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Infineon Technologies IRL3302

Part No.:
IRL3302
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixIRL3302.pdf
Description:
MOSFET N-CH 20V 39A TO220AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,841

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Product details

Overview

IRL3302 from International Rectifier is a 20V, 39A (at TC = 25°C, VGS = 4.5V) N-channel HEXFET® Power MOSFET in TO-220AB package, optimized for 4.5V gate drive and designed specifically for CPU core DC-DC converters in PCs. It features RDS(on) = 0.020 Ω at VGS = 4.5V/ID = 23A, 150°C max junction temperature, and fast switching with td(on) = 7.2 ns and tf = 89 ns.

For engineers reviewing the IRL3302 datasheet, IRL3302 pinout, IRL3302 application, or IRL3302 equivalent, key selection criteria include low-threshold 4.5V logic-level gate drive compatibility, high pulsed drain current (160A), avalanche ruggedness (EAS = 130 mJ), and thermal performance (RθJC = 2.2°C/W) in high-density power stages.

Technical Context

The IRL3302 employs advanced process technology and an optimized gate oxide to achieve low RDS(on) at 4.5V gate drive-enabling direct interface with low-voltage PWM controllers in synchronous buck converters. Its body diode exhibits trr = 62–94 ns and Qrr = 110–160 nC, supporting efficient synchronous rectification or freewheeling in high-frequency (<1 MHz) topologies.

Designed for CPU core voltage regulation, it operates reliably across –55°C to +150°C junction range with linear derating (0.45 W/°C above 25°C). The TO-220AB package provides low thermal resistance to heatsink (RθCS = 0.50°C/W) and robust mechanical mounting (10 lbf·in torque).

Key Specifications

ParameterValue and Actual Design Meaning
V(BR)DSS20 V - Withstands up to 20V drain-source blocking voltage, suitable for 12V-input or lower intermediate bus DC-DC stages.
RDS(on)0.020 Ω @ VGS = 4.5V, ID = 23A - Enables <0.5W conduction loss at 50A peak in typical CPU VRMs.
ID (TC = 25°C)39 A - Supports high-current output stages without parallel devices in compact 1–2 phase designs.
EAS130 mJ - Provides single-pulse avalanche energy margin during transient overvoltage events like load dump or inductive kickback.
Qg / Qgd31 nC / 13 nC - Low Miller charge enables fast, clean switching with minimal gate drive power and reduced shoot-through risk.
tr / tf110 ns / 89 ns - Fast edge rates support >500 kHz switching frequencies while maintaining efficiency and EMI control.
RθJC2.2 °C/W - Allows direct heatsink mounting with predictable thermal rise; enables 57W dissipation at 25°C case temperature.

Pinout & Package

IRL3302 is housed in a TO-220AB package with isolated tab (drain-connected), standard lead spacing, and mechanical mounting hole. Thermal path is optimized via metal tab contact to heatsink.

Pin/TerminalCircuit RoleDesign Meaning
1 - GateControl terminalReceives 4.5V logic-level PWM signal; low VGS(th) (0.7V min) ensures full enhancement with standard controller outputs.
2 - DrainHigh-side switch nodeConnected to input rail and internal die substrate; electrically tied to metal tab for low-inductance thermal path.
3 - SourcePower return / referenceServes as local ground reference for gate driver and current sensing; connects to PCB power plane for low-impedance return path.
4 - Drain (Tab)Thermal & electrical nodeExposed metal tab is internally connected to Drain; must be electrically isolated from heatsink unless system design permits drain-referenced cooling.

Key Features

FeatureDesign Value
Logic-level gate driveOperates fully enhanced at VGS = 4.5V - eliminates need for gate boosters in 5V or 3.3V controller systems.
Optimized RDS(on) vs. temperatureRDS(on) increases only ~1.8× from 25°C to 125°C - maintains stable conduction loss across CPU thermal envelope.
Fast body diode recoverytrr = 62 ns (typ), Qrr = 110 nC - reduces reverse recovery losses and EMI in synchronous rectifier configurations.
Avalanche-ratedEAS = 130 mJ (TJ = 25°C) - withstands inductive energy spikes without failure in unclamped inverter or converter fault conditions.
TO-220AB mechanical robustnessMounting torque rating 10 lbf·in (1.1 N·m) - ensures reliable thermal interface under thermal cycling in industrial PC and server applications.

Applications

Server CPU Voltage RegulatorLaptop Core Power Stage

Use Scenario: High-current, multi-phase buck converter supplying dynamic 0.8–1.5V core voltage to Intel/AMD processors under rapid load transients.

IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 300–600 kHz with tight dead-time control.

Use Value: Low RDS(on) and fast switching minimize conduction + switching losses, enabling >90% efficiency at 50A+ loads while meeting strict thermal limits on dense motherboard layouts.

Use Scenario: Compact dual-phase VRM on thin-and-light laptop motherboards where space and thermal headroom are constrained.

IC Role / Device Role / Timing Role: Primary switching FET in 12V-to-core-buck stage, driven directly by 4.5V PWM output of embedded controller.

Use Value: Logic-level compatibility eliminates level-shifter components; TO-220AB footprint allows manual rework and supports cost-effective heatsink integration without thermal vias.

Industrial PLC Power ModuleNetwork Switch ASIC Supply

Use Scenario: 24V-input DC-DC module powering FPGA and microcontroller cores in programmable logic controllers with extended temperature operation.

IC Role / Device Role / Timing Role: Main switching transistor in isolated or non-isolated buck regulator delivering 1.2V/15A with -40°C to +85°C ambient requirement.

Use Value: 150°C rated junction temperature and guaranteed RDS(on) performance at 100°C case enable reliable operation without derating in sealed enclosures.

Use Scenario: Point-of-load regulator supplying 0.95V/30A to high-speed Ethernet switch ASICs with stringent ripple and transient response specs.

IC Role / Device Role / Timing Role: High-efficiency, low-noise high-side FET in multiphase buck topology synchronized to system clock.

Use Value: Low Qgd and Ciss reduce gate drive losses and improve loop stability; fast trr minimizes cross-conduction losses during phase interleaving.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRL3803RDS(on) = 0.006 Ω @ 4.5V (lower), but ID = 110A and PD = 90W - larger die, higher gate charge (Qg = 51 nC).Better suited for higher-current, lower-loss 3+ phase VRMs; requires stronger gate driver due to higher Qg.Select when conduction loss dominates and gate drive capability supports 51 nC charge.
SI4435DYSO-8 package, RDS(on) = 0.018 Ω @ 4.5V, ID = 8.5A continuous - smaller footprint, lower current rating, no isolated tab.Targeted at space-constrained, lower-power applications (e.g., peripheral rails); not suitable for >15A CPU core loads.Select for board area optimization where thermal budget allows surface-mount heatsinking or lower current demand.

Compared with IRL3302, IRL3803 offers superior conduction efficiency at higher currents but demands more gate drive strength, while SI4435DY trades current capacity and thermal robustness for compactness-making IRL3302 the balanced choice for mainstream 20–40A CPU VRMs requiring TO-220 reliability and 4.5V drive simplicity.

Availability

IRL3302 is available at Aetrix Electronics and suitable for server CPU voltage regulators, laptop core power stages, and industrial PLC power modules requiring stable component supply and long-lifecycle support.

Supply support for IRL3302 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

International Rectifier (now part of Infineon Technologies) was a pioneer in power MOSFET and IGBT design, headquartered in El Segundo, CA, with global manufacturing and application engineering presence.

The HEXFET® product line was developed specifically for high-efficiency, high-density DC-DC conversion-emphasizing low RDS(on), logic-level gate drive, and rugged avalanche performance in computing and industrial power systems.

FAQ

Is the IRL3302 suitable for synchronous rectification in a buck converter?

Yes. Its integrated body diode has trr = 62–94 ns and Qrr = 110–160 nC, enabling efficient synchronous rectification when paired with a complementary low-side FET. The low RDS(on) and fast switching further reduce total power loss in high-frequency (>300 kHz) topologies.

What is the maximum safe operating frequency for the IRL3302 in a 12V-input buck converter?

Based on its 110 ns rise time and 89 ns fall time, the IRL3302 supports stable operation up to 1 MHz in well-designed layouts with minimized parasitic inductance. Practical use in CPU VRMs typically ranges from 300 kHz to 600 kHz to balance efficiency, EMI, and gate drive losses.

Does the TO-220AB package require electrical isolation when mounted to a heatsink?

Yes. Pin 2 (Drain) and the metal tab are internally connected. If the heatsink is grounded or at a different potential, a thermally conductive but electrically isolating pad (e.g., mica or polymer film) must be used to prevent short circuits and ensure safety compliance.

Can the IRL3302 replace the IRF3710 in a 4.5V gate-driven application?

No. The IRF3710 requires ≥10V VGS for full enhancement (VGS(th) = 2–4V), whereas the IRL3302 is specified for full conduction at 4.5V. Substituting IRL3302 for IRF3710 in a 4.5V-driven circuit improves efficiency and reliability-but not vice versa without gate boosting.

IRL3302 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
20 V
Current - Continuous Drain (Id) @ 25°C:
39A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 7V
Rds On (Max) @ Id, Vgs:
20mOhm @ 23A, 7V
Vgs(th) (Max) @ Id:
700mV @ 250µA (Min)
Gate Charge (Qg) (Max) @ Vgs:
31 nC @ 4.5 V
Vgs (Max):
±10V
Input Capacitance (Ciss) (Max) @ Vds:
1300 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
57W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB

IRL3302 FAQ

1.How can I place an order for IRL3302 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRL3302 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRL3302 reliable?

The price and inventory of IRL3302 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL3302 is usually 5 days.

3.What payment methods are accepted for IRL3302?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL3302 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRL3302?

IRL3302 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRL3302 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRL3302?

For technical support, including IRL3302 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL3302 requirements.

6.How does Aetrix verify that IRL3302 is sourced from the original manufacturer or authorized distributors?

All IRL3302 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL3302 meets industry standards.

7.What is the process for return or replacement of IRL3302?

All IRL3302 units undergo pre-shipment inspection (PSI). If there is an issue with IRL3302, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRL3302 part is unused and in its original packaging.

Return procedure for IRL3302:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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