Infineon Technologies IRLR2905TRLPBF
- Part No.:
- IRLR2905TRLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRLR2905TRLPBF.pdf
- Description:
- MOSFET N-CH 55V 42A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,726
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRLR2905TRLPBF from Infineon Technologies (formerly International Rectifier) is a logic-level N-channel Power MOSFET in D-Pak (TO-252AA) package, rated for 55 V V(BR)DSS, 42 A continuous drain current at 25°C, and 0.027 Ω RDS(on) at VGS = 10 V. It features ultra-low on-resistance, fast switching, and full avalanche rating-designed for high-efficiency DC-DC converters, motor control H-bridges, and synchronous rectification in industrial power supplies.
For engineers reviewing the IRLR2905TRLPBF datasheet, IRLR2905TRLPBF pinout, IRLR2905TRLPBF application, or IRLR2905TRLPBF equivalent, key selection criteria include gate threshold voltage (1.0–2.0 V), total gate charge (48 nC), junction-to-case thermal resistance (1.4 °C/W), and body diode reverse recovery performance (trr = 80–120 ns, Qrr = 210–320 nC).
Technical Context
This fifth-generation HEXFET device uses advanced planar processing to minimize RDS(on) per die area while maintaining rugged unclamped inductive switching capability (EAS = 210 mJ). Its logic-level gate drive (VGS(th) ≤ 2.0 V) enables direct interfacing with 3.3 V and 5 V microcontrollers without level-shifting.
The integrated body diode exhibits controlled reverse recovery (dv/dt = 5.0 V/ns, Qrr = 210–320 nC), supporting hard-switched topologies. Thermal design is enabled by low RθJC (1.4 °C/W) and defined PCB-mount RθJA (50 °C/W on 1"² FR-4), making it suitable for compact surface-mount power stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | 55 V - Maximum blocking voltage before avalanche onset; sets upper limit for bus voltage in buck, flyback, and half-bridge designs. |
| RDS(on) | 0.027 Ω @ VGS = 10 V - Enables <1.2 W conduction loss at 42 A; critical for thermal management in high-current switch nodes. |
| ID (TC = 25°C) | 42 A - Continuous current rating under ideal heatsinking; derates to 30 A at 100°C case temperature. |
| Qg / Qgs / Qgd | 48 / 8.6 / 25 nC - Gate charge profile determines driver strength requirements and switching loss trade-offs in PWM operation. |
| trr / Qrr | 80–120 ns / 210–320 nC - Body diode recovery behavior directly impacts shoot-through risk and EMI in synchronous rectifiers. |
| RθJC | 1.4 °C/W - Enables precise junction temperature estimation when mounted to external copper pour or heatsink via thermal pad. |
| EAS | 210 mJ - Single-pulse avalanche energy rating supports robustness against inductive load transients without external snubbers. |
Pinout & Package
IRLR2905TRLPBF is housed in a surface-mount D-Pak (TO-252AA) package with exposed drain pad for thermal and electrical connection. The three terminals are arranged in standard S-D-G order (Source–Drain–Gate) along the leadframe edge.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Left) | Source (S) | Common return path for load current; tied to power ground plane; connects to internal source metallization and body diode cathode. |
| Pin 2 (Center) | Drain (D) | Main power output node; electrically and thermally connected to large exposed copper pad on bottom of package. |
| Pin 3 (Right) | Gate (G) | Control input; requires low-impedance drive due to 48 nC total gate charge; sensitive to ESD (±16 V max rating). |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS = 4.0 V (RDS(on) = 0.040 Ω), enabling direct 3.3 V MCU interface without gate driver ICs. |
| Fully avalanche-rated | Rated for 210 mJ single-pulse avalanche energy-eliminates need for external clamping in inductive switching circuits. |
| Low RθJC | 1.4 °C/W junction-to-case thermal resistance allows >80 W power dissipation with modest heatsinking (e.g., 2 oz Cu + thermal via array). |
| Lead-free & RoHS-compliant | Meets JEDEC J-STD-020 reflow profile; marked with "P" suffix per Infineon's lead-free product designation system. |
| Fast body diode | Reverse recovery time (trr) ≤ 120 ns and low Qrr support high-frequency synchronous rectification up to 500 kHz. |
Applications
| DC-DC Buck Converter | Brushed DC Motor Driver |
|---|---|
Use Scenario: High-efficiency 12 V → 3.3 V/5 V point-of-load conversion in industrial PLC modules. IC Role / Device Role / Timing Role: Low-side synchronous rectifier switch operating at 300–500 kHz PWM frequency. Use Value: 0.027 Ω RDS(on) reduces conduction loss by >40% vs. legacy 0.05 Ω MOSFETs, improving full-load efficiency from 89% to 93%. | Use Scenario: Bidirectional 24 V H-bridge for 100 W robotic joint actuation. IC Role / Device Role / Timing Role: High-current quadrant-switching element with integrated body diode conducting freewheeling current during PWM off-time. Use Value: 210 mJ EAS rating withstands inductive kickback during rapid direction reversal without snubber networks. |
| Synchronous Rectifier | Hot-Swap Controller |
Use Scenario: Secondary-side rectification in isolated 48 V telecom DC-DC bricks. IC Role / Device Role / Timing Role: Active replacement for Schottky diodes in forward/flyback secondary, driven by transformer-coupled or controller-synchronized gate signals. Use Value: trr ≤ 120 ns and Qrr ≤ 320 nC minimize reverse-recovery losses, enabling >95% efficiency at 200 kHz switching. | Use Scenario: Inrush current limiting and fault protection in 12 V backplane power distribution units. IC Role / Device Role / Timing Role: Load switch controlled by dedicated hot-swap IC (e.g., LTC4215), placed between input supply and downstream capacitive loads. Use Value: 42 A ID rating and 0.027 Ω RDS(on) limit voltage drop to <1.2 V at 40 A, ensuring stable rail startup under 10,000 µF capacitance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLZ44N | RDS(on) = 0.028 Ω @ 10 V; higher Qg (71 nC); same D-Pak package. | Higher gate drive power required; slightly slower switching in high-frequency SMPS. | Prefer IRLR2905TRLPBF where lower Qg and tighter VGS(th) tolerance improve 3.3 V MCU compatibility. |
| STP55NF06L | RDS(on) = 0.018 Ω @ 10 V; higher ID (55 A); TO-220 package (not surface-mount). | Requires through-hole layout and larger heatsink; unsuitable for space-constrained SMT designs. | Select IRLR2905TRLPBF for D-Pak footprint compliance and optimized thermal performance on PCB. |
Compared with IRLZ44N and STP55NF06L, IRLR2905TRLPBF delivers the best balance of low gate charge (48 nC), tight threshold voltage (1.0–2.0 V), and surface-mount D-Pak thermal performance-making it optimal for compact, high-efficiency, logic-level-driven power stages.
Availability
IRLR2905TRLPBF is available at Aetrix Electronics and suitable for industrial motor drives, telecom power supplies, and embedded DC-DC converters requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for IRLR2905TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon-based power devices.
The IRLR2905TRLPBF belongs to Infineon's legacy HEXFET® logic-level MOSFET product line, engineered specifically for high-current, low-voltage switching applications where gate drive simplicity and thermal efficiency are critical.
FAQ
What is the maximum safe operating frequency for IRLR2905TRLPBF in a hard-switched buck converter?
Based on its 48 nC total gate charge and 25 nC Miller charge, the device supports reliable operation up to 500 kHz in well-designed buck converters with ≤3.4 Ω gate drive impedance and adequate PCB layout. Switching losses rise significantly above this frequency due to increased Qgd-related delay and body diode recovery effects.
Can IRLR2905TRLPBF be used in parallel configurations for higher current handling?
Yes-its positive RDS(on) temperature coefficient (0.070 V/°C) ensures inherent current sharing stability. For two devices in parallel, derate total current to ≤75 A with matched gate drive routing and symmetric thermal mounting to avoid thermal runaway.
Does IRLR2905TRLPBF require a gate resistor, and what value is recommended?
A gate resistor is mandatory to control dv/dt and suppress ringing. For 5 V MCU drive, a 10 Ω series resistor is recommended; for 12 V drivers, use 22–33 Ω. Values below 5 Ω risk excessive peak gate current (>2 A), while values above 100 Ω increase switching losses unnecessarily.
How does the body diode performance affect synchronous rectifier design?
The body diode's 80–120 ns trr and 210–320 nC Qrr determine minimum dead-time requirements and reverse-recovery loss contribution. In 200–300 kHz designs, dead-time must exceed 200 ns to prevent shoot-through, and Qrr directly adds ~0.5 W loss per device at 25 A average current.
IRLR2905TRLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 42A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4V, 10V
- Rds On (Max) @ Id, Vgs:
- 27mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 48 nC @ 5 V
- Vgs (Max):
- ±16V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1700 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 110W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRLR2905TRLPBF FAQ
1.How can I place an order for IRLR2905TRLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRLR2905TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRLR2905TRLPBF reliable?
The price and inventory of IRLR2905TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLR2905TRLPBF is usually 5 days.
3.What payment methods are accepted for IRLR2905TRLPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLR2905TRLPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRLR2905TRLPBF?
IRLR2905TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRLR2905TRLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRLR2905TRLPBF?
For technical support, including IRLR2905TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLR2905TRLPBF requirements.
6.How does Aetrix verify that IRLR2905TRLPBF is sourced from the original manufacturer or authorized distributors?
All IRLR2905TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR2905TRLPBF meets industry standards.
7.What is the process for return or replacement of IRLR2905TRLPBF?
All IRLR2905TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLR2905TRLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRLR2905TRLPBF part is unused and in its original packaging.
Return procedure for IRLR2905TRLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRLR2905TRLPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

