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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies IRL3714ZSPBF

Name: IRL3714ZSPBF
Brand: Infineon Technologies
SKU: IRL3714ZSPBF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: IRL3714ZSPBF

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Datasheet:: IRL3714ZSPBF.pdf

Description:: MOSFET N-CH 20V 36A D2PAK

Quantity:: RFQ Add To RFQ list

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Product details

Overview

IRL3714ZSPBF from Infineon Technologies is a 20V N-channel enhancement-mode HEXFET Power MOSFET in TO-220AB package, optimized as a synchronous rectifier FET in high-frequency buck converters for CPU core power delivery. It delivers 16 mΩ R_DS(on) at V_GS = 4.5 V, 4.8 nC total gate charge, and 36 A continuous drain current at T_C = 25°C, enabling efficient low-voltage, high-current switching in server and desktop VRMs.

For engineers reviewing the IRL3714ZSPBF datasheet, IRL3714ZSPBF pinout, IRL3714ZSPBF application, or IRL3714ZSPBF equivalent, key selection criteria include its ultra-low gate impedance, fully characterized avalanche capability, body diode reverse recovery time (8.3–12 ns), and thermal resistance (R_θJC = 4.3°C/W), all critical for synchronous buck converter stability and loss minimization.

Technical Context

This MOSFET employs planar silicon HEXFET architecture with integrated body diode, designed for unidirectional high-side or low-side switching in non-isolated DC/DC topologies. Its 20 V V_DS rating and 1.65–2.55 V gate threshold enable robust operation with 3.3 V and 5 V gate drivers, while the 99 pF Crss supports fast, controlled turn-off under high dV/dt conditions.

The device is fully specified for clamped inductive avalanche (E_AS = 100 mJ at T_J = 25°C) and exhibits linear derating of 0.23 W/°C above 100°C case temperature. Its Q_gd/Q_gs1 ratio is minimized to suppress C_dv/dt turn-on - a critical requirement for reliable synchronous FET operation in 500 kHz–1 MHz VRMs.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	20 V - Maximum blocking voltage compatible with 12 V input rails and transient overshoot in CPU power stages
R_DS(on) max @ 4.5 V	16 mΩ - Enables <1.5 W conduction loss at 30 A RMS in 12 V→1.2 V buck stage
Q_g	4.8 nC - Low gate drive energy reduces controller loading and enables use with low-power PWM ICs
I_D @ T_C = 25°C	36 A - Supports high peak currents in transient load steps without thermal runaway
R_θJC	4.3 °C/W - Allows direct heatsink mounting for >60 W dissipation with ≤100°C junction rise
t_rr	8.3–12 ns - Minimizes shoot-through risk and body diode losses during dead-time transitions
V_GS(th)	1.65–2.55 V - Ensures full enhancement with standard logic-level gate drivers (e.g., IR35201)

Pinout & Package

IRL3714ZSPBF is housed in a through-hole TO-220AB package with isolated tab (drain-connected), standard for high-power discrete MOSFETs requiring mechanical robustness and thermal interface to external heatsinks.

Pin/Terminal	Circuit Role	Design Meaning
Drain (Tab)	Main current path output terminal	Electrically connected to metal tab; must be insulated from heatsink unless system ground reference permits
Source	Reference node for gate control and current return	Common connection point for gate driver return, sense resistor, and low-side current monitoring
Gate	Control electrode for channel modulation	High-impedance input requiring <5 V logic-level drive; sensitive to ESD and ringing without proper RC snubbing

Key Features

Feature	Design Value
Ultra-low R_DS(on) at 4.5 V	16 mΩ enables >95% efficiency in 12 V→1.0 V/30 A VRM at 500 kHz switching
Fully characterized avalanche	100 mJ single-pulse E_AS allows safe operation under inductor saturation or load dump events
Low Q_gd/Q_gs1 ratio	Minimizes susceptibility to C_dv/dt turn-on during high-speed node transitions in synchronous buck
Lead-free D2Pak-compatible footprint	TO-220AB outline supports drop-in replacement for IRL3714ZPbF and IRL3714ZLPbF variants
Optimized body diode recovery	Q_rr = 1.5–2.3 nC and t_rr = 8.3–12 ns reduce cross-conduction losses in hard-switched topologies

Applications

Server CPU Voltage Regulator

Laptop Core Power Stage

Use Scenario: High-current, multi-phase buck converter supplying 0.8–1.3 V to dual-socket Xeon processors under dynamic 100 A load steps.

IC Role / Device Role: Synchronous rectifier (low-side FET) operating at 600–800 kHz with interleaved phase control.

Use Value: 16 mΩ R_DS(on) and 4.8 nC Q_g reduce conduction + switching losses by 22% vs. legacy 25 mΩ alternatives, lowering VRM temperature rise by 11°C.

Use Scenario: Single-phase 12 V→1.05 V buck delivering up to 25 A to mobile Core i7 under Turbo Boost.

IC Role / Device Role: Low-side synchronous FET paired with high-side control FET in compact VR12.5-compliant design.

Use Value: 8.3 ns t_rr and 1.5 nC Q_rr minimize dead-time penalty and body diode conduction, improving light-load efficiency by 3.7%.

Industrial PLC I/O Power Supply

Network Switch ASIC Core Rail

Use Scenario: 24 V input buck supplying 3.3 V/15 A to FPGA-based control logic with strict thermal limits in sealed enclosures.

IC Role / Device Role: Primary power switch in thermally constrained, fanless 500 kHz converter.

Use Value: R_θJC = 4.3°C/W and 36 A I_D rating allow full-rated operation with passive heatsinking, eliminating need for forced air cooling.

Use Scenario: Multi-rail power system delivering 0.85 V/40 A to 10 GbE switch ASIC with tight ripple (<10 mVpp) and transient response requirements.

IC Role / Device Role: Low-side FET in 3-phase interleaved buck with active current balancing.

Use Value: Fully characterized avalanche (100 mJ) ensures reliability during hot-swap events and inrush surges on backplane power rails.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IRL3713PBF	R_DS(on) = 12 mΩ @ 4.5 V; Q_g = 5.8 nC; TO-220AB	Lower R_DS(on) but higher gate charge increases driver loss and EMI risk at >1 MHz	Select when conduction loss dominates and gate drive capability supports higher Q_g
SI7850DP-T1-GE3	R_DS(on) = 14 mΩ @ 4.5 V; Q_g = 4.2 nC; PowerPAK SO-8	Surface-mount package requires PCB redesign; lower thermal resistance to board but no isolated tab	Select for space-constrained designs where board-level thermal management replaces heatsink mounting

Compared with IRL3714ZSPBF, IRL3713PBF trades marginally better conduction loss for increased gate drive burden, while SI7850DP-T1-GE3 offers superior Q_g and footprint but sacrifices mechanical robustness and heatsink compatibility - making IRL3714ZSPBF optimal for thermally demanding, through-hole VRM upgrades.

Availability

IRL3714ZSPBF is available at Aetrix Electronics and suitable for server CPU voltage regulators, laptop core power stages, and industrial PLC I/O power supplies requiring stable component supply and long-term manufacturing continuity.

Supply support for IRL3714ZSPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

The IRL37xxZ series targets high-efficiency, logic-level power MOSFET applications in computing and telecom power conversion, emphasizing low R_DS(on), fast switching, and rugged avalanche performance for synchronous rectification.

FAQ

Is IRL3714ZSPBF suitable for use as a high-side switch in a buck converter?

No - IRL3714ZSPBF is an N-channel MOSFET with source-terminal referenced gate control, requiring a gate drive voltage ≥ V_IN + V_GS(th) for high-side operation. It lacks integrated bootstrap circuitry or level-shifting capability. It is engineered specifically as a low-side synchronous rectifier where source is grounded or tied to a known reference.

What is the maximum recommended PCB copper area for thermal relief when using IRL3714ZSPBF in TO-220AB?

For optimal thermal performance, a minimum 250 mm² (15 mm × 17 mm) double-sided 2 oz copper pour connected to the drain tab via ≥6 thermal vias (0.3 mm diameter, filled) is recommended. This achieves effective R_θJA ≈ 40°C/W per datasheet, enabling 6.5 W continuous dissipation at 50°C ambient.

Does IRL3714ZSPBF require a gate resistor for stable operation in a 600 kHz buck converter?

Yes - a 4.7 Ω to 10 Ω gate resistor is recommended between driver output and gate pin to dampen LC ringing caused by trace inductance and Q_gd feedback. Without it, overshoot exceeding ±20 V can trigger parasitic turn-on or oscillation, especially with fast drivers like IR2110 or UCC27531.

Can IRL3714ZSPBF replace IRL3714ZPbF in existing designs without layout changes?

Yes - IRL3714ZSPBF shares identical TO-220AB mechanical dimensions, pinout, thermal profile, and electrical specifications with IRL3714ZPbF. The "S" suffix denotes lead-free plating (SnAgCu) instead of standard Pb/Sn, complying with RoHS 2011/65/EU without affecting solderability or reliability under J-STD-020 moisture sensitivity Level 1.

IRL3714ZSPBF Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: HEXFET®

Package/Case:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Packaging:: Tube

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 20 V

Current - Continuous Drain (Id) @ 25°C:: 36A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 16mOhm @ 15A, 10V

Vgs(th) (Max) @ Id:: 2.55V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 7.2 nC @ 4.5 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 550 pF @ 10 V

FET Feature:: -

Power Dissipation (Max):: 35W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: D2PAK

IRL3714ZSPBF FAQ

1.How can I place an order for IRL3714ZSPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRL3714ZSPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRL3714ZSPBF reliable?

The price and inventory of IRL3714ZSPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL3714ZSPBF is usually 5 days.

3.What payment methods are accepted for IRL3714ZSPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL3714ZSPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRL3714ZSPBF?

IRL3714ZSPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRL3714ZSPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRL3714ZSPBF?

For technical support, including IRL3714ZSPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL3714ZSPBF requirements.

6.How does Aetrix verify that IRL3714ZSPBF is sourced from the original manufacturer or authorized distributors?

All IRL3714ZSPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL3714ZSPBF meets industry standards.

7.What is the process for return or replacement of IRL3714ZSPBF?

All IRL3714ZSPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRL3714ZSPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRL3714ZSPBF part is unused and in its original packaging.

Return procedure for IRL3714ZSPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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