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Infineon Technologies IRLL3303

Part No.:
IRLL3303
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-261-4, TO-261AA
Datasheet:
AetrixIRLL3303.pdf
Description:
MOSFET N-CH 30V 4.6A SOT223
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,006

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Product details

Overview

IRLL3303 from International Rectifier is a logic-level N-channel enhancement-mode Power MOSFET in SOT-223 package, rated for 30V VDSS, 4.6A continuous drain current at 25°C, and 0.031Ω RDS(on) at VGS = 10V. It delivers fast switching (tr = 22ns, tf = 28ns), high dv/dt immunity (1.3 V/ns), and robust unclamped inductive avalanche capability (140 mJ), making it suitable for DC-DC converters, load switches, and motor drive half-bridges.

For engineers reviewing the IRLL3303 datasheet, IRLL3303 pinout, IRLL3303 application, or IRLL3303 equivalent, key selection criteria include logic-level gate drive compatibility (VGS(th) = 1.0–2.5V), thermal resistance (RθJA = 93°C/W on FR-4), body diode recovery performance (trr = 65–98ns), and SO-223 package thermal derating (8.3 mW/°C).

Technical Context

This HEXFET device uses fifth-generation silicon processing to achieve ultra-low on-resistance per die area while maintaining ruggedness against repetitive avalanche stress (EAR = 0.10 mJ) and high dv/dt transients. Its gate charge profile (Qg = 34 nC typ.) supports efficient PWM operation at frequencies up to several hundred kHz.

The integrated body diode exhibits low forward voltage (VSD = 1.3V at IS = 4.6A) and controlled reverse recovery (Qrr = 160–240 nC), enabling reliable synchronous rectification and freewheeling in buck and H-bridge topologies without external Schottky supplementation.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum blocking voltage before avalanche; sets upper limit for input rail in 24V systems.
RDS(on)0.031 Ω @ VGS = 10V - Enables <150 mW conduction loss at 4.6A, critical for thermally constrained SMT designs.
ID (continuous)4.6 A @ TA = 25°C - Usable DC current on standard FR-4 with minimum footprint; derates to 3.7A at 70°C ambient.
Qg34 nC typ. - Determines gate driver power requirement and switching transition time in hard-switched applications.
tr/tf22 ns / 28 ns - Supports >500 kHz switching in non-resonant topologies with minimal overlap loss.
EAS140 mJ - Withstands single-pulse inductive energy spikes without failure, easing layout margin in relay/motor drive snubbing.
RθJA93 °C/W - Thermal resistance on FR-4 board defines maximum power dissipation (1.0 W) before junction exceeds 150°C.

Pinout & Package

SOT-223 (TO-261AA) surface-mount package with exposed drain tab for enhanced heatsinking. Thermal pad connects internally to Drain terminal; requires solder mask defined copper pour for optimal PCB thermal transfer.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Source terminal of N-channel MOSFETReference node for gate drive; connected to power ground or low-side return path.
Pin 2 (Gate)Control electrodeLogic-compatible input requiring ≥4.5V for full enhancement; low Qgs (4.4 nC) enables fast turn-on.
Pin 3 (Drain)High-side current pathInternally bonded to exposed metal tab; must be routed to high-current net and thermally coupled to PCB copper.
Pin 4 (Source)Second source connectionRedundant source bond for lower parasitic inductance and improved current sharing in parallel configurations.

Key Features

FeatureDesign Value
Logic-level gate driveVGS(th) = 1.0–2.5V ensures full enhancement from 3.3V or 5V microcontrollers without level-shifting.
Ultra-low RDS(on)0.031Ω at 10V reduces conduction loss by >40% vs. legacy SOT-223 MOSFETs at same current density.
Fast body diode recoverytrr = 65–98ns and Qrr = 160–240nC minimize switching loss and EMI in freewheeling paths.
Robust avalanche rating140 mJ single-pulse EAS allows safe operation under inductive turn-off stress without external clamping.
Thermally optimized SOT-223Exposed drain tab lowers RθJA to 48°C/W on 1-in² copper, enabling 2.1W dissipation in enhanced layouts.

Applications

DC-DC Buck ConverterSmart Load Switch

Use Scenario: 12V-to-3.3V point-of-load conversion in industrial PLC I/O modules.

IC Role / Device Role / Timing Role: Synchronous rectifier switch operating at 300 kHz PWM with 50% duty cycle.

Use Value: Low RDS(on) and fast switching reduce total power loss to <0.3W, eliminating need for heatsink in sealed enclosures.

Use Scenario: Hot-swap power control for USB-C peripheral ports in embedded gateways.

IC Role / Device Role / Timing Role: High-side load switch with controlled inrush limiting via gate slew rate.

Use Value: Logic-level gate enables direct MCU GPIO control; body diode blocks reverse current during plug-out events.

H-Bridge Motor DriverLED Constant-Current Dimmer

Use Scenario: 24V brushed DC motor control in automated valve actuators.

IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration with PWM frequency ≤20 kHz.

Use Value: Avalanche rating absorbs back-EMF spikes during abrupt stop commands; tf < 30ns minimizes shoot-through risk.

Use Scenario: Analog-dimming LED driver for architectural lighting with 0–10V interface.

IC Role / Device Role / Timing Role: Linear current regulator bypassing constant-current IC during dimming transitions.

Use Value: Low VSD (1.3V) and tight VGS(th) tolerance ensure stable current sink down to 0.5V compliance voltage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN3025LSD-13RDS(on) = 0.025Ω @ 4.5V (lower), but Qg = 40 nC (higher); SOT-23-3 package limits power handling.Not suitable for >2A continuous loads due to higher RθJA (190°C/W); best for space-constrained signal switching.Select when board area is critical and peak current ≤2A; avoid for thermal-limited power stages.
SI2303DS-T1-GE3RDS(on) = 0.09Ω @ 4.5V (3× higher); VDSS = 30V same; SOT-23 package.Limited to ≤1.5A continuous; higher conduction loss increases thermal stress in sustained PWM.Choose only for cost-sensitive, low-power (<0.5W) switching where gate drive voltage ≥4.5V is guaranteed.

Compared with DMN3025LSD-13 and SI2303DS-T1-GE3, IRLL3303 offers superior thermal performance (1.0W vs. ≤0.5W), balanced gate charge for medium-frequency PWM, and proven avalanche ruggedness-making it the preferred choice for industrial-grade 4–5A load switching where reliability and thermal margin are prioritized.

Availability

IRLL3303 is available at Aetrix Electronics and suitable for DC-DC converters, smart load switches, H-bridge motor drivers, and LED constant-current dimmers requiring stable component supply and long-term industrial availability.

Supply support for IRLL3303 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

International Rectifier (now part of Infineon Technologies) was a pioneer in power semiconductor design, specializing in high-efficiency MOSFETs, IGBTs, and driver ICs for industrial, automotive, and computing applications.

The HEXFET® product line was engineered for high-power-density, high-reliability switching in thermally constrained environments-emphasizing low RDS(on), fast switching, and rugged avalanche performance across SMT packages like SOT-223.

FAQ

Is IRLL3303 suitable for 3.3V microcontroller gate drive?

Yes. With VGS(th) max of 2.5V and RDS(on) = 0.045Ω at VGS = 4.5V, IRLL3303 achieves full enhancement using 3.3V logic when paired with a gate driver buffer or low-impedance GPIO. At 3.3V, RDS(on) rises to ~0.07Ω, limiting continuous current to ~3A with adequate heatsinking.

What is the maximum PCB copper area needed to achieve 2.1W power dissipation?

To reach the 2.1W rating, the datasheet specifies mounting on a 1-inch square (25.4 mm × 25.4 mm) copper pad with 2-oz thickness and no thermal vias. Achieving this requires full-surface copper fill under the SOT-223 drain tab, isolated from other nets, and free of solder mask over the thermal pad.

Can IRLL3303 replace IRFL3303 in existing designs?

Yes-IRLL3303 and IRFL3303 share identical electrical specs, pinout, and SOT-223 package. The "L" suffix denotes lead-free (PbF) construction, while "F" indicates standard leaded finish. Both meet the same JEDEC moisture sensitivity level (MSL3) and thermal profiles.

Does the body diode support synchronous rectification in buck converters?

It can be used for asynchronous operation, but its Qrr (160–240 nC) and trr (65–98 ns) are higher than dedicated Schottky diodes. For synchronous rectification above 100 kHz, an external low-Qrr MOSFET is recommended; IRLL3303's body diode is best suited for lower-frequency freewheeling or fault protection.

IRLL3303 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-261-4, TO-261AA
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
4.6A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
31mOhm @ 4.6A, 10V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
50 nC @ 10 V
Vgs (Max):
±16V
Input Capacitance (Ciss) (Max) @ Vds:
840 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
1W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-223

IRLL3303 FAQ

1.How can I place an order for IRLL3303 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRLL3303 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRLL3303 reliable?

The price and inventory of IRLL3303 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLL3303 is usually 5 days.

3.What payment methods are accepted for IRLL3303?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLL3303 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRLL3303?

IRLL3303 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRLL3303 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRLL3303?

For technical support, including IRLL3303 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLL3303 requirements.

6.How does Aetrix verify that IRLL3303 is sourced from the original manufacturer or authorized distributors?

All IRLL3303 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLL3303 meets industry standards.

7.What is the process for return or replacement of IRLL3303?

All IRLL3303 units undergo pre-shipment inspection (PSI). If there is an issue with IRLL3303, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRLL3303 part is unused and in its original packaging.

Return procedure for IRLL3303:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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