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Infineon Technologies IRL40S212

Part No.:
IRL40S212
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIRL40S212.pdf
Description:
MOSFET N-CH 40V 195A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,715

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Product details

Overview

IRL40S212 from Infineon Technologies (formerly International Rectifier) is a 40 V, logic-level N-channel HEXFET® Power MOSFET in D2-Pak (TO-263) package, optimized for high-current synchronous rectification and motor drive applications. It delivers 1.5 mΩ typical RDS(on) at VGS = 10 V, supports 195 A continuous drain current (package-limited), and features enhanced body diode dV/dt and dI/dt capability for robust BLDC and brushed motor control in battery-powered systems.

For engineers reviewing the IRL40S212 datasheet, IRL40S212 pinout, IRL40S212 application, or IRL40S212 equivalent, key selection criteria include its 40 V VDS, 1.5 mΩ RDS(on) at 10 V gate drive, 195 A package-limited current, avalanche energy rating of 790 mJ (EAS), and D2-Pak thermal performance with RθJC = 0.65 °C/W - critical for high-efficiency DC/DC converters and half-bridge topologies.

Technical Context

This MOSFET employs planar silicon technology with optimized cell layout to achieve ultra-low on-resistance while maintaining strong avalanche ruggedness (EAS = 790 mJ) and dynamic dV/dt immunity. Its gate threshold voltage (1.0–2.4 V) enables direct interfacing with 3.3 V and 5 V logic controllers without level-shifting.

The device integrates a fast, soft-recovery body diode (trr = 32 ns at 125°C, Qrr = 28 nC) and exhibits low Crss (790 pF) and Coss eff.(TR) = 1580 pF, supporting high-frequency switching in resonant-mode power supplies and OR-ing applications up to 200 kHz.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V - Maximum blocking voltage compatible with 24 V and 36 V battery systems and 48 V industrial rails.
RDS(on) typ. 1.5 mΩ @ VGS = 10 V, ID = 100 A - Enables <1.5 W conduction loss at 100 A, reducing heatsink requirements.
ID (Package) 195 A @ TC = 25°C - Determined by wire-bond and leadframe limits; defines practical PCB-mount current capacity.
EAS 790 mJ - Single-pulse avalanche energy at L = 1 mH, IAS = 40 A, enabling unclamped inductive switching safety margin.
Qg 91 nC typ. - Total gate charge supporting efficient gate driver sizing for <100 ns turn-on/turn-off in half-bridge configurations.
trr 32 ns @ TJ = 125°C - Body diode reverse recovery time enabling ZVS operation and minimizing commutation loss in synchronous rectifiers.
RθJC 0.65 °C/W - Junction-to-case thermal resistance confirming suitability for direct heatsink mounting in high-power density designs.

Pinout & Package

IRL40S212 uses the D2-Pak (TO-263) surface-mount package with exposed drain pad for thermal and electrical connection. The package has three terminals: Gate (G), Drain (D), and Source (S), arranged in standard G-D-S order when viewed from top with marking side up and tab facing away.

Pin/Terminal Circuit Role Design Meaning
G Gate Control terminal accepting logic-level input (3.3 V/5 V compatible); requires ≤91 nC charge for full enhancement.
D Drain Main high-side power terminal; electrically and thermally connected to exposed copper pad - must be soldered to PCB copper pour or heatsink.
S Source Power return path and reference for gate drive; forms common node with gate driver ground in low-side configurations.

Key Features

Feature Design Value
Logic-level gate drive Operates fully enhanced at VGS ≥ 4.5 V - eliminates need for gate driver boost stages in 5 V microcontroller-based motor controllers.
Enhanced body diode dV/dt immunity Rated to 6.0 V/ns at TJ = 175°C - prevents false turn-on during high-speed switching in bridge legs.
Low Crss / high Qgd/Qg ratio Crss = 790 pF, Qgd = 46 nC - improves Miller immunity and enables stable operation in hard-switched full-bridge inverters.
Lead-free & RoHS-compliant Halogen-free construction with Pb-free terminations - meets IPC-J-STD-020 moisture sensitivity level 3 (MSL3) for standard reflow assembly.
Characterized avalanche SOA Single-pulse EAS = 790 mJ and repetitive EAR validated - supports reliable operation in unclamped inductive load switching without snubbers.

Applications

Brushed DC Motor Drive BLDC Motor Inverter Stage

Use Scenario: High-current H-bridge for cordless power tools operating from 18–36 V Li-ion packs.

IC Role / Device Role / Timing Role: Low-side switch in dual-phase half-bridge configuration, handling peak currents >150 A during stall conditions.

Use Value: 1.5 mΩ RDS(on) minimizes I²R heating during PWM-driven stall, extending tool runtime and preventing thermal shutdown.

Use Scenario: Upper-leg switch in 3-phase BLDC inverter for e-bike controller with field-oriented control (FOC).

IC Role / Device Role / Timing Role: High-side synchronous rectifier in active freewheeling mode, requiring fast body diode recovery and low Qrr.

Use Value: 32 ns trr and 28 nC Qrr at 125°C reduce switching losses by >35% vs. standard MOSFETs, improving inverter efficiency at 15 kHz PWM.

OR-ing Power Supply Resonant LLC Secondary Rectifier

Use Scenario: Redundant 48 V DC power distribution in telecom shelf with hot-swap capability.

IC Role / Device Role / Timing Role: Back-to-back configured MOSFET acting as ideal diode, replacing Schottky with lower forward drop.

Use Value: 1.2 V VSD at 100 A and 25°C enables <1.2 W conduction loss per device - 60% lower than 40 V Schottky alternatives.

Use Scenario: Synchronous rectification in secondary side of 300 W LLC resonant converter for server PSU.

IC Role / Device Role / Timing Role: Zero-voltage-switched (ZVS) rectifier operating at 300–500 kHz with adaptive gate timing.

Use Value: Low Coss eff.(TR) = 1580 pF and 790 mJ EAS ensure reliable ZVS across load range and withstand transient overvoltage during light-load resonance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current logic-level N-channel MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRF1404PbF 40 V, 200 A, RDS(on) = 2.7 mΩ @ 10 V, TO-220AB package, RθJC = 0.75 °C/W Higher RDS(on) and thermal resistance; limited to lower-frequency, air-cooled applications Select when cost-sensitive, through-hole assembly required, and 2.7 mΩ conduction loss is acceptable.
STL220N4F7AG 40 V, 220 A, RDS(on) = 1.35 mΩ @ 10 V, PowerFLAT™ 8x8 package, RθJC = 0.55 °C/W Lower RDS(on) and better thermal performance but no integrated avalanche rating (EAS not specified) Select for highest efficiency in space-constrained, forced-air-cooled DC/DC where avalanche stress is mitigated externally.

Compared with IRL40S212, IRF1404PbF trades 80% higher conduction loss for lower cost and through-hole compatibility, while STL220N4F7AG offers superior RDS(on) and thermal metrics but lacks documented avalanche ruggedness - making IRL40S212 the preferred choice for unclamped inductive switching in motor drives and OR-ing.

Availability

IRL40S212 is available at Aetrix Electronics and suitable for brushed motor drives, BLDC inverters, and synchronous rectifier applications requiring stable component supply across automotive-grade temperature ranges and high-volume production cycles.

Supply support for IRL40S212 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with deep expertise in silicon-based power devices and system-level solutions.

This part belongs to the StrongIRFET™ family of logic-level HEXFET® MOSFETs, engineered specifically for high-current, high-efficiency switching in battery-powered motor control and power conversion systems.

FAQ

What is the maximum continuous drain current for IRL40S212 under real-world PCB mounting?

The package-limited continuous drain current is 195 A at TC = 25°C, assuming direct heatsink mounting with greased interface (RθCS = 0.50 °C/W). On a 1-inch-square FR-4 PCB, derating applies: at TA = 70°C, usable current drops to ~65 A due to RθJA = 40 °C/W. Thermal design must account for both junction-to-case and case-to-heatsink paths.

Can IRL40S212 be driven directly from a 3.3 V microcontroller GPIO?

Yes - its gate threshold voltage (VGS(th)) ranges from 1.0 V to 2.4 V, and it achieves 1.9 mΩ RDS(on) at VGS = 4.5 V. At 3.3 V, RDS(on) rises to ~3.2 mΩ (extrapolated from Fig 1), delivering ~120 A with acceptable loss in pulsed operation. For continuous 195 A, 4.5 V or higher gate drive is recommended.

How does the body diode performance compare to discrete Schottky diodes in synchronous rectification?

The integrated body diode provides VSD = 1.2 V at 100 A and 25°C - higher forward drop than a 40 V Schottky (~0.55 V), but with superior reverse recovery (trr = 32 ns, Qrr = 28 nC) and dV/dt immunity (6.0 V/ns). In ZVS circuits, its soft recovery reduces EMI and eliminates need for external snubbers, offsetting the VF penalty.

Is IRL40S212 suitable for paralleling multiple devices to increase current capacity?

Yes - its positive temperature coefficient of RDS(on) (Fig 6 shows 1.8× increase from 25°C to 175°C) ensures inherent current sharing. Parallel operation requires matched gate drive impedance, symmetrical PCB layout, and shared source inductance <10 nH. Derate total current by 15% for thermal coupling effects in dense layouts.

IRL40S212 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
StrongIRFET™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
195A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
1.9mOhm @ 100A, 10V
Vgs(th) (Max) @ Id:
2.4V @ 150µA
Gate Charge (Qg) (Max) @ Vgs:
137 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
8320 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
231W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3

IRL40S212 FAQ

1.How can I place an order for IRL40S212 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRL40S212 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRL40S212 reliable?

The price and inventory of IRL40S212 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL40S212 is usually 5 days.

3.What payment methods are accepted for IRL40S212?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL40S212 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRL40S212?

IRL40S212 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRL40S212 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRL40S212?

For technical support, including IRL40S212 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL40S212 requirements.

6.How does Aetrix verify that IRL40S212 is sourced from the original manufacturer or authorized distributors?

All IRL40S212 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL40S212 meets industry standards.

7.What is the process for return or replacement of IRL40S212?

All IRL40S212 units undergo pre-shipment inspection (PSI). If there is an issue with IRL40S212, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRL40S212 part is unused and in its original packaging.

Return procedure for IRL40S212:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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