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Infineon Technologies IRFSL38N20DPBF

Part No.:
IRFSL38N20DPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-262-3 Long Leads, I2PAK, TO-262AA
Datasheet:
AetrixIRFSL38N20DPBF.pdf
Description:
MOSFET N-CH 200V 43A TO262
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,095

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Product details

Overview

IRFSL38N20DPBF from Infineon is a 200 V, 43 A (TC = 25°C), N-channel enhancement-mode HEXFET® Power MOSFET in TO-262 package, with RDS(on) ≤ 54 mΩ at VGS = 10 V and rated for 175 °C junction operation. It delivers robust avalanche energy handling (EAS = 460 mJ), low gate charge (Qg = 60–91 nC), and fast switching (tr = 95 ns, tf = 47 ns) for high-efficiency DC-DC converters and plasma display drivers.

For engineers reviewing the IRFSL38N20DPBF datasheet, IRFSL38N20DPBF pinout, IRFSL38N20DPBF application, or IRFSL38N20DPBF equivalent, key selection criteria include its 260 V unclamped avalanche rating, 0.47 °C/W junction-to-case thermal resistance, body diode recovery performance (trr = 160–240 ns), and suitability for hard-switched 200 V industrial power stages requiring high pulse current capability (IDM = 180 A).

Technical Context

This MOSFET employs planar silicon process technology optimized for high-voltage, high-current switching with minimized Miller capacitance (Crss = 73 pF) and characterized effective output capacitance (Coss_eff = 380 pF). Its gate threshold voltage (VGS(th) = 3.0–5.0 V) ensures reliable turn-on with standard 10 V gate drivers while maintaining noise immunity.

The device integrates a fast, low-loss intrinsic body diode (VSD ≤ 1.5 V at IS = 26 A, TJ = 25°C) with controlled reverse recovery (Qrr = 1.3–2.0 µC, trr = 160–240 ns), enabling use in synchronous rectification and freewheeling paths without external Schottky supplementation in many 200 V applications.

Key Specifications

ParameterValue and Actual Design Meaning
VDS200 V - Maximum blocking voltage for primary-side switches in 200 V bus systems (e.g., telecom PSUs, industrial AC/DC front-ends)
RDS(on) max @ 10 V54 mΩ - Conduction loss of ≤ 0.06 W at 10 A continuous drain current, enabling compact heatsink design
ID @ TC = 25°C43 A - Continuous current rating under ideal heatsinking, supporting >500 W power conversion stages
EAS460 mJ - Single-pulse avalanche energy tolerance allows safe operation during inductive turn-off transients without snubbers
Qg60–91 nC - Gate drive energy requirement determines driver IC selection and switching loss trade-off at 100–500 kHz
tr/tf95 ns / 47 ns - Fast edge rates reduce switching transition time, critical for minimizing losses in high-frequency DC-DC topologies
RθJC0.47 °C/W - Thermal path efficiency enables direct mounting to cold plates or heatsinks with minimal thermal interface resistance penalty

Pinout & Package

IRFSL38N20DPBF is housed in a TO-262 (ISOTOP) package with three terminals: Gate (G), Drain (D), and Source (S). The package features isolated metal tab (Drain-connected) for direct heatsinking and screw-mount compatibility.

Pin/TerminalCircuit RoleDesign Meaning
GGate control inputReceives 10 V logic-level signal to fully enhance channel; requires <91 nC total charge for full turn-on
DDrain (high-side switch node)Connected to internal die backside and metal tab; electrically tied to heatsink; must be isolated from ground plane
SSource (return path)Reference node for gate drive; carries full load current and body diode reverse recovery current

Key Features

FeatureDesign Value
Low Qgd/Qgs ratio28–42 nC / 17–25 nC = ~1.6–2.5 - Reduces Miller-induced shoot-through risk in half-bridge configurations
Fully characterized Coss_eff380 pF - Enables accurate soft-switching timing prediction and resonant converter design without iterative measurement
Lead-free constructionRoHS-compliant finish with Pb-free solderability per J-STD-020 - Supports automated reflow and wave soldering processes
Avalanche-ratedVDS(Avalanche) ≥ 260 V - Guarantees ruggedness against voltage spikes exceeding nominal 200 V rating during fault conditions
High-temperature operationTJ(max) = 175 °C - Allows derated operation in sealed enclosures or high-ambient environments up to 125 °C case temperature

Applications

Plasma Display Panel (PDP) Sustain CircuitIndustrial DC-DC Converter Primary Switch

Use Scenario: Driving sustain electrodes in AC plasma displays requiring rapid 200 V switching at 200–500 kHz.

IC Role / Device Role / Timing Role: High-side power switch controlling bidirectional sustain pulses across display cells.

Use Value: Low RDS(on) minimizes conduction loss during long duty cycles; fast tf ensures clean voltage transitions critical for pixel uniformity.

Use Scenario: Primary-side switch in isolated 200 V input, 12–48 V output flyback or forward converters for factory automation equipment.

IC Role / Device Role / Timing Role: Main power transistor handling full input voltage and peak current during PWM on-time.

Use Value: 460 mJ EAS withstands leakage inductance spikes without clamping; 0.47 °C/W RθJC supports forced-air cooling in space-constrained enclosures.

Motor Drive Half-Bridge LegUninterruptible Power Supply (UPS) Inverter Stage

Use Scenario: Upper switch in 3-phase IGBT/MOSFET inverter driving 200 V DC bus industrial motors (e.g., pumps, compressors).

IC Role / Device Role / Timing Role: High-side switching element in bridge leg, commutating inductive motor current.

Use Value: Body diode trr = 160–240 ns and Qrr = 1.3–2.0 µC limit reverse recovery losses during cross-conduction; 180 A IDM handles motor stall currents.

Use Scenario: Output stage switch in online UPS inverters converting 200 V DC battery bank to 230 V AC line output.

IC Role / Device Role / Timing Role: Hard-switched power switch in full-bridge inverter topology operating at 10–20 kHz.

Use Value: 260 V avalanche rating provides margin against bus overvoltage during load dump or regeneration; 175 °C TJ(max) ensures reliability under sustained overload conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRFB38N20DPBFSame die, TO-220AB package; RθJC = 0.47 °C/W (same), but lower mechanical robustness and no screw-mount optionPreferred where PCB through-hole mounting suffices and heatsink attachment is via clip or thermal pad onlySelect when footprint constraints favor TO-220 and screw-mount is unnecessary
STP20NM20200 V, 20 A, RDS(on) = 80 mΩ; lower current rating, higher on-resistance, no published EAS specSuitable only for lower-power (<200 W) applications with relaxed thermal and ruggedness requirementsChoose only if cost sensitivity outweighs performance and reliability needs in non-critical designs

Compared with IRFB38N20DPBF and STP20NM20, IRFSL38N20DPBF uniquely combines TO-262 mechanical stability, full 43 A current rating, and verified 460 mJ avalanche capability-making it optimal for industrial-grade 200 V switching where thermal management and fault tolerance are prioritized.

Availability

IRFSL38N20DPBF is available at Aetrix Electronics and suitable for plasma display panel sustain circuits, industrial DC-DC converters, and UPS inverter stages requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for IRFSL38N20DPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

This part belongs to Infineon's HEXFET® Power MOSFET product line, engineered for high-efficiency, high-reliability switching in industrial power supplies, motor drives, and lighting systems operating at 100–250 V DC bus voltages.

FAQ

What is the maximum continuous drain current at 100°C case temperature?

The maximum continuous drain current for IRFSL38N20DPBF at TC = 100°C is 30 A when driven with VGS = 10 V. This derating reflects thermal limits of the TO-262 package and silicon die; operation above this current requires active cooling or reduced duty cycle to maintain TJ ≤ 175°C.

Does IRFSL38N20DPBF have a specified gate charge profile?

Yes-total gate charge (Qg) is specified as 60–91 nC at VDS = 100 V and ID = 26 A. Gate-to-source (Qgs) and gate-to-drain (Qgd) charges are 17–25 nC and 28–42 nC respectively, enabling precise gate driver sizing and switching loss calculation per IEEE 1547-compliant designs.

Can IRFSL38N20DPBF replace IRFB38N20DPBF in existing TO-220 layouts?

No-IRFSL38N20DPBF uses TO-262 (ISOTOP) package with different pin spacing, mounting hole pattern, and tab geometry than TO-220AB. Direct replacement requires PCB redesign, heatsink adapter, and mechanical validation; electrical parameters are identical, but thermal and mechanical integration differs significantly.

What is the typical reverse recovery charge of the body diode?

The body diode's reverse recovery charge (Qrr) is 1.3–2.0 µC under test conditions of IF = 26 A, di/dt = 100 A/µs, and TJ = 25°C. This value is critical for calculating commutation losses in synchronous rectifiers and half-bridge freewheeling paths, and is fully characterized per datasheet Figure 13.

IRFSL38N20DPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
200 V
Current - Continuous Drain (Id) @ 25°C:
43A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
54mOhm @ 26A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
91 nC @ 10 V
Vgs (Max):
-
Input Capacitance (Ciss) (Max) @ Vds:
2900 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-262

IRFSL38N20DPBF FAQ

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Please submit a Request for Quotation (RFQ) for IRFSL38N20DPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFSL38N20DPBF reliable?

The price and inventory of IRFSL38N20DPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFSL38N20DPBF is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFSL38N20DPBF?

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6.How does Aetrix verify that IRFSL38N20DPBF is sourced from the original manufacturer or authorized distributors?

All IRFSL38N20DPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFSL38N20DPBF meets industry standards.

7.What is the process for return or replacement of IRFSL38N20DPBF?

All IRFSL38N20DPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFSL38N20DPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFSL38N20DPBF part is unused and in its original packaging.

Return procedure for IRFSL38N20DPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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