Infineon Technologies IRL3714ZLPBF
- Part No.:
- IRL3714ZLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
IRL3714ZLPBF.pdf
- Description:
- MOSFET N-CH 20V 36A TO262
- Quantity:
- Payment:

- Shipping:

Inventory:3,762
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRL3714ZLPBF from Infineon Technologies is a 20V, 36A N-channel enhancement-mode HEXFET Power MOSFET in D2Pak (TO-263) package, optimized as a synchronous rectifier or low-side switch in high-frequency DC/DC converters. It delivers 13 mΩ RDS(on) at VGS = 4.5 V, 4.8 nC total gate charge, and 140 A pulsed drain current - enabling efficient operation in CPU core voltage regulation.
For engineers reviewing the IRL3714ZLPBF datasheet, IRL3714ZLPBF pinout, IRL3714ZLPBF application, or IRL3714ZLPBF equivalent, key selection criteria include its ultra-low gate impedance, fully characterized avalanche capability, lead-free D2Pak thermal performance (RθJC = 4.3 °C/W), and body diode recovery (trr = 8.3 ns, Qrr = 1.5 nC) for synchronous buck topologies.
Technical Context
This MOSFET employs planar silicon-gate technology with optimized cell pitch and trench-assisted charge balancing to achieve low RDS(on) while maintaining robust unclamped inductive switching (EAS = 100 mJ at TJ = 25°C). Its gate threshold voltage (VGS(th) = 1.65–2.55 V) ensures reliable turn-on with 3.3 V and 5 V logic drivers.
The device features a fully rated integral body diode with low forward voltage (VSD ≤ 1.0 V at IS = 14 A) and fast reverse recovery (Qrr = 1.5–2.3 nC), minimizing cross-conduction losses in synchronous rectification. Thermal design is supported by validated junction-to-case resistance (4.3 °C/W) and PCB-mount RθJA of 40 °C/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V - supports input rails up to 16 V with 20 % margin for transient spikes in 12 V bus systems |
| RDS(on) max @ 4.5 V | 16 mΩ - enables <1.5 W conduction loss at 12 A DC load in 48 V→12 V intermediate bus converters |
| Qg | 4.8 nC - reduces gate drive power and allows use of low-current PWM controllers (e.g., IR35201) |
| ID @ TC = 25°C | 36 A - sustains full-load current in single-phase VRMs without forced airflow |
| trr | 8.3 ns - limits shoot-through risk during dead-time transitions in 500 kHz–1 MHz synchronous buck stages |
| RθJC | 4.3 °C/W - permits 25 W dissipation with ≤100°C case temperature rise using standard heatsink interface |
| EAS | 100 mJ - withstands single-pulse inductive energy from 10 µH chokes at 30 A peak without failure |
Pinout & Package
IRL3714ZLPBF uses the surface-mount D2Pak (TO-263) package with exposed drain pad for thermal and electrical connection. The package measures 10.67 mm × 9.65 mm × 4.83 mm and is RoHS-compliant and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path output terminal | Electrically and thermally connected to PCB copper pour; requires solder mask opening and ≥2 oz Cu for thermal relief |
| Source | Reference node for gate control and current return | Connected to power ground plane; must minimize inductance to avoid gate oscillation during hard switching |
| Gate | Control electrode for channel modulation | High-impedance input requiring <10 Ω series resistor to damp ringing; sensitive to dv/dt coupling from drain node |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) at 4.5 V | 13 mΩ typ. - enables direct drive from 5 V microcontrollers and eliminates level-shifting in low-voltage gate driver ICs |
| Fully characterized avalanche rating | EAS = 100 mJ - removes need for external snubbers in non-isolated flyback or buck-derived topologies |
| Ultra-low gate impedance | Qgd/Qgs1 ratio < 1.0 - suppresses Cdv/dt turn-on during high dV/dt node transitions in synchronous rectifiers |
| Fast body diode recovery | Qrr = 1.5 nC - reduces reverse recovery loss transferred to high-side FET and improves light-load efficiency |
| Thermal performance | RθJC = 4.3 °C/W - supports >25 W continuous operation with passive cooling on 4-layer PCBs |
Applications
| Server VRM Phase Legs | Laptop CPU Core Regulators |
|---|---|
Use Scenario: Single-phase 12 V → 1.0 V/100 A buck converter supplying Intel Core i9 processor under turbo boost. IC Role / Device Role / Timing Role: Low-side synchronous rectifier switching at 1 MHz with 100 ns dead time. Use Value: 13 mΩ RDS(on) and 8.3 ns trr reduce conduction + recovery losses by 22 % vs. legacy 25 mΩ parts, improving full-load efficiency from 92.1 % to 93.7 %. | Use Scenario: Dual-phase 19 V → 1.2 V/40 A regulator powering AMD Ryzen 7 mobile SoC in thin-and-light chassis. IC Role / Device Role / Timing Role: Bottom-FET in interleaved buck stage, driven by integrated controller with 3.3 V gate output. Use Value: 4.8 nC Qg allows full switching at 800 kHz without gate driver saturation, enabling smaller output inductors and reduced board area. |
| Industrial PLC Power Modules | Automotive ADAS Domain Controllers |
Use Scenario: 24 V input → 5 V/15 A auxiliary rail for I/O isolation and communication interfaces in DIN-rail mounted PLC. IC Role / Device Role / Timing Role: Primary low-side switch in 300 kHz synchronous buck with wide ambient range (-40°C to +85°C). Use Value: Stable RDS(on) temperature coefficient (0.015 mV/°C) and 175°C TJ(max) ensure consistent regulation across industrial temperature extremes. | Use Scenario: 12 V battery-fed 3.3 V/8 A power rail for radar sensor fusion MCU in autonomous driving ECU. IC Role / Device Role / Timing Role: Secondary-side switch in compact 600 kHz buck converter with strict EMI limits. Use Value: Low Crss (99 pF) and controlled Qgd/Qgs1 ratio minimize dv/dt-induced false turn-on, eliminating need for negative gate bias circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3713ZLPBF | RDS(on) = 11 mΩ @ 4.5 V; Qg = 5.4 nC; same D2Pak package | Higher conduction efficiency but increased gate drive loss at >1 MHz switching | Select when optimizing for <500 kHz operation with minimal RDS(on) priority |
| SI7850DP-T1-GE3 | RDS(on) = 14 mΩ @ 4.5 V; Qg = 4.2 nC; SO-8 package, no exposed drain | Lower gate charge but limited thermal capacity (RθJA = 50 °C/W); unsuitable above 15 A continuous | Select only for space-constrained, low-power (<10 A) applications where PCB real estate outweighs thermal headroom |
Compared with IRL3714ZLPBF, IRL3713ZLPBF trades marginally lower RDS(on) for higher Qg, increasing gate loss at high frequency; SI7850DP offers faster switching in SO-8 but cannot sustain 36 A due to package thermal limits - making IRL3714ZLPBF the balanced choice for 20–40 A, 500 kHz–1 MHz server and computing power stages.
Availability
IRL3714ZLPBF is available at Aetrix Electronics and suitable for server VRM phase legs, laptop CPU core regulators, and industrial PLC power modules requiring stable component supply and long-term manufacturing continuity.
Supply support for IRL3714ZLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and industrial control ICs, with global wafer fabs and packaging facilities.
The IRL37xxZ series targets high-efficiency, high-density DC/DC conversion in computing and communications infrastructure, emphasizing low-voltage logic-level drive, avalanche ruggedness, and thermal reliability in surface-mount packages.
FAQ
Is IRL3714ZLPBF suitable for 3.3 V gate drive?
Yes. With a gate threshold voltage range of 1.65–2.55 V and guaranteed RDS(on) at 4.5 V, it switches fully on using 3.3 V logic with margin. At 3.3 V VGS, RDS(on) rises to ~21 mΩ (typ.), which remains acceptable for moderate-current applications below 15 A continuous.
What is the maximum recommended PCB copper area for the D2Pak drain pad?
Infineon recommends ≥400 mm² of 2 oz copper connected directly to the exposed drain tab via ≥6 thermal vias (0.3 mm diameter, 0.8 mm pitch). This achieves the specified RθJC = 4.3 °C/W and prevents localized hot spots above 20 W dissipation.
Does IRL3714ZLPBF require a gate resistor for stability?
Yes. A 5–10 Ω non-inductive resistor in series with the gate is required to damp high-frequency oscillation caused by gate-drain capacitance (Crss = 99 pF) interacting with PCB trace inductance. Omitting it risks erratic switching and accelerated gate oxide wear under repetitive 1 MHz operation.
Can IRL3714ZLPBF replace IRL3714ZSPbF in TO-220AB package?
No. While electrically identical, the D2Pak (IRL3714ZLPBF) and TO-220AB (IRL3714ZSPbF) packages differ mechanically and thermally: D2Pak has lower RθJC (4.3 vs. 3.0 °C/W) but requires surface-mount reflow, whereas TO-220AB supports through-hole mounting and clip-on heatsinks. Substitution requires PCB redesign and thermal validation.
IRL3714ZLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 36A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 16mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.55V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 7.2 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 550 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 35W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-262
IRL3714ZLPBF FAQ
1.How can I place an order for IRL3714ZLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRL3714ZLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRL3714ZLPBF reliable?
The price and inventory of IRL3714ZLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL3714ZLPBF is usually 5 days.
3.What payment methods are accepted for IRL3714ZLPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL3714ZLPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRL3714ZLPBF?
IRL3714ZLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRL3714ZLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRL3714ZLPBF?
For technical support, including IRL3714ZLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL3714ZLPBF requirements.
6.How does Aetrix verify that IRL3714ZLPBF is sourced from the original manufacturer or authorized distributors?
All IRL3714ZLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL3714ZLPBF meets industry standards.
7.What is the process for return or replacement of IRL3714ZLPBF?
All IRL3714ZLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRL3714ZLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRL3714ZLPBF part is unused and in its original packaging.
Return procedure for IRL3714ZLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRL3714ZLPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

