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Infineon Technologies IRLR3303TRLPBF

Part No.:
IRLR3303TRLPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixIRLR3303TRLPBF.pdf
Description:
MOSFET N-CH 30V 35A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,600

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Product details

Overview

IRLR3303TRLPBF from Infineon Technologies (formerly International Rectifier) is a 30V, 35A logic-level N-channel Power MOSFET in TO-252AA (D-Pak) surface-mount package, featuring 31 mΩ RDS(on) at VGS = 10 V and 45 mΩ at VGS = 4.5 V, fully avalanche-rated, and optimized for DC-DC converters, motor drives, and load switching in industrial power supplies.

For engineers reviewing the IRLR3303TRLPBF datasheet, IRLR3303TRLPBF pinout, IRLR3303TRLPBF application, or IRLR3303TRLPBF equivalent, key selection criteria include logic-level gate drive compatibility (VGS(th) = 1.0–2.5 V), low RDS(on) at 4.5 V, fast switching (tr = 200 ns, tf = 36 ns), and rugged unclamped inductive switching capability (EAS = 130 mJ).

Technical Context

This HEXFET device uses fifth-generation silicon process technology to minimize conduction loss while maintaining high dv/dt immunity (5.0 V/ns) and robust body diode performance (trr = 72–110 ns, Qrr = 180–280 nC). Its gate charge profile (Qg = 26 nC, Qgd = 15 nC) supports efficient PWM operation in synchronous buck stages.

The MOSFET integrates low-inductance internal source (LS = 7.5 nH) and drain (LD = 4.5 nH) paths, enabling clean switching waveforms under high di/dt conditions (up to 140 A/µs). Thermal design is supported by validated junction-to-case resistance of 2.2 °C/W and PCB-mounted junction-to-ambient rating of 50 °C/W.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum blocking voltage; suitable for 24 V nominal bus systems with margin.
RDS(on) @ VGS = 4.5 V45 mΩ - Enables efficient operation directly from 3.3 V or 5 V logic-level drivers without level-shifting.
ID @ TC = 25°C35 A - Continuous current rating at heatsink temperature; limited to 20 A by package thermal constraint.
EAS130 mJ - Single-pulse avalanche energy; supports reliable unclamped inductive turn-off in motor control.
Qg26 nC - Total gate charge; determines driver power requirement and switching loss trade-off.
tr/tf200/36 ns - Rise/fall times at VDD = 15 V, ID = 20 A; enables >500 kHz switching in SMPS designs.
θJC2.2 °C/W - Junction-to-case thermal resistance; defines minimum heatsink interface requirement for thermal management.

Pinout & Package

IRLR3303TRLPBF is housed in a TO-252AA (D-Pak) surface-mount package with gull-wing leads, designed for vapor-phase, infrared, or wave soldering. The package provides low thermal resistance and mechanical robustness for high-power density board layouts.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Power return path and gate referenceConnected to PCB ground plane; carries full load current and serves as gate drive reference point.
Pin 2 (Gate)Control input terminalHigh-impedance node requiring low-inductance routing; driven by logic-level or dedicated gate driver IC.
Pin 3 (Drain)Main power output terminalConnected to switched high-side rail; electrically tied to die backside (exposed pad) for thermal conduction.

Key Features

FeatureDesign Value
Logic-level gate driveVGS(th) = 1.0–2.5 V ensures full enhancement with 3.3 V or 5 V microcontroller outputs.
Fully avalanche-ratedRated for repetitive and single-pulse avalanche events up to EAR = 6.8 mJ and EAS = 130 mJ.
Ultra-low RDS(on)31 mΩ @ 10 V and 45 mΩ @ 4.5 V reduce conduction losses in high-current, low-voltage applications.
Fast body diodetrr = 72–110 ns and Qrr = 180–280 nC minimize reverse recovery loss in synchronous rectification.
Lead-free and RoHS-compliant"PBF" suffix confirms Pb-free terminations and compliance with EU RoHS Directive 2011/65/EU.

Applications

DC-DC Buck ConverterBrushed DC Motor Driver

Use Scenario: High-efficiency 24 V input to 5/3.3 V output conversion in industrial PLC I/O modules.

IC Role / Device Role / Timing Role: Synchronous high-side switch operating at 300–600 kHz with logic-level gate control.

Use Value: 45 mΩ RDS(on) at 4.5 V reduces conduction loss by >30% vs. standard MOSFETs, improving full-load efficiency above 92%.

Use Scenario: H-bridge drive for 12–24 V brushed motors in automated gate actuators and HVAC dampers.

IC Role / Device Role / Timing Role: Low-side switching element handling bidirectional 20 A peak currents with fast PWM commutation.

Use Value: 130 mJ EAS withstands inductive kickback during rapid direction reversal without snubbers or clamps.

Hot-Swap ControllerLED Constant-Current Driver

Use Scenario: Inrush current limiting and fault protection in redundant 24 V power distribution units.

IC Role / Device Role / Timing Role: Series pass element controlled by external current-sense amplifier and comparator.

Use Value: 35 A continuous rating and 140 A pulsed capability support 20 A steady-state loads with 2× surge margin.

Use Scenario: Dimmable constant-current driver for high-brightness LED arrays in signage and architectural lighting.

IC Role / Device Role / Timing Role: PWM-controlled current sink switching at 1–5 kHz with analog dimming feedback.

Use Value: Low Qg (26 nC) and fast tf (36 ns) enable precise current regulation with minimal switching noise coupling into analog feedback.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRLR3103TRLPBFRDS(on) = 55 mΩ @ 4.5 V; lower ID (30 A); identical package and pinoutHigher conduction loss limits use in >15 A continuous applicationsSelect when cost sensitivity outweighs efficiency requirements and thermal headroom exists
STP36NF06L60 V VDSS; RDS(on) = 20 mΩ @ 10 V but 50 mΩ @ 4.5 V; TO-220 packageHigher voltage rating but through-hole mounting and higher gate charge (45 nC)Choose only if 60 V blocking is required and PCB layout allows TO-220 footprint

Compared with IRLR3103TRLPBF and STP36NF06L, the IRLR3303TRLPBF delivers optimal balance of low 4.5 V RDS(on), surface-mount D-Pak packaging, and proven avalanche ruggedness-making it preferred for space-constrained, high-reliability 24 V industrial power stages.

Availability

IRLR3303TRLPBF is available at Aetrix Electronics and suitable for DC-DC converters, motor drivers, hot-swap controllers, and LED drivers requiring stable component supply across extended production lifecycles.

Supply support for IRLR3303TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, and industrial control solutions.

This device belongs to Infineon's legacy HEXFET® Power MOSFET product line, engineered for high-efficiency, high-reliability switching in industrial power conversion and motor control applications.

FAQ

Is IRLR3303TRLPBF suitable for 3.3 V microcontroller gate drive?

Yes. With a gate threshold voltage (VGS(th)) of 1.0–2.5 V and guaranteed RDS(on) of 45 mΩ at VGS = 4.5 V, the device fully enhances using standard 3.3 V GPIO outputs. For optimal performance, a dedicated gate driver is recommended to achieve fast switching and minimize Miller-induced shoot-through.

What is the maximum continuous current at 100°C case temperature?

The datasheet specifies ID = 25 A at TC = 100°C with VGS = 10 V. This derating reflects thermal limits-not package current capacity, which is capped at 20 A regardless of temperature. Designers must verify PCB copper area and heatsinking to maintain TC ≤ 100°C under load.

Does IRLR3303TRLPBF have integrated ESD protection?

No. The device lacks on-die ESD protection structures. External gate protection-such as a 10 kΩ series resistor and 12 V Zener clamp between gate and source-is strongly recommended to prevent damage during handling or system-level transients.

Can IRLR3303TRLPBF replace IRLR3303PBF in existing designs?

Yes. The "TRLPBF" suffix denotes tape-and-reel packaging with lead-free terminations, while "PBF" indicates bulk packaging with identical electrical and thermal specifications. No layout or circuit changes are needed-only logistics and assembly process adjustments for reel-fed pick-and-place.

IRLR3303TRLPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
35A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
31mOhm @ 21A, 10V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
26 nC @ 4.5 V
Vgs (Max):
±16V
Input Capacitance (Ciss) (Max) @ Vds:
870 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
68W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-252AA (DPAK)

IRLR3303TRLPBF FAQ

1.How can I place an order for IRLR3303TRLPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRLR3303TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRLR3303TRLPBF reliable?

The price and inventory of IRLR3303TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLR3303TRLPBF is usually 5 days.

3.What payment methods are accepted for IRLR3303TRLPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLR3303TRLPBF transactions.

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4.How is shipping managed for IRLR3303TRLPBF?

IRLR3303TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRLR3303TRLPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRLR3303TRLPBF?

For technical support, including IRLR3303TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLR3303TRLPBF requirements.

6.How does Aetrix verify that IRLR3303TRLPBF is sourced from the original manufacturer or authorized distributors?

All IRLR3303TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR3303TRLPBF meets industry standards.

7.What is the process for return or replacement of IRLR3303TRLPBF?

All IRLR3303TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLR3303TRLPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRLR3303TRLPBF part is unused and in its original packaging.

Return procedure for IRLR3303TRLPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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