Infineon Technologies IRFU3410
- Part No.:
- IRFU3410
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-251-3 Short Leads, IPAK, TO-251AA
- Datasheet:
-
IRFU3410.pdf
- Description:
- MOSFET N-CH 100V 31A IPAK
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IRFU3410 from Infineon Technologies (formerly International Rectifier) is a 100 V, 31 A N-channel enhancement-mode HEXFET Power MOSFET in D-Pak package, featuring 39 mΩ RDS(on) at VGS = 10 V, 125 A pulsed drain current, and optimized gate charge (Qg = 37 nC typ.) for high-frequency DC-DC converters.
For engineers reviewing the IRFU3410 datasheet, IRFU3410 pinout, IRFU3410 application, or IRFU3410 equivalent, key selection criteria include its low RDS(on), fast switching (tr = 27 ns, tf = 13 ns), robust avalanche rating (EAS = 140 mJ), and thermal resistance (RθJC = 1.4 °C/W) - all critical for compact, high-efficiency power stages.
Technical Context
This MOSFET employs planar silicon process with optimized cell geometry to achieve low conduction loss and controlled capacitive behavior. Its Ciss = 1690 pF, Coss = 220 pF, and Crss = 26 pF support predictable hard-switching performance up to several hundred kHz.
The integrated body diode exhibits VSD = 1.3 V at IS = 18 A and trr = 84 ns with Qrr = 260 nC, enabling reliable synchronous rectification and unclamped inductive switching in buck and half-bridge topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - supports 48 V input bus designs with 2× safety margin against transients |
| RDS(on) max | 39 mΩ at VGS = 10 V, TJ = 25°C - enables ≤1.2 W conduction loss at 18 A continuous |
| ID continuous | 31 A at TC = 25°C - rated for PCB-mount thermal interface with heatsink |
| Qg | 37 nC typ. - reduces gate drive power and enables 500 kHz+ PWM operation with standard drivers |
| EAS | 140 mJ single-pulse - withstands energy from inductive turn-off without external snubber |
| RθJC | 1.4 °C/W - allows direct case-to-heatsink mounting for high-power density layouts |
| tr/tf | 27 ns / 13 ns - minimizes switching transition losses in hard-switched converters |
Pinout & Package
D-Pak (TO-252AA) surface-mount package with exposed drain pad for thermal and electrical connection; 3-pin configuration: Drain (pins 1 & 2 & tab), Source (pin 3), Gate (pin 1 leadframe tie).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab + Pins 1 & 2) | Main current path collector | Electrically and thermally connected to PCB copper pour; primary heat dissipation path |
| Source (Pin 3) | Reference node for gate drive and current sensing | Low-inductance return path; used for Kelvin source connection in precision gate control |
| Gate (Pin 1 leadframe) | Control terminal for channel modulation | High-impedance input requiring <10 Ω series resistance to damp ringing in high-dV/dt environments |
Key Features
| Feature | Design Value |
|---|---|
| Low gate-to-drain charge (Qgd) | 11 nC - reduces Miller-induced shoot-through risk and improves voltage-controlled switching stability |
| Fully characterized Coss(eff) | 250 pF - enables accurate calculation of turn-off energy and snubber sizing across full VDS range |
| Avalanche-rated | 140 mJ EAS - eliminates need for external clamping in flyback or active clamp circuits |
| Lead-free (PbF) | RoHS-compliant finish - meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1) for reflow assembly |
| Body diode Qrr | 260 nC - supports zero-voltage switching (ZVS) design in resonant topologies when paired with appropriate timing |
Applications
| Server VRM | Industrial Motor Drive |
|---|---|
Use Scenario: High-current, multi-phase buck converter supplying CPU core voltage (0.8–1.2 V @ up to 200 A). IC Role / Device Role / Timing Role: Synchronous rectifier MOSFET in low-side position, switching at 300–600 kHz with precise dead-time control. Use Value: 39 mΩ RDS(on) and 1.4 °C/W RθJC enable >95% efficiency and <5°C junction rise above heatsink at full load. | Use Scenario: Inverter stage for 0.5–2 kW BLDC motor drives in HVAC blowers and pumps. IC Role / Device Role / Timing Role: Low-side switch in three-phase bridge, operating with 10–20 kHz PWM and regenerative braking. Use Value: 125 A pulsed rating and 140 mJ avalanche energy tolerate motor inductance kickback during fault conditions without failure. |
| Telecom DC-DC | LED Driver |
Use Scenario: Isolated forward or active-clamp forward converter in 48 V telecom rectifier modules. IC Role / Device Role / Timing Role: Primary-side switch handling 100 V bus with 500 kHz switching and tight duty-cycle control. Use Value: Low Crss (26 pF) and fast tf (13 ns) minimize cross-conduction loss and improve light-load efficiency. | Use Scenario: Constant-current buck driver for high-brightness LED arrays in street lighting (36–72 V input). IC Role / Device Role / Timing Role: Main power switch regulating average LED current via PWM dimming at 1–20 kHz. Use Value: Body diode trr = 84 ns and Qrr = 260 nC prevent voltage overshoot and EMI during diode commutation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP36NF10 | RDS(on) = 38 mΩ, Qg = 45 nC, TO-220 package | Larger footprint, higher thermal resistance (RθJC = 1.5 °C/W), no exposed drain pad | Preferred where through-hole mounting or legacy board layout requires TO-220 form factor |
| IXTP30N10P | RDS(on) = 32 mΩ, Qg = 42 nC, TO-220FP package | Vertical FET structure yields lower Coss but higher cost; not RoHS-compliant by default | Selected when lowest possible RDS(on) is prioritized over gate drive simplicity and lead-free compliance |
Compared with STP36NF10 and IXTP30N10P, the IRFU3410 offers superior thermal performance in surface-mount format, tighter Qg/RDS(on) trade-off for high-frequency use, and guaranteed Pb-free construction - making it optimal for space-constrained, high-reliability DC-DC modules.
Availability
IRFU3410 is available at Aetrix Electronics and suitable for server VRMs, industrial motor drives, telecom DC-DC converters, and LED drivers requiring stable component supply across extended production lifecycles.
Supply support for IRFU3410 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon MOSFET and IGBT development.
The IRFU3410 belongs to the HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-frequency switching power supplies and motor control applications demanding low RDS(on), fast switching, and rugged avalanche capability.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRFU3410 supports 22 A continuous drain current at TC = 100°C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the D-Pak package under real-world PCB mount conditions with limited copper area, and must be verified using the normalized RDS(on) vs. temperature curve (Fig 4) and actual thermal design.
Does the IRFU3410 have a built-in body diode, and what are its key parameters?
Yes, the IRFU3410 integrates a monolithic p-n junction body diode. Key parameters include VSD = 1.3 V at IS = 18 A and TJ = 25°C, reverse recovery time trr = 84 ns, and Qrr = 260 nC under specified test conditions (di/dt = 100 A/µs). These values are measured with VGS = 0 V and define diode performance in synchronous rectification and freewheeling roles.
Can the IRFU3410 be used in avalanche mode, and what is its rated energy?
Yes, the IRFU3410 is fully rated for repetitive unclamped inductive switching (UIS). Its single-pulse avalanche energy EAS is 140 mJ at TJ = 25°C, with IAR = 18 A peak avalanche current. Operation within the Safe Operating Area (SOA) curves (Fig 8) and adherence to pulse width limits per Fig 12c are required to ensure reliability under avalanche stress.
What is the gate threshold voltage range, and how does it affect drive circuit design?
The gate threshold voltage VGS(th) is specified from 2.0 V to 4.0 V at ID = 250 µA. This range indicates moderate process variation and necessitates gate drive voltages ≥10 V to ensure full enhancement and minimal RDS(on). Drive circuits must provide sufficient voltage headroom and current capability to overcome Qg = 37 nC within required switching times while avoiding unintended turn-on from noise coupling.
IRFU3410 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-251-3 Short Leads, IPAK, TO-251AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 31A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 39mOhm @ 18A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 56 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1690 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3W (Ta), 110W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- IPAK (TO-251AA)
IRFU3410 FAQ
1.How can I place an order for IRFU3410 through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFU3410 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFU3410 reliable?
The price and inventory of IRFU3410 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFU3410 is usually 5 days.
3.What payment methods are accepted for IRFU3410?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFU3410 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFU3410?
IRFU3410 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFU3410 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFU3410?
For technical support, including IRFU3410 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFU3410 requirements.
6.How does Aetrix verify that IRFU3410 is sourced from the original manufacturer or authorized distributors?
All IRFU3410 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFU3410 meets industry standards.
7.What is the process for return or replacement of IRFU3410?
All IRFU3410 units undergo pre-shipment inspection (PSI). If there is an issue with IRFU3410, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFU3410 part is unused and in its original packaging.
Return procedure for IRFU3410:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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