Infineon Technologies IRL3103PBF
- Part No.:
- IRL3103PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
IRL3103PBF.pdf
- Description:
- MOSFET N-CH 30V 64A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:3,954
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRL3103PBF from Infineon Technologies (formerly International Rectifier) is a 30V, 64A N-channel enhancement-mode power MOSFET in TO-220AB package, featuring 12 mΩ RDS(on) at VGS = 10 V, fully avalanche-rated, and lead-free. It serves as a high-efficiency synchronous rectifier or low-side switch in DC-DC converters, motor drives, and power supplies operating up to 175°C junction temperature.
For engineers reviewing the IRL3103PBF datasheet, IRL3103PBF pinout, IRL3103PBF application, or IRL3103PBF equivalent, key selection criteria include its 12 mΩ on-resistance at 10 V gate drive, 220 A pulsed drain current capability, 1320 mJ single-pulse avalanche energy rating, and validated thermal resistance of 1.6°C/W junction-to-case - critical for high-reliability industrial power switching designs.
Technical Context
This HEXFET® device uses advanced silicon processing to achieve ultra-low conduction loss while maintaining robust avalanche ruggedness and fast switching (tr = 120 ns, tf = 9.1 ns). Its gate threshold voltage (1.0–2.7 V) enables 4.5 V logic-level drive compatibility, and the integrated body diode supports freewheeling in buck and half-bridge topologies.
The MOSFET's dynamic parameters - including Qg = 33 nC, Qgd = 17 nC, and Ciss = 1650 pF - are optimized for high-frequency operation with minimal Miller effect. Thermal design is supported by verified RθJC = 1.6°C/W and RθCS = 0.50°C/W (greased flat sink), enabling stable 94 W continuous dissipation at TC = 25°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum blocking voltage before avalanche onset; defines safe operation in 24 V bus systems. |
| RDS(on) | 12 mΩ @ VGS = 10 V - Enables ≤0.77 W conduction loss at 64 A DC, reducing heatsink requirements. |
| ID (TC = 25°C) | 64 A - Continuous drain current rating under ideal heatsinking; derates linearly at 0.63 W/°C above 25°C case temp. |
| EAS | 1320 mJ - Single-pulse avalanche energy; allows reliable operation during inductive turn-off transients without external snubbers. |
| Qg | 33 nC - Total gate charge determines driver strength requirement; compatible with standard 1 A peak gate drivers. |
| tr/tf | 120 ns / 9.1 ns - Fast switching edges minimize switching losses in 100–500 kHz SMPS designs. |
| RθJC | 1.6°C/W - Verified junction-to-case thermal resistance; enables direct mounting to heatsinks with predictable thermal modeling. |
Pinout & Package
Package: TO-220AB - Industry-standard through-hole power package with isolated tab (drain-connected), rated for ≤50 W commercial-industrial use, low-cost assembly, and mechanical mounting via M3/6-32 screw (1.1 N·m torque).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control terminal | Receives gate drive signal; requires ≤16 V absolute max; threshold range 1.0–2.7 V enables 4.5 V logic compatibility. |
| 2 (Drain) | High-side current path | Internally connected to metal tab; electrically tied to pin 4; must be insulated from heatsink unless referenced to system ground. |
| 3 (Source) | Reference node | Serves as return path for load current and gate drive reference; low-inductance layout critical for EMI control. |
| 4 (Drain) | Secondary drain connection | Redundant drain terminal for enhanced current handling and thermal spreading; shares same potential as pin 2. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 12 mΩ at 10 V gate drive reduces conduction loss by >30% vs. legacy 30 V MOSFETs in 48 V input DC-DC stages. |
| Logic-level gate drive | Guaranteed turn-on at VGS ≥ 4.5 V supports direct interface with microcontrollers and PWM controllers without level-shifting. |
| Full avalanche rating | Rated for 34 A repetitive avalanche current and 1320 mJ single-pulse energy - eliminates need for external clamping in inductive loads. |
| Lead-free construction | RoHS-compliant "PbF" suffix confirms exemption-free lead-free plating and solderability per J-STD-020 moisture sensitivity level 1. |
| TO-220AB thermal performance | 1.6°C/W RθJC and 0.50°C/W RθCS (greased) enable 94 W continuous operation with standard extruded aluminum heatsinks. |
Applications
| Motor Drive Half-Bridge | DC-DC Synchronous Rectifier |
|---|---|
Use Scenario: Low-voltage BLDC motor control in industrial actuators with 24 V supply and 30 A peak phase current. IC Role / Device Role / Timing Role: Low-side switch in three-phase inverter leg; commutated at 20 kHz with dead-time control. Use Value: 12 mΩ RDS(on) limits conduction loss to <0.9 W at 30 A, enabling compact heatsinkless design in IP65 enclosures. | Use Scenario: Secondary-side synchronous rectification in 48 V–12 V isolated buck converter delivering 60 A output. IC Role / Device Role / Timing Role: Active rectifier replacing Schottky diode; driven by transformer-coupled gate signal synchronized to primary switch. Use Value: Reduces forward drop from ~0.5 V (Schottky) to <0.05 V, improving efficiency by 1.8% at full load and lowering secondary-side thermal density. |
| Hot-Swap OR-ing FET | Industrial Power Sequencer |
Use Scenario: Redundant 24 V power rail OR-ing in programmable logic controller backplane with inrush limiting. IC Role / Device Role / Timing Role: Back-to-back configured N-channel MOSFET acting as ideal diode; controlled by dedicated hot-swap controller. Use Value: 12 mΩ on-resistance yields <0.75 V drop at 60 A, minimizing voltage sag during failover and eliminating reverse recovery losses. | Use Scenario: Controlled power-up sequencing of FPGA, memory, and analog subsystems in test equipment with 3.3 V/1.2 V/1.8 V rails. IC Role / Device Role / Timing Role: High-current enable switch placed between bulk input and downstream LDOs/DC-DCs; triggered by sequencer IC. Use Value: 220 A pulsed drain rating handles 100 ms inrush surges from large bulk capacitors without SOA violation or thermal runaway. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF3205PBF | RDS(on) = 8 mΩ @ 10 V, but VDSS = 55 V and higher Qg = 71 nC | Better for 48 V systems; slower switching increases loss in >100 kHz designs | Select when higher voltage margin is needed and gate drive strength permits higher Qg. |
| STP30NF20 | VDSS = 200 V, RDS(on) = 40 mΩ @ 10 V, lower ID = 30 A | Designed for flyback snubber and AC-DC PFC; unsuitable for high-current 24 V loads | Choose only if 200 V blocking is mandatory and current demand is ≤25 A. |
Compared with IRF3205PBF and STP30NF20, the IRL3103PBF delivers optimal balance of low on-resistance, logic-level drive, and avalanche ruggedness specifically for 24–30 V industrial power switching - offering superior efficiency at high frequency and lower gate drive complexity than higher-voltage alternatives.
Availability
IRL3103PBF is available at Aetrix Electronics and suitable for motor drives, DC-DC synchronous rectifiers, and industrial hot-swap OR-ing circuits requiring stable component supply across multi-year production cycles.
Supply support for IRL3103PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, and industrial control solutions with vertical integration from silicon fabrication to system-level validation.
The IRL3103PBF belongs to Infineon's HEXFET® power MOSFET product line, engineered for high-efficiency, high-reliability switching in industrial power conversion where low conduction loss, fast switching, and rugged transient tolerance are essential.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRL3103PBF supports 45 A continuous drain current at TC = 100°C, as specified in its Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-220AB package and ensures junction temperature remains within the −55°C to +175°C operational range under sustained load conditions with appropriate heatsinking.
Is the IRL3103PBF suitable for use with 3.3 V microcontroller GPIOs?
No - while the gate threshold voltage starts at 1.0 V, full enhancement requires ≥4.5 V for guaranteed 64 A conduction. At 3.3 V, RDS(on) rises significantly (>50 mΩ), increasing conduction loss and risk of thermal runaway. A gate driver or level shifter is required for robust 3.3 V control.
Does the TO-220AB package have an electrically isolated tab?
No - the metal tab in the TO-220AB package is internally connected to the drain (pins 2 and 4). Electrical isolation from the heatsink requires a mica or polymer insulator kit plus shoulder washers, or use of a non-conductive thermal pad with verified dielectric strength ≥500 V RMS.
What is the typical reverse recovery time of the body diode?
The body diode exhibits trr = 57 ns (typical) at TJ = 25°C, IF = 34 A, and di/dt = 100 A/µs. This fast recovery minimizes switching loss and voltage overshoot during freewheeling in synchronous buck converters, especially when paired with complementary high-side switches.
IRL3103PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 64A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 12mOhm @ 34A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 33 nC @ 4.5 V
- Vgs (Max):
- ±16V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1650 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 94W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
IRL3103PBF FAQ
1.How can I place an order for IRL3103PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRL3103PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRL3103PBF reliable?
The price and inventory of IRL3103PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL3103PBF is usually 5 days.
3.What payment methods are accepted for IRL3103PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL3103PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRL3103PBF?
IRL3103PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRL3103PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRL3103PBF?
For technical support, including IRL3103PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL3103PBF requirements.
6.How does Aetrix verify that IRL3103PBF is sourced from the original manufacturer or authorized distributors?
All IRL3103PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL3103PBF meets industry standards.
7.What is the process for return or replacement of IRL3103PBF?
All IRL3103PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRL3103PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRL3103PBF part is unused and in its original packaging.
Return procedure for IRL3103PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRL3103PBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

