Infineon Technologies IRLR3103PBF
- Part No.:
- IRLR3103PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRLR3103PBF.pdf
- Description:
- MOSFET N-CH 30V 55A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:3,953
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Product details
Overview
IRLR3103PBF from Infineon (formerly International Rectifier) is a logic-level N-channel enhancement-mode Power MOSFET in D-PAK (TO-252AA) package, rated for 30V VDSS, 55A continuous drain current at TC = 25°C, and 0.019Ω RDS(on) at VGS = 10V. It features ultra-low on-resistance, fast switching, and full avalanche rating - deployed in DC-DC synchronous rectification, motor drive half-bridges, and high-efficiency power supplies.
For engineers reviewing the IRLR3103PBF datasheet, IRLR3103PBF pinout, IRLR3103PBF application, or IRLR3103PBF equivalent, key selection criteria include gate threshold voltage (1.0–2.5V), pulsed drain current capability (220A), junction-to-case thermal resistance (1.4°C/W), and body diode reverse recovery charge (210–310nC) under 100A/µs di/dt.
Technical Context
This HEXFET device uses fifth-generation silicon process to achieve low RDS(on) per die area while maintaining rugged unclamped inductive switching performance. Its logic-level gate enables direct drive from 3.3V/5V microcontrollers without level-shifting.
The integrated body diode supports freewheeling in buck converters and H-bridge motor control, with measured trr = 81–120ns and Qrr = 210–310nC at TJ = 25°C, IF = 34A, and di/dt = 100A/µs - critical for minimizing switching losses in high-frequency topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V - maximum blocking voltage before avalanche onset; defines usable input range in 24V systems |
| RDS(on) @ VGS=10V | 0.019Ω - conduction loss of 0.037W at 30A, enabling >95% efficiency in 50W synchronous rectifiers |
| ID @ TC=25°C | 55A - continuous current limited by package thermal capacity, not silicon; requires heatsink or PCB copper area |
| Qg | 50nC - total gate charge determines driver strength requirement; compatible with standard 1A peak gate drivers |
| EAS | 240mJ - single-pulse avalanche energy rating ensures robustness against inductive kickback in motor drives |
| RθJC | 1.4°C/W - junction-to-case thermal resistance enables 76W dissipation at ΔT = 107°C with minimal heatsink |
| trr | 81–120ns - body diode reverse recovery time directly impacts shoot-through risk and EMI in bridge configurations |
Pinout & Package
D-PAK (TO-252AA) surface-mount package with exposed drain pad for thermal and electrical connection. Standard three-terminal configuration optimized for PCB heat spreading and low-inductance layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (S) | Reference node for gate drive; connects to power ground or low-side switch return path |
| Pin 2 (Gate) | Control terminal (G) | High-impedance input requiring <50nC to switch; logic-level compatible down to 4.5V |
| Pin 3 (Drain) | Power output terminal (D) | Exposed metal pad - electrically and thermally connected to drain; must be soldered to large copper pour |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS = 4.5V (RDS(on) = 0.024Ω), eliminating need for gate driver ICs in 5V MCU systems |
| Fully avalanche-rated | Guaranteed single-pulse avalanche energy of 240mJ supports reliable operation in unclamped inductive loads |
| Low Qgd/Qg ratio | Miller charge Qgd = 28nC (56% of Qg) reduces susceptibility to false turn-on during high dv/dt commutation |
| Enhanced body diode | Reverse recovery charge Qrr = 210–310nC and trr = 81–120ns enable efficient freewheeling in synchronous buck converters |
| Lead-free construction | Pb-free plating and RoHS-compliant packaging meet industrial and automotive environmental requirements |
Applications
| DC-DC Synchronous Rectifier | Brushless DC Motor Drive |
|---|---|
Use Scenario: Secondary-side switch in 12V–24V isolated DC-DC converters delivering up to 100W. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode to reduce conduction loss and improve efficiency. Use Value: 0.019Ω RDS(on) cuts rectifier loss by >60% vs. 40V/50A Schottky, enabling >94% converter efficiency at full load. | Use Scenario: High-current half-bridge leg in 24V BLDC motor controllers for power tools and e-bikes. IC Role / Device Role / Timing Role: Low-side switching element controlled by gate driver IC with 100ns dead-time management. Use Value: 220A pulsed drain rating and 240mJ avalanche energy tolerate motor phase current transients and back-EMF spikes. |
| Hot-Swap Power Controller | Industrial LED Driver |
Use Scenario: Inrush current limiter and fault protection switch in 24V/48V backplane power distribution units. IC Role / Device Role / Timing Role: Series pass element with external current-sense and gate slew-rate control for soft-start and overcurrent shutdown. Use Value: Linear Derating Factor of 0.71W/°C and 1.4°C/W RθJC support stable operation under sustained 30A linear-mode stress. | Use Scenario: Constant-current switch in high-power LED string drivers for street lighting and horticultural fixtures. IC Role / Device Role / Timing Role: PWM-controlled high-side or low-side current regulator operating at 1–10kHz switching frequency. Use Value: Fast tr = 210ns and tf = 54ns minimize switching loss at 5A LED current, reducing thermal load on aluminum-core PCB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level Power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3103PBF | Same die, TO-220 through-hole package; RθJA = 62°C/W (vs. 50°C/W for D-PAK); no exposed drain pad | Better suited for prototyping or low-volume through-hole assembly; higher thermal resistance limits power density | Select when manual soldering or socketing required; avoid in space-constrained or high-power-density designs |
| STP36NF06L | 60V VDSS, 36A ID, 0.022Ω RDS(on) @ 10V; Qg = 42nC; TO-220 package | Higher voltage rating but lower current and higher on-resistance; less suitable for 24V/50A applications | Choose only if 60V blocking margin is mandatory and 55A continuous current is not required |
Compared with IRL3103PBF and STP36NF06L, the IRLR3103PBF delivers superior current density and thermal performance in surface-mount layouts, while retaining identical silicon characteristics - making it the optimal choice for production-grade 24V power stages where board space and thermal management are constrained.
Availability
IRLR3103PBF is available at Aetrix Electronics and suitable for DC-DC converters, motor drives, and hot-swap controllers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant lead-free packaging.
Supply support for IRLR3103PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired International Rectifier in 2015 and continues its legacy of high-performance power semiconductors with rigorous qualification and automotive-grade reliability testing.
This part belongs to the HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-current switching in industrial power supplies, motor controls, and battery-powered systems demanding low RDS(on) and fast dynamic response.
FAQ
What is the maximum safe operating temperature for IRLR3103PBF?
The IRLR3103PBF has a maximum operating junction temperature of +175°C and storage temperature range from –55°C to +175°C. Its thermal design must ensure junction temperature remains below this limit under worst-case power dissipation and ambient conditions, using the specified RθJC = 1.4°C/W and PCB copper area guidelines from AN-994.
Can IRLR3103PBF be driven directly from a 3.3V microcontroller GPIO?
No - while the gate threshold voltage starts at 1.0V, full enhancement requires VGS ≥ 4.5V for RDS(on) ≤ 0.024Ω. A 3.3V GPIO cannot reliably achieve this; a dedicated gate driver (e.g., TC4427) or level shifter is required to deliver ≥4.5V with sufficient peak current for 50nC Qg.
Does IRLR3103PBF have an integrated ESD protection diode on the gate?
Yes - the device includes built-in gate protection with ±100nA gate leakage at ±16V and absolute maximum VGS rating of ±16V. However, external 10–22Ω series gate resistor and optional Zener clamp (e.g., 12V) are recommended in high-noise environments to prevent transient-induced gate oxide damage.
How does the body diode performance compare to discrete Schottky diodes?
The integrated body diode has VSD = 1.3V at 28A and trr = 81–120ns, which is slower and higher forward drop than optimized Schottky diodes (e.g., 0.55V, <10ns). It is intended for freewheeling, not primary rectification; use external Schottky for highest efficiency in non-synchronous designs.
IRLR3103PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 55A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 19mOhm @ 33A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 50 nC @ 4.5 V
- Vgs (Max):
- ±16V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1600 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 107W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRLR3103PBF FAQ
1.How can I place an order for IRLR3103PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRLR3103PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRLR3103PBF reliable?
The price and inventory of IRLR3103PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLR3103PBF is usually 5 days.
3.What payment methods are accepted for IRLR3103PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLR3103PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRLR3103PBF?
IRLR3103PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRLR3103PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRLR3103PBF?
For technical support, including IRLR3103PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLR3103PBF requirements.
6.How does Aetrix verify that IRLR3103PBF is sourced from the original manufacturer or authorized distributors?
All IRLR3103PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR3103PBF meets industry standards.
7.What is the process for return or replacement of IRLR3103PBF?
All IRLR3103PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLR3103PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRLR3103PBF part is unused and in its original packaging.
Return procedure for IRLR3103PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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