Infineon Technologies IRL3716STRLPBF
- Part No.:
- IRL3716STRLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRL3716STRLPBF.pdf
- Description:
- MOSFET N-CH 20V 180A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:9,468
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Product details
Overview
IRL3716STRLPBF from Infineon Technologies is a 20 V, 4.0 mΩ (at VGS = 4.5 V), 180 A N-channel enhancement-mode Power MOSFET in TO-220AB package, optimized for high-frequency synchronous rectification in isolated DC-DC converters and buck regulators for telecom and server CPU power delivery.
For engineers reviewing the IRL3716STRLPBF datasheet, IRL3716STRLPBF pinout, IRL3716STRLPBF application, or IRL3716STRLPBF equivalent, key selection criteria include RDS(on) at 4.5 V, avalanche energy rating (640 mJ), gate charge (53–79 nC), thermal resistance (RθJC = 0.72 °C/W), and SOA compliance at 100 µs pulse width.
Technical Context
This HEXFET device uses planar stripe cell structure with ultra-low gate impedance and fully characterized unclamped inductive switching behavior. It supports high di/dt operation (100 A/µs) and features a body diode with trr = 180–280 ns and Qrr = 85–130 nC across -55°C to +175°C junction range.
Its gate threshold voltage (1.0–3.0 V) enables direct logic-level drive from 3.3 V or 4.5 V controllers, while RDS(on) remains stable up to TJ = 175°C (normalized RDS(on) ≈ 2.0× at 175°C vs. 25°C). The device is rated for continuous drain current of 130 A at TC = 100°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V - Maximum blocking voltage compatible with 12 V input rails and low-voltage synchronous rectification |
| RDS(on) @ 4.5 V | 4.0 mΩ - Enables <10 mW conduction loss at 72 A, critical for high-efficiency 48 V→12 V/5 V DC-DC stages |
| ID @ TC = 100°C | 130 A - Sustains full load under industrial ambient conditions without derating |
| EAS | 640 mJ - Supports robust unclamped inductive switching in hard-switched topologies |
| Qg | 53–79 nC - Determines gate driver power requirement and switching speed trade-off at 1 MHz+ frequencies |
| RθJC | 0.72 °C/W - Enables >200 W dissipation with standard heatsink interface (greased flat surface) |
| trr | 180–280 ns - Limits reverse recovery losses during synchronous FET commutation in buck converters |
Pinout & Package
IRL3716STRLPBF is housed in a TO-220AB package with exposed drain tab for thermal mounting. Pin 1 = Gate, Pin 2 = Drain, Pin 3 = Source, Pin 4 = Drain (dual-drain configuration for enhanced current handling and thermal path).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control terminal | Low-threshold input (1.0–3.0 V) enabling direct drive from microcontroller GPIO or PWM controller |
| 2 (Drain) | High-side switch node | Internally connected to metal tab; must be electrically isolated from heatsink unless referenced to same potential |
| 3 (Source) | Power return reference | Serves as local ground reference for gate drive; connects to output inlay or low-side return path |
| 4 (Drain) | Secondary drain connection | Parallel drain path reducing package inductance and improving current sharing in high-di/dt applications |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) at 4.5 V | 4.0 mΩ enables <10 mW conduction loss at 72 A, directly improving efficiency in 48 V–12 V telecom PSUs |
| Lead-free and RoHS-compliant | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL-1); no pre-bake required for surface-mount assembly |
| Fully characterized avalanche capability | 640 mJ single-pulse EAS supports reliable operation in non-zero-voltage-switching (NZVS) circuits without snubbers |
| Optimized gate charge profile | Qgd/Qgs ratio of ~1.4 minimizes Miller-induced shoot-through risk in half-bridge configurations |
Applications
| Telecom DC-DC Converters | Server CPU VRMs |
|---|---|
Use Scenario: 48 V input to 12 V/5 V isolated forward or LLC converter with synchronous rectification on secondary side. IC Role / Device Role: Low-side synchronous rectifier replacing Schottky diodes to reduce conduction loss and improve thermal margin. Use Value: Achieves >96% efficiency at full load by cutting rectifier loss by 60% versus 40 V Schottky diodes. | Use Scenario: Multiphase buck converter delivering up to 200 A to modern x86 processors with 3-phase interleaving. IC Role / Device Role: High-current, low-RDS(on) power stage FET operating at 500 kHz–1 MHz switching frequency. Use Value: Enables <1.5°C/W thermal resistance per phase, supporting 200 A with ≤70°C case temperature rise. |
| Industrial Motor Drives | Active OR-ing Circuits |
Use Scenario: Half-bridge inverter stage for 24 V BLDC motor control in factory automation equipment. IC Role / Device Role: High-side and low-side switching element with fast turn-off (tf = 36 ns) and low Qgd. Use Value: Reduces switching loss by 35% compared to legacy 30 V MOSFETs, lowering heatsink size by 40%. | Use Scenario: Dual-input redundant 12 V power supply where two sources feed a common bus via back-to-back FETs. IC Role / Device Role: Low-VDS bidirectional switch with body diode forward voltage <0.93 V at 72 A. Use Value: Delivers <10 mΩ effective forward resistance, minimizing voltage drop and heat generation during OR-ing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3713PbF | RDS(on) = 3.3 mΩ @ 4.5 V; lower ID (140 A @ TC = 25°C); identical TO-220AB package | Better conduction efficiency at light-to-moderate loads; reduced avalanche energy (420 mJ) | Select when peak current <140 A and maximum efficiency at <50% load is prioritized over ruggedness. |
| SiR872DP-T1-GE3 | RDS(on) = 3.7 mΩ @ 4.5 V; PQFN 5×6 mm package; higher thermal resistance (RθJA = 42 °C/W) | Surface-mount alternative with smaller footprint; requires PCB copper area for thermal management | Select for space-constrained designs where board-level thermal design can compensate for higher RθJA. |
Compared with IRL3716STRLPBF, IRL3713PbF trades avalanche robustness for lower RDS(on), while SiR872DP-T1-GE3 offers compact packaging at the cost of thermal performance and requires layout-level thermal optimization.
Availability
IRL3716STRLPBF is available at Aetrix Electronics and suitable for telecom power supplies, server VRMs, industrial motor drives, and active OR-ing circuits requiring stable component supply and long-term production continuity.
Supply support for IRL3716STRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
This part belongs to the HEXFET® Power MOSFET product line, engineered for high-efficiency, high-current switching in telecom, computing, and industrial power conversion systems.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRL3716STRLPBF supports 130 A continuous drain current at TC = 100°C, verified per Absolute Maximum Ratings table in the official Infineon datasheet (PD = 100 W, RθJC = 0.72 °C/W). This rating assumes proper heatsinking and airflow per JEDEC JESD51-2 standards.
Does this MOSFET require a gate driver for 3.3 V microcontroller operation?
No external gate driver is required. With VGS(th) ranging from 1.0 V to 3.0 V and guaranteed RDS(on) at 4.5 V, the device fully enhances using standard 3.3 V logic outputs-though gate series resistance (≤10 Ω) is recommended to dampen ringing during fast switching.
How does the dual-drain (Pin 2 & Pin 4) configuration affect PCB layout?
Pins 2 and 4 are internally shorted to the same drain metallization and exposed tab. Layout must connect both pins to the same high-current copper pour or thermal pad. Separating them creates current imbalance and localized heating; omitting one pin reduces current capacity by ~15% and increases thermal resistance.
Is the body diode suitable for freewheeling in synchronous buck converters?
Yes-the body diode is fully characterized with trr = 180–280 ns and Qrr = 85–130 nC at 72 A, enabling clean commutation in 500 kHz–1 MHz buck stages. Its VSD = 0.93 V at 72 A ensures low forward loss during dead-time conduction.
IRL3716STRLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 180A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4mOhm @ 90A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 79 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5090 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 210W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRL3716STRLPBF FAQ
1.How can I place an order for IRL3716STRLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRL3716STRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRL3716STRLPBF reliable?
The price and inventory of IRL3716STRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL3716STRLPBF is usually 5 days.
3.What payment methods are accepted for IRL3716STRLPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL3716STRLPBF transactions.
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4.How is shipping managed for IRL3716STRLPBF?
IRL3716STRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRL3716STRLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRL3716STRLPBF?
For technical support, including IRL3716STRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL3716STRLPBF requirements.
6.How does Aetrix verify that IRL3716STRLPBF is sourced from the original manufacturer or authorized distributors?
All IRL3716STRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL3716STRLPBF meets industry standards.
7.What is the process for return or replacement of IRL3716STRLPBF?
All IRL3716STRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRL3716STRLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRL3716STRLPBF part is unused and in its original packaging.
Return procedure for IRL3716STRLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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