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Infineon Technologies IRFSL7437PBF

Part No.:
IRFSL7437PBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-262-3 Long Leads, I2PAK, TO-262AA
Datasheet:
AetrixIRFSL7437PBF.pdf
Description:
MOSFET N-CH 40V 195A TO262
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,365

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Product details

Overview

IRFSL7437PBF from Infineon Technologies is a 40V, 195A (package-limited), N-channel enhancement-mode HEXFET Power MOSFET in TO-262 package with 1.4 mΩ typical RDS(on) at VGS = 10 V, optimized for high-current synchronous rectification and half-bridge motor drive. It features enhanced body diode dV/dt and dI/dt capability, 1000 mJ single-pulse avalanche energy, and 100 A continuous source current rating.

For engineers reviewing the IRFSL7437PBF datasheet, IRFSL7437PBF pinout, IRFSL7437PBF application, or IRFSL7437PBF equivalent, key selection criteria include its 1.4 mΩ on-resistance at 10 V gate drive, 195 A package-limited continuous drain current, robust 1000 mJ unclamped inductive switching capability, and TO-262 thermal performance with 0.65 °C/W RθJC.

Technical Context

This MOSFET employs planar silicon-gate technology with optimized cell pitch and trench-assisted charge balancing to achieve ultra-low RDS(on) while maintaining >40 V V(BR)DSS and controlled threshold voltage (2.2–3.9 V). Its body diode is engineered for fast recovery (trr = 30 ns) and high dI/dt immunity (up to 1166 A/μs).

The device operates in enhancement mode with gate threshold defined at 150 μA ID, exhibits 150–225 nC total gate charge, and supports hard-switched topologies up to 200 kHz due to low Coss eff. (TR) = 1735 pF and Crss = 745 pF - enabling efficient zero-voltage switching in resonant converters.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS40 V - Maximum blocking voltage before avalanche onset; enables use in 24 V and 36 V DC bus systems.
RDS(on) typ.1.4 mΩ @ VGS = 10 V, TJ = 25°C - Delivers <0.14 W conduction loss at 100 A, critical for high-efficiency power stages.
ID (Package)195 A @ TC = 25°C - Thermal limit set by TO-262 copper tab and bond wire; defines max continuous output in heatsink-mounted designs.
EAS1000 mJ - Single-pulse avalanche energy rating; supports reliable operation under unclamped inductive switching in motor drives.
Qg150–225 nC - Gate drive charge requirement determines driver strength needed; impacts switching loss and gate resistor sizing.
trr30 ns @ TJ = 25°C - Fast body diode recovery minimizes commutation loss and voltage overshoot during synchronous rectification.
RθJC0.65 °C/W - Junction-to-case thermal resistance enables direct heatsink mounting with predictable temperature rise under steady-state load.

Pinout & Package

IRFSL7437PBF is housed in a TO-262 (Straight Lead) package with isolated metal tab for direct heatsink attachment. The package provides low-inductance, high-current terminals and meets lead-free/halogen-free requirements per JEDEC J-STD-020.

Pin/TerminalCircuit RoleDesign Meaning
Drain (D)Main current path from source to load returnInternally connected to metal tab; electrically tied to heatsink - requires insulation unless system ground referenced.
Source (S)Power return node and reference for gate driveLow-inductance Kelvin connection point; critical for accurate gate control and current sensing in high-di/dt applications.
Gate (G)Control terminal for channel modulationHigh-impedance input requiring 10 V for full enhancement; internal RG = 2.2 Ω affects switching speed and ringing susceptibility.

Key Features

FeatureDesign Value
Enhanced body diode dI/dt capabilityRated for 1166 A/μs - prevents snap-off failure during fast turn-off of inductive loads in BLDC and OR-ing circuits.
Fully characterized SOAValidated safe operating area up to 100 A at 40 V for 100 μs pulses - enables confident design without derating in bridge-leg fault conditions.
Improved dynamic dV/dt ruggednessRated for >10 V/ns - suppresses false turn-on in high-speed half-bridge configurations with fast bus transients.
Avalanche-rated construction1000 mJ single-pulse EAS with thermal failure model validated - eliminates need for external snubbers in brushed motor H-bridges.

Applications

Brushed Motor DriveBLDC Motor Drive

Use Scenario: High-power 24 V automotive seat/mirror actuators with PWM-controlled H-bridge.

IC Role / Device Role / Timing Role: Low-side switch in dual N-channel half-bridge configuration handling bidirectional 150 A peak currents.

Use Value: 1.4 mΩ RDS(on) reduces I²R loss by >35% vs. legacy 2.5 mΩ devices, extending battery runtime and limiting junction temperature rise.

Use Scenario: 3-phase inverter for e-bike mid-drive motor with space-constrained heatsinking.

IC Role / Device Role / Timing Role: Upper-leg switch in 6-pack inverter, operating at 16 kHz with synchronous rectification during freewheeling.

Use Value: 30 ns trr and soft-recovery body diode minimize shoot-through risk and reduce voltage spikes during commutation.

Synchronous RectifierOR-ing Power Switch

Use Scenario: 40 V/100 A secondary-side rectification in telecom DC/DC brick with <1% conduction loss target.

IC Role / Device Role / Timing Role: Active replacement for Schottky diode in forward converter synchronous rectifier stage.

Use Value: 1.0–1.3 V VSD at 100 A yields ~50% lower forward drop than 45 V Schottky, cutting rectifier losses by 4.2 W at full load.

Use Scenario: Redundant 28 V aircraft avionics power supply with hot-swap and reverse-current blocking.

IC Role / Device Role / Timing Role: Back-to-back configured N-MOSFET for ideal diode function with active gate control.

Use Value: 195 A package rating and 1000 mJ EAS ensure survival during load dump transients and inrush current events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRFS7437PBFD2Pak package; RθJA = 40 °C/W (vs. 0.65 °C/W RθJC); identical die and RDS(on)Better suited for PCB-mount-only designs without external heatsink; lower assembly cost but higher thermal resistance.Select when board-level thermal management suffices and TO-262 mechanical mounting is impractical.
STL220N4F7AG40 V, 220 A, 0.95 mΩ typ., H2PAK-2 package; higher current density but unverified avalanche ratingEnables smaller footprint in space-constrained inverters; lacks published EAS data - unsuitable for unclamped inductive switching.Choose only where avalanche stress is absent and layout allows tighter thermal coupling to heatsink.

Compared with IRFS7437PBF, the TO-262 variant offers superior thermal path to heatsink and higher pulse current headroom; versus STL220N4F7AG, IRFSL7437PBF trades 0.45 mΩ higher RDS(on) for guaranteed 1000 mJ avalanche robustness and mature application validation in motor control.

Availability

IRFSL7437PBF is available at Aetrix Electronics and suitable for brushed motor drive, BLDC inverter, and synchronous rectifier applications requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing for safety-critical systems.

Supply support for IRFSL7437PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and industrial sensors, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

This device belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-reliability power conversion in automotive, industrial, and renewable energy systems where thermal stability and ruggedness under transient stress are mandatory.

FAQ

What is the maximum continuous drain current for IRFSL7437PBF at 100°C case temperature?

The maximum continuous drain current at TC = 100°C is 180 A, as specified in the Absolute Maximum Ratings table. This value reflects silicon-limited conduction capacity under thermal constraint, distinct from the 195 A package-limited rating at 25°C case temperature. Derating follows linear thermal slope of 3.0 W/°C beyond 25°C.

Can IRFSL7437PBF be used in parallel configurations without current-sharing resistors?

Yes - its positive RDS(on) temperature coefficient (normalized RDS(on) rises with junction temperature) enables inherent current sharing in parallel operation. However, matched gate drive layout, symmetrical PCB traces, and individual gate resistors (≥5 Ω) are required to prevent oscillation and ensure balanced dynamic current distribution across devices.

Is the body diode of IRFSL7437PBF suitable for reverse recovery in hard-switched PFC stages?

No - while the body diode has fast trr = 30 ns and soft recovery characteristics, it is not rated for continuous reverse recovery stress in boost PFC. Its Qrr = 24 nC and IRRM = 1.3 A are optimized for motor freewheeling and synchronous rectification, not high-frequency, high-dI/dt PFC diode replacement.

Does IRFSL7437PBF require gate clamping for 12 V logic-level drive?

No - its absolute maximum VGS rating is ±20 V, and gate threshold is 2.2–3.9 V, making it fully compatible with standard 12 V gate drivers. However, a 15 V gate drive is recommended to ensure robust enhancement margin across temperature and process variation, especially in high-noise motor drive environments.

IRFSL7437PBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®, StrongIRFET™
Package/Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
195A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
6V, 10V
Rds On (Max) @ Id, Vgs:
1.8mOhm @ 100A, 10V
Vgs(th) (Max) @ Id:
3.9V @ 150µA
Gate Charge (Qg) (Max) @ Vgs:
225 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
7330 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
230W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-262

IRFSL7437PBF FAQ

1.How can I place an order for IRFSL7437PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFSL7437PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFSL7437PBF reliable?

The price and inventory of IRFSL7437PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFSL7437PBF is usually 5 days.

3.What payment methods are accepted for IRFSL7437PBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFSL7437PBF transactions.

Note: Certain payment methods may incur a processing fee.

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IRFSL7437PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFSL7437PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFSL7437PBF?

For technical support, including IRFSL7437PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFSL7437PBF requirements.

6.How does Aetrix verify that IRFSL7437PBF is sourced from the original manufacturer or authorized distributors?

All IRFSL7437PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFSL7437PBF meets industry standards.

7.What is the process for return or replacement of IRFSL7437PBF?

All IRFSL7437PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFSL7437PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFSL7437PBF part is unused and in its original packaging.

Return procedure for IRFSL7437PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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