Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies IRLR3802TRLPBF

Name: IRLR3802TRLPBF
Brand: Infineon Technologies
SKU: IRLR3802TRLPBF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: IRLR3802TRLPBF

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Datasheet:: IRLR3802TRLPBF.pdf

Description:: MOSFET N-CH 12V 84A DPAK

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:8,896

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

IRLR3802TRLPBF from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode HEXFET Power MOSFET optimized for high-efficiency, high-frequency synchronous buck converters in 3.3V/5V input point-of-load power management. It features 12V V_DS, 8.5 mΩ R_DS(on) at V_GS = 4.5V, 27 nC total gate charge, and operates up to +175°C junction temperature - deployed in netcom DC-DC modules and portable computing VRMs.

For engineers reviewing the IRLR3802TRLPBF datasheet, IRLR3802TRLPBF pinout, IRLR3802TRLPBF application, or IRLR3802TRLPBF equivalent, key selection criteria include low-voltage gate drive compatibility (2.8V–4.5V), ultra-low conduction loss at 12A, avalanche-rated ruggedness (300 mJ E_AS), and D-Pak thermal performance (R_θJC = 1.7°C/W).

Technical Context

This MOSFET employs a trench-gate silicon process enabling sub-10 mΩ on-resistance with fast switching dynamics: Q_gd = 10 nC and C_iss = 2490 pF support MHz-range operation in synchronous rectification. Its gate threshold voltage (0.6–1.9 V) ensures reliable turn-on with 3.3V logic-level drivers.

The integrated body diode exhibits t_rr = 52–78 ns and Q_rr = 54–81 nC at 25°C, enabling efficient freewheeling in hard-switched buck topologies. Thermal design is enabled by R_θJA = 40°C/W (PCB mount) and R_θJC = 1.7°C/W, supporting high-power density layouts.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	12 V - Maximum blocking voltage compatible with 12V rail systems and low-voltage DC-DC inputs.
R_DS(on) max	8.5 mΩ @ V_GS = 4.5V, T_J = 25°C - Enables <1W conduction loss at 12A, critical for PoL efficiency.
Q_g	27 nC - Low gate charge reduces driver power and enables fast switching with minimal gate drive loss.
I_D continuous	84 A @ T_C = 25°C - High current capability supports compact, high-current VRM phases without parallel devices.
E_AS	300 mJ - Rated single-pulse avalanche energy allows robust operation during transient overvoltage events.
R_θJC	1.7 °C/W - Enables direct heatsinking via PCB copper or clip-mount, simplifying thermal management in space-constrained modules.
V_GS(th)	0.6–1.9 V - Ensures full enhancement with 3.3V microcontroller GPIO or dedicated low-V_GS drivers.

Pinout & Package

IRLR3802TRLPBF is housed in a lead-free D-Pak (TO-252AA) surface-mount package with exposed drain pad for thermal and electrical connection. The package supports high-current PCB routing and direct thermal coupling to inner-layer copper pours.

Pin/Terminal	Circuit Role	Design Meaning
Pin 1 (G)	Gate	Control terminal accepting 0–12V logic-level signals; low input capacitance (C_iss = 2490 pF) minimizes driver loading.
Pin 2 (S)	Source	Reference node for gate drive and current sensing; tied to power ground in synchronous buck low-side configuration.
Pin 3 (D)	Drain	Main power output terminal; electrically and thermally connected to exposed copper pad for low-inductance, high-current paths.

Key Features

Feature	Design Value
Ultra-low R_DS(on)	8.5 mΩ at 4.5V drive enables >95% efficiency in 12A PoL converters without forced air cooling.
Logic-level gate drive	Guaranteed turn-on at 2.8V V_GS eliminates need for level-shifting circuits in 3.3V control architectures.
Fast body diode recovery	t_rr = 52 ns (25°C) reduces switching losses and EMI in hard-switched synchronous rectifiers.
Avalanche-rated	300 mJ single-pulse E_AS provides margin against inductive kickback in unclamped inductive loads.
Lead-free D-Pak	RoHS-compliant TO-252AA package offers proven manufacturability and thermal reliability in high-volume SMT lines.

Applications

Server VRM Phase Legs

5G Base Station PoL Converters

Use Scenario: High-current, multi-phase buck converter supplying core voltage to Xeon or EPYC CPUs in 1U servers.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier operating at 500 kHz–1 MHz with 3.3V PWM controller interface.

Use Value: 8.5 mΩ R_DS(on) cuts conduction loss by 35% vs. legacy 15 mΩ MOSFETs, reducing phase temperature rise by 18°C at 80A.

Use Scenario: Point-of-load regulator powering RF transceiver ASICs in outdoor macro cell radios with wide ambient temperature range.

IC Role / Device Role / Timing Role: High-efficiency 12V-to-1.2V buck switch delivering 40A continuous current in thermally constrained enclosure.

Use Value: 175°C max T_J and 1.7°C/W R_θJC allow stable operation at -40°C to +85°C ambient without derating.

Industrial PLC I/O Power Modules

Portable SSD Power Rails

Use Scenario: Compact 24V-to-5V/3.3V isolated DC-DC stage powering digital I/O banks in DIN-rail mounted controllers.

IC Role / Device Role / Timing Role: Primary switching FET in non-isolated buck pre-regulator feeding downstream LDOs and isolated gate drivers.

Use Value: 27 nC Q_g enables clean 1 MHz switching with minimal gate drive power (<15 mW), extending module MTBF.

Use Scenario: Dual-rail power delivery (1.8V/3.3V) for NVMe SSD controllers and NAND flash in ultrabooks and tablets.

IC Role / Device Role / Timing Role: Low-R_DS(on) high-side switch in dual-phase buck converter with integrated PMIC sequencing.

Use Value: Logic-level V_GS(th) ensures full enhancement from 1.8V bias rails, eliminating external gate boost circuitry.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IRLR3702TRLPBF	R_DS(on) = 12 mΩ @ 4.5V; Q_g = 22 nC; V_DS = 20 V	Higher voltage rating but higher conduction loss - suitable where 20V blocking is required over 12V.	Select when system input exceeds 12V or avalanche margin must cover wider transients.
SI7850DP-T1-GE3	R_DS(on) = 7.5 mΩ @ 4.5V; Q_g = 31 nC; V_DS = 20 V; SO-8 package	Lower R_DS(on) but higher Q_g and smaller package - better for space-limited designs needing lower loss, worse for thermal-heavy layouts.	Select when board area is constrained and thermal mass is sufficient to absorb higher switching loss.

Compared with IRLR3802TRLPBF, IRLR3702TRLPBF trades conduction efficiency for higher voltage headroom, while SI7850DP-T1-GE3 improves on-resistance at the cost of gate drive demand and thermal dissipation capability - making IRLR3802TRLPBF optimal for 12V-input, thermally demanding PoL applications.

Availability

IRLR3802TRLPBF is available at Aetrix Electronics and suitable for server VRMs, 5G base station power supplies, and industrial PLC I/O modules requiring stable component supply across multi-year production cycles.

Supply support for IRLR3802TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon MOSFET innovation and high-reliability manufacturing.

The IRLR3802TRLPBF belongs to Infineon's HEXFET® logic-level power MOSFET product line, engineered specifically for high-frequency, low-voltage synchronous buck converters in computing, networking, and portable electronics.

FAQ

Is IRLR3802TRLPBF suitable for 3.3V gate drive?

Yes. With a gate threshold voltage range of 0.6–1.9 V and guaranteed R_DS(on) ≤ 8.5 mΩ at V_GS = 4.5V, it fully enhances using standard 3.3V logic outputs. At 3.3V V_GS, R_DS(on) is typically ~12 mΩ - verified in Fig. 3 of the datasheet under TJ = 25°C.

What is the maximum continuous drain current at 100°C case temperature?

The datasheet specifies I_D = 60 A at T_C = 100°C and V_GS = 4.5V. This reflects thermal derating due to reduced channel mobility and increased R_DS(on); linear derating factor is 0.59 mW/°C above 100°C case temperature.

Does IRLR3802TRLPBF have avalanche capability?

Yes. It is fully characterized for unclamped inductive switching with E_AS = 300 mJ (single pulse) and I_AR = 20 A. Fig. 12a–c and Table "Avalanche Characteristics" confirm ruggedness under repetitive avalanche conditions within specified limits.

Can IRLR3802TRLPBF be used in parallel configurations?

Yes - its positive temperature coefficient of R_DS(on) (see Fig. 4) promotes current sharing. However, layout symmetry (matched gate and source inductance) and individual gate resistors (≥10 Ω) are required to prevent oscillation and ensure balanced dynamic current distribution.

IRLR3802TRLPBF Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: HEXFET®

Package/Case:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 12 V

Current - Continuous Drain (Id) @ 25°C:: 84A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 2.8V, 4.5V

Rds On (Max) @ Id, Vgs:: 8.5mOhm @ 15A, 4.5V

Vgs(th) (Max) @ Id:: 1.9V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 41 nC @ 5 V

Vgs (Max):: ±12V

Input Capacitance (Ciss) (Max) @ Vds:: 2490 pF @ 6 V

FET Feature:: -

Power Dissipation (Max):: 88W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: TO-252AA (DPAK)

IRLR3802TRLPBF FAQ

1.How can I place an order for IRLR3802TRLPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRLR3802TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRLR3802TRLPBF reliable?

The price and inventory of IRLR3802TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLR3802TRLPBF is usually 5 days.

3.What payment methods are accepted for IRLR3802TRLPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLR3802TRLPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRLR3802TRLPBF?

IRLR3802TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRLR3802TRLPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRLR3802TRLPBF?

For technical support, including IRLR3802TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLR3802TRLPBF requirements.

6.How does Aetrix verify that IRLR3802TRLPBF is sourced from the original manufacturer or authorized distributors?

All IRLR3802TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR3802TRLPBF meets industry standards.

7.What is the process for return or replacement of IRLR3802TRLPBF?

All IRLR3802TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLR3802TRLPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRLR3802TRLPBF part is unused and in its original packaging.

Return procedure for IRLR3802TRLPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.