Infineon Technologies IRLH6224TR2PBF
- Part No.:
- IRLH6224TR2PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
IRLH6224TR2PBF.pdf
- Description:
- MOSFET N CH 20V 28A PQFN 5X6 MM
- Quantity:
- Payment:

- Shipping:

Inventory:5,333
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Product details
Overview
IRLH6224TR2PBF from Infineon Technologies is a 20 V, 80 A N-channel HEXFET Power MOSFET in PQFN 5×6 mm package, featuring RDS(on) of 2.3 mΩ @ VGS = 10 V and 3.0 mΩ @ VGS = 4.5 V, with 44 nC total gate charge and 2.4°C/W junction-to-case (bottom) thermal resistance. It serves as a high-current, low-voltage synchronous rectifier or battery protection switch in compact DC-DC converters.
For engineers reviewing the IRLH6224TR2PBF datasheet, IRLH6224TR2PBF pinout, IRLH6224TR2PBF application, or IRLH6224TR2PBF equivalent, key selection criteria include its 2.3 mΩ on-resistance at 10 V gate drive, 80 A continuous drain current at TC(bottom) = 25°C, PQFN 5×6 mm footprint with exposed thermal pad, and industry-standard pinout for multi-vendor compatibility in high-density power stages.
Technical Context
This device uses a trench-gated N-channel silicon MOSFET structure optimized for low RDS(on) and fast switching in 20 V systems. Its gate threshold voltage (0.5–1.1 V) enables robust operation with 2.5 V and 4.5 V logic-level drive, while the 44 nC Qg supports efficient PWM control at frequencies up to several hundred kHz.
Thermal performance is defined by a 2.4°C/W RθJC(bottom), enabling direct PCB copper thermal spreading, and a 35°C/W RθJA under standard JEDEC conditions. The integrated body diode exhibits 1.2 V forward drop at 20 A and 38–57 ns reverse recovery time, supporting synchronous rectification and bidirectional current handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V - Maximum blocking voltage for 12 V nominal bus applications with margin |
| RDS(on) @ VGS = 10 V | 2.3 mΩ - Enables <100 mW conduction loss at 20 A in high-efficiency buck converters |
| RDS(on) @ VGS = 4.5 V | 3.0 mΩ - Supports direct drive from 3.3 V/5 V controllers without level-shifting |
| Qg typ | 44 nC - Determines gate driver power requirement and switching loss at 500 kHz PWM |
| ID @ TC(bottom) = 25°C | 80 A - Continuous current rating when mounted on ≥100 mm² 2 oz Cu thermal pad |
| RθJC(bottom) | 2.4°C/W - Enables junction temperature rise of ≤24°C at 10 W dissipation with proper PCB layout |
| VGS max | ±12 V - Specifies safe gate oxide stress limit during transient events |
Pinout & Package
PQFN 5 mm × 6 mm, 8-lead, thermally enhanced package with exposed bottom thermal pad (pin 1 marked by quadrant identifier Q1 per tape reel spec). Industry-standard pinout supports drop-in replacement across multiple vendors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7 | Drain (internally connected) | All seven pins tied to internal drain metallization and exposed thermal pad - primary current path and thermal interface |
| 8 | Source | Low-side return path for load current; referenced to ground in high-side switch configurations |
| Gate | Control terminal | Exposed top-side pad (not numbered); requires controlled trace routing to minimize ringing and EMI |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) at 4.5 V | 3.0 mΩ - Enables use with 3.3 V microcontrollers and PMICs without gate boosting |
| Junction-to-case thermal resistance | 2.4°C/W (bottom) - Allows >75% of heat to transfer directly to PCB copper, reducing heatsink need |
| 100% Rg tested | 2.0 Ω typical gate resistance - Ensures consistent turn-on/turn-off timing and reduces gate oscillation risk |
| RoHS & halogen-free | No lead, bromide, or halogen - Complies with IPC-J-STD-609A Class 1 and EU RoHS Directive 2011/65/EU |
| MSL1 rating | Unlimited floor life at ≤30°C/60% RH - Eliminates bake requirements before reflow assembly |
Applications
| Battery Protection Circuit | High-Density DC-DC Converter |
|---|---|
Use Scenario: Overcurrent and short-circuit protection in 2S–3S Li-ion battery packs for portable medical devices. IC Role / Device Role / Timing Role: Low-side main switch controlling discharge path; responds within microseconds to fault signals from protection ICs. Use Value: 2.3 mΩ RDS(on) limits voltage drop to <50 mV at 20 A, preserving battery runtime and minimizing thermal stress during sustained faults. | Use Scenario: Synchronous rectifier in 12 V input, 1.2 V/60 A output multiphase buck converter for AI accelerator modules. IC Role / Device Role / Timing Role: High-current output stage switch operating at 400–600 kHz with precise dead-time control. Use Value: 44 nC Qg and 13 nC Qsw enable low gate drive loss and fast transitions, improving efficiency by 1.2% over comparable 3.5 mΩ MOSFETs. |
| USB-C PD Power Delivery | Industrial Motor Drive H-Bridge |
Use Scenario: Input power switch in 20 V USB-C PD 3.1 sink applications requiring 5 A continuous and 10 A peak current. IC Role / Device Role / Timing Role: Hot-swap FET managing inrush current and reverse polarity protection upstream of controller. Use Value: 1.1 V VGS(th) max ensures reliable turn-on with 3.3 V logic, while ±12 V VGS rating withstands transient coupling from CC lines. | Use Scenario: Low-side switch in 24 V brushed DC motor driver for factory automation actuators. IC Role / Device Role / Timing Role: PWM-controlled power switch delivering up to 40 A RMS with 100% duty cycle capability at TC = 70°C. Use Value: 80 A ID rating at TC(bottom) = 25°C and 67 A at TC = 100°C ensures headroom for surge currents without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLH6224PBF | Same die, tube packaging (no tape/reel); identical RDS(on), Qg, and thermal specs | Suitable for prototyping or low-volume manual assembly; lacks reel orientation marking | Select for lab evaluation where reel handling is unnecessary |
| SI7850DP-T1-GE3 | 20 V, 3.1 mΩ @ 4.5 V, 47 nC Qg, PowerPAK SO-8 package (larger footprint, higher RθJA) | Compatible with legacy SO-8 layouts but requires 30% more board area and delivers ~15% higher thermal resistance | Choose only if redesigning for PQFN is not feasible and thermal margin exists |
Compared with IRLH6224TR2PBF, the IRLH6224PBF offers identical electrical performance in non-reel form, while the SI7850DP-T1-GE3 trades 0.1 mΩ higher RDS(on) and 3 nC higher Qg for SO-8 compatibility-making the IRLH6224TR2PBF optimal for space-constrained, high-efficiency designs requiring PQFN thermal advantages.
Availability
IRLH6224TR2PBF is available at Aetrix Electronics and suitable for battery protection circuits, high-density DC-DC converters, and USB-C PD power delivery systems requiring stable component supply and long-term manufacturability.
Supply support for IRLH6224TR2PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
This part belongs to Infineon's HEXFET® Power MOSFET product line, engineered for high-current, low-voltage switching in space-constrained power conversion and battery management systems.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRLH6224TR2PBF supports 67 A continuous drain current when the bottom case temperature is maintained at 100°C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the PQFN package and requires adequate PCB copper area and airflow to sustain.
Does this MOSFET require a gate resistor for stability?
Yes-a gate resistor (typically 1.8–10 Ω) is recommended between driver and gate to dampen ringing caused by trace inductance and the device's 2.0 Ω intrinsic gate resistance. Layout best practices include minimizing loop area and using a dedicated ground plane beneath the gate trace.
Can the body diode be used for reverse current conduction in bidirectional applications?
Yes-the integrated body diode supports continuous source current up to 125 A (pulsed) and 40 A (continuous), with 1.2 V forward voltage at 20 A and 38–57 ns reverse recovery time. It is suitable for freewheeling in H-bridge motor drives but not for high-frequency synchronous rectification without external control.
Is the PQFN 5×6 mm package compatible with standard reflow profiles?
Yes-the IRLH6224TR2PBF meets MSL1 classification and is qualified for standard lead-free reflow profiles (peak 260°C, 20–40 sec above 217°C). Its 1.2 mm profile and exposed thermal pad require solder paste stencil design with 30–40% aperture reduction to prevent voiding and ensure mechanical reliability.
IRLH6224TR2PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Cut Tape (CT)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 28A (Ta), 105A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- 3mOhm @ 20A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.1V @ 50µA
- Gate Charge (Qg) (Max) @ Vgs:
- 86 nC @ 10 V
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- 3710 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-PQFN (5x6)
IRLH6224TR2PBF FAQ
1.How can I place an order for IRLH6224TR2PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRLH6224TR2PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRLH6224TR2PBF reliable?
The price and inventory of IRLH6224TR2PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLH6224TR2PBF is usually 5 days.
3.What payment methods are accepted for IRLH6224TR2PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLH6224TR2PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRLH6224TR2PBF?
IRLH6224TR2PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRLH6224TR2PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRLH6224TR2PBF?
For technical support, including IRLH6224TR2PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLH6224TR2PBF requirements.
6.How does Aetrix verify that IRLH6224TR2PBF is sourced from the original manufacturer or authorized distributors?
All IRLH6224TR2PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLH6224TR2PBF meets industry standards.
7.What is the process for return or replacement of IRLH6224TR2PBF?
All IRLH6224TR2PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLH6224TR2PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRLH6224TR2PBF part is unused and in its original packaging.
Return procedure for IRLH6224TR2PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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