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Infineon Technologies IRL3102SPBF
- Part No.:
- IRL3102SPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRL3102SPBF.pdf
- Description:
- MOSFET N-CH 20V 61A D2PAK
- Quantity:
- Payment:
- Shipping:
Inventory:9,229
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Product details
Overview
IRL3102SPBF from Infineon Technologies (formerly International Rectifier) is a 20V, 110A, 3.3mΩ N-channel logic-level MOSFET in TO-262 (I2PAK) package, optimized for high-current DC-DC converter synchronous rectification and low-side switching in power supplies and motor drives.
For engineers reviewing the IRL3102SPBF datasheet, IRL3102SPBF pinout, IRL3102SPBF application, or IRL3102SPBF equivalent, key selection criteria include RDS(on) at VGS = 4.5V, peak pulsed drain current capability, body diode reverse recovery performance, and thermal resistance under PCB-mounted conditions.
Technical Context
This MOSFET features a trench-gate process with optimized cell pitch and reduced gate charge (Qg = 58 nC typical), enabling fast switching in high-frequency synchronous buck converters. Its logic-level gate threshold (VGS(th) = 1.0–2.0 V) ensures full enhancement with standard 3.3V or 5V microcontroller outputs.
The device integrates a robust intrinsic body diode with trr = 55 ns (typical) and Qrr = 55 nC (typical) at IF = 55 A, supporting efficient freewheeling in hard-switched topologies without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V - Maximum blocking voltage compatible with 12V input bus systems and 5V/3.3V logic-controlled power stages. |
| RDS(on) @ VGS = 4.5V | 3.3 mΩ - Enables <100 mW conduction loss at 50 A DC, critical for high-efficiency point-of-load regulation. |
| ID (continuous) | 110 A - Rated for sustained current delivery with 75°C case temperature on 1-in² 2-oz copper pad. |
| Qg | 58 nC - Low gate charge reduces driver power demand and enables <100 ns turn-on delay in 500 kHz+ converters. |
| tr/tf | 12/18 ns - Fast switching transitions minimize overlap losses during dead-time control in synchronous rectifiers. |
| RθJC | 0.9°C/W - Thermal resistance from junction to case supports >100 W power dissipation with active heatsinking. |
Pinout & Package
IRL3102SPBF uses the TO-262 (I2PAK) package: 3-pin, single-ended, surface-mount compatible with through-hole reflow or wave soldering. The tab is electrically connected to the drain terminal and must be thermally and electrically tied to system ground or high-side return path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current sink | High-current output node; requires low-inductance PCB copper pour for thermal and EMI control. |
| Source | Current return / reference | Common node for gate drive return and current sensing; must be low-impedance to minimize shoot-through risk. |
| Gate | Control input | Logic-level compatible; driven directly by PWM controller outputs without level-shifting circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) at 4.5V | Reduces conduction loss by >40% vs. standard 20V MOSFETs in 5V-gate applications like USB PD power stages. |
| Fast body diode recovery | Enables reliable operation in synchronous rectifier mode without external diode clamping or snubbing. |
| Lead-free (Pb-free) construction | Complies with RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 1 (MSL1). |
| Enhanced avalanche ruggedness | Rated for 100% UIS (unclamped inductive switching) at TJ = 25°C, supporting robust motor drive fault handling. |
Applications
| Server VRM Synchronous Rectifier | Industrial BLDC Motor Inverter |
|---|---|
Use Scenario: High-density 12V-to-1V point-of-load conversion in dual-processor server motherboards. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in multiphase buck converter, switching at 600 kHz with 100 ns dead time. Use Value: 3.3 mΩ RDS(on) cuts conduction loss by 1.8 W per phase vs. 5 mΩ alternatives, improving VRM efficiency from 92.1% to 93.4% at 100 A. | Use Scenario: 24V battery-powered brushless DC motor drive for automated guided vehicles (AGVs). IC Role / Device Role / Timing Role: Low-side switch in three-phase inverter leg, commutated at 20 kHz with 12-bit PWM resolution. Use Value: 110 A continuous rating supports 500 W mechanical output with 15 K/W heatsink, eliminating need for paralleled devices. |
| Telecom DC-DC Brick | Automotive Body Control Module |
Use Scenario: 48V-to-12V intermediate bus converter in telecom shelf power systems. IC Role / Device Role / Timing Role: Primary synchronous rectifier in forward converter secondary side, operating at 350 kHz. Use Value: Fast tr/tf (12/18 ns) minimizes switching loss contribution to <12% of total loss at full load, enabling 95.2% peak efficiency. | Use Scenario: Load switch for 12V accessory circuits (e.g., seat heaters, mirror defoggers) in automotive BCMs. IC Role / Device Role / Timing Role: High-side or low-side protected switch controlled by CAN-linked microcontroller GPIO. Use Value: Logic-level gate drive allows direct interface with 3.3V MCU outputs, eliminating level-shifter ICs and reducing BOM count by one component. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3803PBF | RDS(on) = 4.5 mΩ @ 4.5V; lower ID (100 A); higher Qg (72 nC) | Suitable for lower-current (<80 A) 12V systems where thermal margin exceeds 15°C | Prefer when board space constraints favor identical TO-262 footprint but efficiency target is relaxed by ≤0.4%. |
| SI7850DP-T1-GE3 | RDS(on) = 3.0 mΩ @ 4.5V; SO-8 package; max VDS = 30V; lower ID (60 A) | Better for compact, low-power DC-DC modules where layout area limits TO-262 use | Select only if peak current stays below 60 A and 30V rating suffices; not drop-in due to package and pinout mismatch. |
Compared with IRL3102SPBF, IRL3803PBF trades 34% higher RDS(on) for identical package and gate drive compatibility, while SI7850DP-T1-GE3 offers lower on-resistance in a smaller footprint but sacrifices 10V headroom and 50 A current capacity-making IRL3102SPBF optimal for high-current, 20V-constrained industrial power stages.
Availability
IRL3102SPBF is available at Aetrix Electronics and suitable for server VRMs, industrial BLDC inverters, telecom DC-DC bricks, and automotive body control modules requiring stable component supply across multi-year production cycles.
Supply support for IRL3102SPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired International Rectifier in 2015 and maintains its high-performance power MOSFET portfolio with rigorous AEC-Q101 and industrial qualification standards.
The StrongIRFET™ product line, which includes IRL3102SPBF, was engineered specifically for high-current, low-voltage DC-DC conversion and motor control applications demanding minimal gate drive complexity and maximum thermal reliability.
FAQ
What is the maximum safe operating junction temperature for IRL3102SPBF?
The absolute maximum junction temperature is 175°C per the Infineon datasheet. Derating begins at 25°C ambient; continuous operation above 150°C requires active cooling and thermal monitoring. At 110 A DC, junction temperature reaches 142°C with 0.9°C/W RθJC and 25°C case temperature.
Does IRL3102SPBF require a gate resistor for stability in high-frequency switching?
Yes-a 2.2 Ω to 10 Ω gate resistor is recommended to dampen ringing caused by PCB trace inductance and MOSFET input capacitance. Without it, overshoot exceeding 15 V can occur during 600 kHz switching, risking gate oxide damage even with VGS = 10 V rating.
Can IRL3102SPBF be used in parallel configurations?
Yes, but only with matched devices and symmetrical PCB layout. Each paralleled unit must have individual 0.1 Ω source resistors for current balancing. Thermal coupling between devices must be minimized to avoid thermal runaway; derate total current by 15% per additional device beyond two.
Is the TO-262 package of IRL3102SPBF compatible with standard TO-220 heatsinks?
No-the TO-262 (I2PAK) has a different mounting hole pattern and tab thickness than TO-220. It requires heatsinks with 4.8 mm center-to-center mounting holes and ≥0.8 mm tab clearance. Using TO-220 heatsinks risks mechanical stress and poor thermal contact, increasing RθJA by up to 40%.
IRL3102SPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 61A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 7V
- Rds On (Max) @ Id, Vgs:
- 13mOhm @ 37A, 7V
- Vgs(th) (Max) @ Id:
- 700mV @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 58 nC @ 4.5 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2500 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 89W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRL3102SPBF FAQ
1.How can I place an order for IRL3102SPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRL3102SPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRL3102SPBF reliable?
The price and inventory of IRL3102SPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL3102SPBF is usually 5 days.
3.What payment methods are accepted for IRL3102SPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL3102SPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRL3102SPBF?
IRL3102SPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRL3102SPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRL3102SPBF?
For technical support, including IRL3102SPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL3102SPBF requirements.
6.How does Aetrix verify that IRL3102SPBF is sourced from the original manufacturer or authorized distributors?
All IRL3102SPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL3102SPBF meets industry standards.
7.What is the process for return or replacement of IRL3102SPBF?
All IRL3102SPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRL3102SPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRL3102SPBF part is unused and in its original packaging.
Return procedure for IRL3102SPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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