment inspection (PSI). If there is an issue with IRFSL31N20D, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFSL31N20D part is unused and in its original packaging.
Return procedure for IRFSL31N20D:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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