Infineon Technologies IRLR3303TRPBF
- Part No.:
- IRLR3303TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRLR3303TRPBF.pdf
- Description:
- MOSFET N-CH 30V 35A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,639
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Product details
Overview
IRLR3303TRPBF from Infineon Technologies (formerly International Rectifier) is a logic-level N-channel Power MOSFET in D-Pak (TO-252AA) package, rated for 30 V V(BR)DSS, 35 A continuous drain current at 25°C, and 0.031 Ω RDS(on) at VGS = 10 V. It features ultra-low on-resistance, fast switching, full avalanche rating, and lead-free construction-designed for high-efficiency DC-DC converters, motor drives, and load-switching applications.
For engineers reviewing the IRLR3303TRPBF datasheet, IRLR3303TRPBF pinout, IRLR3303TRPBF application, or IRLR3303TRPBF equivalent, key selection criteria include gate threshold voltage (1.0–2.5 V), thermal resistance (RθJC = 2.2 °C/W), body diode recovery performance (trr = 72–110 ns), and logic-level drive compatibility with 4.5 V microcontrollers.
Technical Context
This HEXFET device uses fifth-generation silicon process technology to minimize RDS(on) per die area while maintaining rugged unclamped inductive switching capability (EAS = 130 mJ). Its low gate charge (Qg = 26 nC) and optimized capacitance profile (Ciss = 870 pF, Crss = 170 pF) support high-frequency operation up to several hundred kHz in synchronous buck topologies.
The integrated body diode exhibits controlled reverse recovery (Qrr = 180–280 nC, trr = 72–110 ns) and forward voltage (VSD = 1.3 V at IS = 20 A), enabling reliable freewheeling in hard-switched converters without external Schottky supplementation in moderate-power designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | 30 V - Maximum blocking voltage before avalanche onset; sets upper limit for input rail in 24 V systems. |
| RDS(on) | 0.031 Ω @ VGS = 10 V - Enables <1 W conduction loss at 18 A, critical for thermally constrained PCB-mount designs. |
| ID (TC = 25°C) | 35 A - Continuous current rating under ideal heatsinking; derates linearly at 0.45 W/°C above 25°C case temperature. |
| Qg / Qgs / Qgd | 26 / 8.8 / 15 nC - Low total and Miller charge reduces driver power demand and improves switching efficiency in 100–500 kHz SMPS. |
| trr / Qrr | 72–110 ns / 180–280 nC - Predictable body diode recovery enables stable operation in non-synchronous rectification without oscillation risk. |
| RθJC | 2.2 °C/W - Junction-to-case thermal resistance allows direct thermal pad mounting to copper pour or heatsink for >50 W power dissipation. |
| VGS(th) | 1.0–2.5 V - Logic-level threshold ensures full enhancement with 3.3 V or 5 V GPIO, eliminating need for gate boosters in MCU-driven loads. |
Pinout & Package
D-Pak (TO-252AA) surface-mount package with exposed drain tab for thermal and electrical connection. Standard three-terminal configuration: Gate (G), Drain (D), Source (S).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (G) | Gate | Control terminal; accepts logic-level voltage (≥4.5 V) to fully enhance channel; requires <100 nA leakage current handling. |
| Pin 2 (D) | Drain | Main power output node; electrically and thermally connected to large exposed copper tab; must be routed with low-inductance layout. |
| Pin 3 (S) | Source | Power return path and reference for gate drive; connects to ground plane or low-side switch node; carries full load current. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V-compatible with 3.3 V and 5 V microcontrollers without level-shifting circuitry. |
| Fully avalanche-rated | Withstands 130 mJ single-pulse avalanche energy-enables robust operation in inductive load switching without snubbers. |
| Ultra-low RDS(on) | 0.031 Ω at 10 V drive minimizes I²R losses in high-current paths, reducing thermal stress in compact DC-DC modules. |
| Lead-free and RoHS-compliant | Meets JEDEC J-STD-020 reflow profiles; qualified for vapor-phase, infrared, and wave soldering per D-Pak footprint standards. |
| Optimized switching parameters | 26 nC total gate charge and 170 pF Crss enable clean turn-off with minimal Miller-induced shoot-through risk in half-bridge configurations. |
Applications
| DC-DC Buck Converter | Brushed DC Motor Driver |
|---|---|
Use Scenario: Synchronous rectification stage in 12 V input, 5 V/15 A output point-of-load converter. IC Role / Device Role / Timing Role: Low-side power switch with fast turn-on/off timing (td(on) = 7.4 ns, tf = 36 ns) to minimize dead-time losses. Use Value: 0.031 Ω RDS(on) limits conduction loss to 7 W at 15 A, enabling >94% efficiency without forced air cooling. | Use Scenario: H-bridge low-side switch controlling 24 V, 10 A brushed motor in industrial actuator. IC Role / Device Role / Timing Role: High-current, logic-driven switching element with integrated avalanche energy handling during motor commutation spikes. Use Value: 130 mJ EAS rating absorbs inductive kickback without external clamping, simplifying board layout and BOM. |
| Hot-Swap Load Switch | LED Constant-Current Driver |
Use Scenario: Inrush-limited 24 V power distribution to field-replaceable subsystems in telecom equipment. IC Role / Device Role / Timing Role: Main pass transistor controlled via PWM or analog gate bias; leverages low VGS(th) for precise soft-start ramp control. Use Value: 1.0–2.5 V gate threshold enables accurate current limiting using simple op-amp feedback, avoiding discrete current-sense amplifiers. | Use Scenario: Dimmable constant-current sink for 36 V, 1.2 A LED string in architectural lighting. IC Role / Device Role / Timing Role: Linear-regulated current path modulated by PWM gate signal; relies on low RDS(on) to minimize thermal overhead at full brightness. Use Value: 0.031 Ω on-resistance yields only 0.45 W dissipation at 1.2 A, permitting use in sealed aluminum housings without heatsinks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLR3103TRPBF | RDS(on) = 0.042 Ω @ 10 V; ID = 30 A; slightly higher conduction loss. | Lower current rating reduces margin in 35 A peak-load scenarios but offers identical pinout and drive compatibility. | Select when thermal budget permits minor efficiency trade-off for cost-sensitive volume production. |
| STL32N3LLH6 | RDS(on) = 0.028 Ω @ 4.5 V; V(BR)DSS = 30 V; 30 A rating; different SO-8FL package. | SO-8FL footprint requires PCB redesign; superior 4.5 V drive supports lower-voltage controllers but lacks D-Pak thermal mass. | Prefer for space-constrained designs where 0.028 Ω at 4.5 V justifies layout change and reduced thermal headroom. |
Compared with IRLR3103TRPBF and STL32N3LLH6, the IRLR3303TRPBF delivers optimal balance of 35 A current capacity, 0.031 Ω RDS(on) at 10 V, and D-Pak thermal performance-making it preferred for thermally demanding, medium-power industrial switching where layout reuse and proven reliability are priorities.
Availability
IRLR3303TRPBF is available at Aetrix Electronics and suitable for DC-DC converters, motor drivers, hot-swap controllers, and LED drivers requiring stable component supply across extended production lifecycles.
Supply support for IRLR3303TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired International Rectifier in 2015 and continues its legacy of high-performance power semiconductors with rigorous automotive and industrial qualification standards.
The HEXFET® Power MOSFET product line-now part of Infineon's StrongIRFET™ family-is engineered for high-efficiency, high-reliability switching in industrial motor controls, server power supplies, and renewable energy inverters.
FAQ
What is the maximum junction temperature and how does it affect continuous current rating?
The IRLR3303TRPBF has a TJ(max) of +175°C. At TC = 100°C, its continuous drain current drops to 25 A due to thermal derating (0.45 W/°C). This means sustained operation above 100°C case temperature requires active cooling or current reduction to prevent exceeding 175°C junction limit-verified by RθJC = 2.2 °C/W and power dissipation calculations.
Is the body diode suitable for freewheeling in non-synchronous buck converters?
Yes-the integrated body diode has characterized reverse recovery (trr = 72–110 ns, Qrr = 180–280 nC) and forward voltage (VSD = 1.3 V at 20 A). These parameters support stable freewheeling in 100–300 kHz non-synchronous buck stages without oscillation, though efficiency is ~3–5% lower than synchronous rectification.
Can IRLR3303TRPBF be driven directly from a 3.3 V microcontroller GPIO?
Yes-its VGS(th) range (1.0–2.5 V) and logic-level design ensure full enhancement at 3.3 V, delivering RDS(on) ≤ 0.045 Ω at VGS = 4.5 V and ID = 17 A. For best efficiency, pair with a low-impedance driver (e.g., TC4427) to minimize switching losses during 26 nC gate charge transfer.
What is the significance of the "P" suffix in IRLR3303TRPBF?
The "P" denotes lead-free (Pb-free) construction per JEDEC J-STD-020, confirmed by Infineon's material declarations. It indicates compliance with RoHS Directive 2011/65/EU and supports standard Pb-free reflow profiles (peak 260°C), with no impact on electrical or thermal specifications versus legacy leaded versions.
IRLR3303TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 35A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 31mOhm @ 21A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 26 nC @ 4.5 V
- Vgs (Max):
- ±16V
- Input Capacitance (Ciss) (Max) @ Vds:
- 870 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 68W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRLR3303TRPBF FAQ
1.How can I place an order for IRLR3303TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRLR3303TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRLR3303TRPBF reliable?
The price and inventory of IRLR3303TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLR3303TRPBF is usually 5 days.
3.What payment methods are accepted for IRLR3303TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLR3303TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRLR3303TRPBF?
IRLR3303TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRLR3303TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRLR3303TRPBF?
For technical support, including IRLR3303TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLR3303TRPBF requirements.
6.How does Aetrix verify that IRLR3303TRPBF is sourced from the original manufacturer or authorized distributors?
All IRLR3303TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR3303TRPBF meets industry standards.
7.What is the process for return or replacement of IRLR3303TRPBF?
All IRLR3303TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLR3303TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRLR3303TRPBF part is unused and in its original packaging.
Return procedure for IRLR3303TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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