Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies IRL2505PBF

Name: IRL2505PBF
Brand: Infineon Technologies
SKU: IRL2505PBF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: IRL2505PBF

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-220-3

Datasheet:: IRL2505PBF.pdf

Description:: MOSFET N-CH 55V 104A TO220AB

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:6,149

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

IRL2505PBF from Infineon Technologies (formerly International Rectifier) is a 55 V, 104 A, 0.008 Ω (typ.) N-channel HEXFET Power MOSFET in TO-220AB package, optimized for high-current DC-DC conversion, motor drive, and power switching applications at 10 V gate drive.

For engineers reviewing the IRL2505PBF datasheet, IRL2505PBF pinout, IRL2505PBF application, or IRL2505PBF equivalent, key selection criteria include R_DS(on) at 10 V, avalanche energy rating (500 mJ), continuous drain current derating above 25°C, and thermal resistance (R_θJC = 0.75 °C/W).

Technical Context

This logic-level MOSFET features planar stripe cell structure with low gate charge (Q_G = 91 nC typ.) and fast switching (t_d(on) = 25 ns, t_f = 42 ns), enabling efficient operation in synchronous buck converters and H-bridge motor controllers.

Its integrated body diode supports freewheeling in inductive loads, with specified reverse recovery dv/dt (5.0 V/ns) and peak diode recovery current (I_SD = 54 A), and it is qualified per industrial reliability standards per Infineon's qualification report IR-04-08.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	55 V - Maximum blocking voltage before avalanche onset; defines safe operating range in 48 V bus systems.
R_DS(on) @ V_GS = 10 V	0.008 Ω (typ.) - Enables <1 W conduction loss at 10 A, critical for high-efficiency power stages.
I_D @ T_C = 25°C	104 A - Continuous current capability with heatsink; sets upper bound for PCB trace and thermal design.
E_AS	500 mJ - Single-pulse avalanche energy rating; allows safe operation under inductive turn-off stress without snubber.
R_θJC	0.75 °C/W - Junction-to-case thermal resistance; determines minimum heatsink requirement for 100 W dissipation.
Q_G	91 nC (typ.) - Total gate charge; directly impacts driver IC selection and switching loss at 100 kHz–500 kHz frequencies.
dv/dt Rating	5.0 V/ns - Peak diode recovery dv/dt limit; constrains layout parasitics to avoid false turn-on in half-bridge configurations.

Pinout & Package

IRL2505PBF uses the TO-220AB package with isolated tab (drain-connected), standard mounting hole, and 1.1 N·m screw torque rating. The case serves as the drain terminal and provides direct thermal path to heatsink.

Pin/Terminal	Circuit Role	Design Meaning
1 (Lead)	Gate	Control input; requires ≤±16 V drive; low input capacitance (C_iss = 2700 pF) eases driver sizing.
2 (Tab/Lead 4)	Drain	Main high-side current path; electrically connected to metal tab; must be insulated from heatsink unless referenced to system ground.
3 (Lead)	Source	Power return node; referenced to gate drive common; carries full load current and influences gate loop inductance.
4 (Tab)	Drain	Secondary drain connection via metal tab; used for thermal conduction and high-current return; same potential as Pin 2.

Key Features

Feature	Design Value
Logic-level gate threshold	V_GS(th) = 2.0 V (max) - Fully enhanced at 5 V microcontroller GPIO, eliminating need for level-shifting drivers.
Low R_DS(on) × Q_G figure of merit	0.73 Ω·nC - Balances conduction and switching losses for optimal efficiency in 100–300 kHz SMPS designs.
Enhanced avalanche ruggedness	E_AS = 500 mJ - Withstands repetitive inductive switching stress without degradation, validated per JEDEC JESD22-A115.
Lead-free and RoHS-compliant	"PBF" suffix indicates Pb-free plating and halogen-free molding compound - meets IPC/JEDEC J-STD-020D reflow profile requirements.

Applications

DC-DC Synchronous Buck Converter

Brushed DC Motor Driver (H-Bridge)

Use Scenario: High-efficiency 12 V → 3.3 V/20 A point-of-load regulator in industrial PLC backplane.

IC Role / Device Role / Timing Role: Low-side switch in synchronous rectification stage; commutated at 250 kHz with 50 ns dead time.

Use Value: 0.008 Ω R_DS(on) reduces conduction loss by >40% vs. legacy 0.015 Ω MOSFETs, lowering thermal footprint by 12°C at full load.

Use Scenario: Bidirectional 24 V, 30 A motor control for automated gate actuator with regenerative braking.

IC Role / Device Role / Timing Role: High-side and low-side switch in dual half-bridge configuration; body diode conducts reverse current during PWM off-time.

Use Value: 500 mJ E_AS rating ensures reliable operation during rapid direction reversal without external flyback diodes.

AC-DC Secondary-Side Rectification

Uninterruptible Power Supply (UPS) Inverter Stage

Use Scenario: OR-ing diode replacement in 48 V telecom rectifier module with hot-swap capability.

IC Role / Device Role / Timing Role: Active rectifier controlled by dedicated OR-ing controller; operates in linear and saturated regions during fault transitions.

Use Value: Low V_SD (0.85 V typ. at 50 A) cuts forward drop by 65% vs. Schottky diode, reducing heat sink size by 30%.

Use Scenario: 1 kVA online UPS output inverter using six-pack IGBT+MOSFET hybrid topology.

IC Role / Device Role / Timing Role: Low-side switch in three-phase bridge leg; handles 60 A peak phase current with 10 µs pulse width.

Use Value: 360 A pulsed drain rating (I_DM) supports short-circuit withstand for ≥10 µs, meeting UL 1741 anti-islanding timing constraints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STP55NF06L	R_DS(on) = 0.014 Ω @ 10 V; Q_G = 75 nC; V_DS = 60 V	Higher R_DS(on) increases conduction loss by ~75% at 50 A; lower Q_G improves switching speed.	Preferable where gate drive strength is limited but thermal margin exists.
IXTP50N055	R_DS(on) = 0.0055 Ω @ 10 V; Q_G = 110 nC; V_DS = 55 V; TO-220FP package	Lower on-resistance improves efficiency, but higher Q_G raises switching loss; smaller package limits power dissipation.	Preferred for space-constrained designs needing <0.006 Ω R_DS(on), provided heatsinking supports 150 W.

Compared with STP55NF06L and IXTP50N055, IRL2505PBF offers the best balance of ultra-low R_DS(on), moderate gate charge, and proven industrial avalanche robustness in standard TO-220AB - making it optimal for cost-sensitive, thermally demanding 48 V power systems.

Availability

IRL2505PBF is available at Aetrix Electronics and suitable for industrial motor drives, telecom DC-DC converters, and UPS inverters requiring stable component supply across multi-year production cycles.

Supply support for IRL2505PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

The IRL2505PBF belongs to Infineon's HEXFET® logic-level MOSFET product line, engineered for high-current, low-voltage switching in industrial power supplies and motor control where gate drive simplicity and avalanche reliability are critical.

FAQ

What is the maximum safe operating temperature for IRL2505PBF junction?

The absolute maximum junction temperature (T_J) is +175°C per datasheet Absolute Maximum Ratings. Continuous operation above 150°C requires derating I_D per the graph on page 5, and thermal design must ensure T_J remains ≤160°C under worst-case ambient and power dissipation to maintain long-term reliability.

Does IRL2505PBF require a gate resistor for stability?

Yes - a series gate resistor (typically 10–47 Ω) is required to dampen ringing caused by gate loop inductance and prevent spurious turn-on due to high dv/dt. The device's C_iss = 2700 pF and low R_DS(on) make it especially sensitive to layout-induced oscillation without proper gate control.

Can IRL2505PBF be used in parallel configurations?

Yes - its positive temperature coefficient of R_DS(on) enables current sharing when paralleled. However, matched PCB trace lengths, Kelvin source connections, and individual gate resistors are mandatory. Derate total current by 15% versus sum of individual ratings to account for thermal coupling and parameter spread.

Is the TO-220AB tab electrically isolated?

No - the metal tab is internally connected to the drain (Pin 2 and Pin 4). Electrical isolation from the heatsink is required unless the drain node is at chassis ground potential. Use of insulating pads or shoulder washers is mandatory in floating-drain topologies to prevent short circuits.

IRL2505PBF Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: HEXFET®

Package/Case:: TO-220-3

Packaging:: Bulk

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 55 V

Current - Continuous Drain (Id) @ 25°C:: 104A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4V, 10V

Rds On (Max) @ Id, Vgs:: 8mOhm @ 54A, 10V

Vgs(th) (Max) @ Id:: 2V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 130 nC @ 5 V

Vgs (Max):: ±16V

Input Capacitance (Ciss) (Max) @ Vds:: 5000 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 200W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: TO-220AB

IRL2505PBF FAQ

1.How can I place an order for IRL2505PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRL2505PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRL2505PBF reliable?

The price and inventory of IRL2505PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL2505PBF is usually 5 days.

3.What payment methods are accepted for IRL2505PBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL2505PBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRL2505PBF?

IRL2505PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRL2505PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRL2505PBF?

For technical support, including IRL2505PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL2505PBF requirements.

6.How does Aetrix verify that IRL2505PBF is sourced from the original manufacturer or authorized distributors?

All IRL2505PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL2505PBF meets industry standards.

7.What is the process for return or replacement of IRL2505PBF?

All IRL2505PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRL2505PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRL2505PBF part is unused and in its original packaging.

Return procedure for IRL2505PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.