Infineon Technologies IRL8113S
- Part No.:
- IRL8113S
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRL8113S.pdf
- Description:
- MOSFET N-CH 30V 105A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:4,099
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Product details
Overview
IRL8113S from Infineon Technologies is a 30V, 74A N-channel enhancement-mode HEXFET Power MOSFET in D2Pak (TO-263) package, optimized for high-frequency synchronous buck converters in CPU core power supplies. It delivers 4.8 mΩ RDS(on) at VGS = 4.5V, 23 nC total gate charge, and fully characterized avalanche capability up to 1000 mJ.
For engineers reviewing the IRL8113S datasheet, IRL8113S pinout, IRL8113S application, or IRL8113S equivalent, key selection criteria include low 4.5V drive compatibility, tight RDS(on) temperature stability, body diode reverse recovery charge (Qrr = 7.2–11 nC), and junction-to-case thermal resistance of 1.32°C/W - all critical for high-efficiency, high-density VRM designs.
Technical Context
This MOSFET employs planar silicon process with optimized cell pitch and trench-assisted charge balancing to achieve low on-resistance while maintaining robust unclamped inductive switching (UIS) performance. Its gate threshold voltage (VGS(th) = 1.35–2.25 V) enables direct logic-level drive from PWM controllers such as Intel VR12/VR13 compliant ICs.
The device integrates a co-packaged, low-Qrr body diode (trr = 18–27 ns, Qrr = 7.2–11 nC) with soft recovery characteristics, minimizing shoot-through risk in synchronous rectification. Thermal design is supported by validated transient impedance data (ZthJC) and linear derating factor of 0.76 W/°C above 100°C case temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage compatible with 5V and 12V input rails in point-of-load converters |
| RDS(on) max @ 4.5V | 6.0 mΩ - Enables <1W conduction loss at 40A RMS in CPU power stages |
| Qg typ | 23 nC - Reduces gate drive power and allows use of low-current drivers (e.g., IR35201) |
| ID @ TC = 100°C | 74 A - Sustains full load current under sustained thermal stress in compact heatsink layouts |
| EAS | 1000 mJ - Withstands single-pulse inductive energy during startup/fault without failure |
| RθJC | 1.32 °C/W - Enables precise junction temperature estimation using case sensor feedback |
| Qrr | 7.2–11 nC - Limits cross-conduction losses and EMI generation during dead-time transitions |
Pinout & Package
IRL8113S uses the surface-mount D2Pak (TO-263) package with exposed drain pad for thermal and electrical connection. The package features 3 leads: Gate (G), Drain (D), Source (S), with Drain electrically and thermally connected to the large copper tab.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G | Gate control terminal | Accepts 0–20V logic-level signals; low input capacitance (Ciss = 2840 pF) reduces driver loading |
| D | Drain (high-side switch node) | Connected to PCB copper pour for heat dissipation; handles full input voltage swing (0–30V) |
| S | Source (power ground reference) | Provides return path for load current; ties to source of synchronous FET in buck topology |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Guaranteed turn-on at VGS = 4.5V supports direct interface with 5V-tolerant PWM controllers |
| Low Qgd/Qgs1 ratio | Qgd = 8.3 nC, Qgs1 = 6.0 nC - Minimizes Cdv/dt induced turn-on risk in high-dV/dt synchronous nodes |
| Enhanced avalanche ruggedness | Rated for 1000 mJ single-pulse energy - eliminates need for external snubbers in VRM applications |
| Thermally optimized D2Pak | RθJC = 1.32°C/W - Enables >70% higher power density vs. TO-220 equivalents at same footprint |
| Lead-free and RoHS-compliant | Pb-free plating and halogen-free molding compound - meets IPC-J-STD-020 moisture sensitivity level 3 |
Applications
| Server VRM Core Power Stage | Laptop CPU Voltage Regulator |
|---|---|
Use Scenario: High-current, multi-phase buck converter supplying Intel Xeon or AMD EPYC processors with dynamic load steps up to 300A/µs. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in 3+1 or 4+1 phase topology, switching at 300–600 kHz with 50–100 ns dead time. Use Value: 4.8 mΩ RDS(on) at 4.5V ensures <0.8W conduction loss per phase at 42A DC, directly improving system efficiency and reducing heatsink mass. | Use Scenario: Compact dual-phase VRM powering mobile Core i7/i9 CPUs in ultrabooks with strict height and thermal constraints. IC Role / Device Role / Timing Role: High-current power switch operating in continuous conduction mode (CCM) with adaptive phase shedding. Use Value: D2Pak thermal performance (RθJC = 1.32°C/W) enables 100% duty cycle operation at 65A without derating, supporting burst-mode efficiency targets. |
| GPU Power Delivery Module | Industrial FPGA Core Supply |
Use Scenario: Single-phase or interleaved buck supplying NVIDIA A100 or AMD MI250X GPU cores with peak currents exceeding 500A. IC Role / Device Role / Timing Role: Parallel-connected low-side switch in modular power stage, driven by digital multiphase controller (e.g., MP2965). Use Value: Fully characterized avalanche rating (EAS = 1000 mJ) prevents failure during GPU workload transients that induce high di/dt-induced voltage spikes. | Use Scenario: Reliable 30A core supply for Xilinx Versal or Intel Agilex FPGAs in industrial PLCs requiring 10+ year lifecycle support. IC Role / Device Role / Timing Role: Primary power switch in isolated or non-isolated buck regulator with extended temperature range (-40°C to +125°C ambient). Use Value: Stable RDS(on) over temperature (±15% from -40°C to +175°C) ensures consistent regulation accuracy across wide environmental conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL8113PbF (TO-220AB) | Same die, but TO-220AB package; RθJA = 62°C/W (vs. 40°C/W for D2Pak PCB mount); no exposed drain pad | Lower power density; requires mechanical mounting hardware and larger heatsink area | Select when through-hole assembly or legacy board layout mandates TO-220 footprint |
| IRL8113LPbF (TO-262) | Same die, TO-262 (I²PAK) package; RθJC = 1.32°C/W identical, but leadframe thermal path differs slightly | Compatible with wave-soldered industrial boards; less common in high-volume computing applications | Select when automated optical inspection (AOI) compatibility or reflow-only process is required without thermal pad soldering |
Compared with IRL8113PbF and IRL8113LPbF, the IRL8113S offers superior thermal performance in surface-mount high-density designs due to its D2Pak's direct-drain thermal pad, enabling 25% higher current handling at equal case temperature - a decisive advantage in space-constrained VRMs.
Availability
IRL8113S is available at Aetrix Electronics and suitable for server VRM core power stages, laptop CPU voltage regulators, and GPU power delivery modules requiring stable component supply and long-term industrial availability.
Supply support for IRL8113S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The IRL8113S belongs to Infineon's HEXFET® logic-level Power MOSFET product line, engineered specifically for high-efficiency, high-frequency DC/DC conversion in computing and communications infrastructure where low gate drive voltage and avalanche robustness are mandatory.
FAQ
What is the maximum continuous drain current for IRL8113S at 100°C case temperature?
The IRL8113S supports 74 A continuous drain current at TC = 100°C with VGS = 10 V, as specified in the Absolute Maximum Ratings table. This value assumes proper PCB copper area (≥10 cm² 2 oz Cu) and thermal interface to heatsink. Derating begins linearly at 0.76 W/°C above 100°C case temperature.
Does IRL8113S require a gate resistor for safe operation in 500 kHz synchronous buck converters?
Yes - a 2.2–4.7 Ω gate resistor is recommended to damp ringing and limit peak gate current during 500 kHz switching. The device's Qg = 23 nC and Ciss = 2840 pF interact with driver output impedance; omitting the resistor risks overshoot (>20 V), increased EMI, and accelerated gate oxide wear under repeated fast transitions.
Can IRL8113S be used as a high-side switch in a floating-gate configuration?
No - the IRL8113S is a standard-level N-channel MOSFET without integrated bootstrap diode or level-shifting circuitry. For high-side operation, it requires an external gate driver with floating supply (e.g., IR2110) and bootstrap capacitor. Its VGS rating of ±20 V limits gate drive headroom in high-VIN applications.
How does the body diode's reverse recovery charge affect synchronous buck efficiency?
The IRL8113S body diode exhibits Qrr = 7.2–11 nC, which directly contributes to switching losses during dead-time conduction. In a 40A, 300 kHz buck converter, this adds ~0.35 W of recoverable loss per phase - mitigated by selecting complementary high-side FETs with matched Qrr and optimizing dead-time to 50–75 ns based on measured trr.
IRL8113S Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 105A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6mOhm @ 21A, 10V
- Vgs(th) (Max) @ Id:
- 2.25V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 35 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2840 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 110W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRL8113S FAQ
1.How can I place an order for IRL8113S through Aetrix?
Please submit a Request for Quotation (RFQ) for IRL8113S on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRL8113S reliable?
The price and inventory of IRL8113S are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL8113S is usually 5 days.
3.What payment methods are accepted for IRL8113S?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL8113S transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRL8113S?
IRL8113S orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRL8113S order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRL8113S?
For technical support, including IRL8113S datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL8113S requirements.
6.How does Aetrix verify that IRL8113S is sourced from the original manufacturer or authorized distributors?
All IRL8113S products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL8113S meets industry standards.
7.What is the process for return or replacement of IRL8113S?
All IRL8113S units undergo pre-shipment inspection (PSI). If there is an issue with IRL8113S, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRL8113S part is unused and in its original packaging.
Return procedure for IRL8113S:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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