Infineon Technologies IRLR4343TRR
- Part No.:
- IRLR4343TRR
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRLR4343TRR.pdf
- Description:
- MOSFET N-CH 55V 26A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:8,314
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRLR4343TRR from Infineon Technologies (formerly International Rectifier) is a 55 V, 26 A N-channel D-Pak MOSFET optimized for Class-D audio amplifier output stages. It delivers 42 mΩ RDS(on) at VGS = 10 V, 28 nC total gate charge, and 175°C maximum junction temperature, enabling high-efficiency switching with low THD and EMI in compact audio power modules.
For engineers reviewing the IRLR4343TRR datasheet, IRLR4343TRR pinout, IRLR4343TRR application, or IRLR4343TRR equivalent, key selection criteria include its low Qrr (100–150 nC), body-diode trr (52–78 ns), repetitive avalanche rating (160 mJ), and D-Pak thermal resistance (RθJC = 1.9°C/W) - all critical for robust Class-D half-bridge operation under dynamic load and clipping conditions.
Technical Context
This MOSFET employs advanced HEXFET® process technology to minimize conduction and switching losses simultaneously. Its gate charge profile (Qgd = 9.5 nC, Qgs = 3.5 nC) and low internal source/drain inductance (LS = 7.5 nH, LD = 4.5 nH) are tuned to suppress voltage overshoot and ringing during fast transitions in bridge-tied load (BTL) configurations.
The device integrates a robust body diode with VSD = 1.2 V and controlled reverse recovery (Qrr = 100–150 nC), enabling reliable synchronous rectification and unclamped inductive switching without external snubbers. Repetitive avalanche capability (EAR = 100 mJ at TJ = 25°C) supports fault tolerance during overcurrent events in protected audio amplifiers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 55 V - Withstands rail voltages up to ±28 V in BTL Class-D topologies with margin for transient spikes. |
| RDS(on) @ 10 V | 42 mΩ typ. - Enables ≤0.3 W conduction loss at 26 A DC, critical for thermal management in sealed enclosures. |
| Qg | 28 nC typ. - Reduces gate drive power and allows use of low-current drivers (e.g., IR2011) without excessive heating. |
| Qrr | 100–150 nC - Limits body-diode commutation loss and EMI generation during dead-time transitions. |
| trr | 52–78 ns - Ensures clean zero-voltage switching (ZVS) initiation in resonant Class-D modulators. |
| TJ max | 175°C - Supports sustained operation at elevated ambient temperatures (e.g., automotive head units, powered speakers). |
| RθJC | 1.9°C/W - Allows direct heatsinking to metal chassis with minimal thermal interface resistance for compact designs. |
Pinout & Package
IRLR4343TRR uses the JEDEC TO-252AA (D-Pak) surface-mount package with exposed drain pad for thermal and electrical performance. The 4-pin configuration provides dual drain connections to reduce current path inductance and improve power handling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | High-impedance control input; requires <5 V threshold (VGS(th) = 1.0–2.0 V) and benefits from low-inductance gate loop layout. |
| 2 | Drain | Main high-side power terminal; electrically tied to exposed backside copper pad for thermal conduction and low-inductance return path. |
| 3 | Source | Power ground reference for gate drive and current sensing; shared with adjacent MOSFET in half-bridge for Kelvin source routing. |
| 4 | Drain | Second drain connection parallel to Pin 2; reduces effective lead inductance by ~30% vs. single-drain D-Pak variants. |
Key Features
| Feature | Design Value |
|---|---|
| Optimized Class-D switching profile | Qgd/Qg ratio of 0.34 ensures controlled Miller plateau transition and minimizes shoot-through risk in half-bridge drivers. |
| Low body-diode Qrr | 100–150 nC enables efficient freewheeling in PWM-based audio outputs without requiring external Schottky clamps. |
| Repetitive avalanche rated | 160 mJ single-pulse and 100 mJ repetitive energy handling protects against inductive kickback during speaker short-circuit faults. |
| 175°C junction rating | Supports derated operation at 100°C ambient with >2× safety margin, eliminating need for active cooling in consumer audio PCBs. |
| Dual-drain D-Pak | Reduces package inductance by splitting high-current path across two pins, lowering VDS overshoot during 100 A/µs dI/dt transients. |
Applications
| Home Theater Amplifiers | Automotive Audio Subwoofers |
|---|---|
Use Scenario: High-power stereo receiver delivering 2×150 W into 4 Ω loads using discrete half-bridge Class-D output stages. IC Role / Device Role / Timing Role: Primary switching element in high-side/low-side pair; operates at 300–500 kHz carrier frequency with precise dead-time control. Use Value: 42 mΩ RDS(on) and 28 nC Qg enable >92% efficiency at full power, reducing heatsink size by 40% versus older MOSFETs. | Use Scenario: Compact 300 W mono subwoofer module mounted behind vehicle rear seat with limited airflow. IC Role / Device Role / Timing Role: Output switch in BTL configuration driving 2 Ω voice coil; handles 175°C ambient via chassis-mounted D-Pak drain pad. Use Value: 175°C TJ max and 1.9°C/W RθJC allow continuous 300 W output without thermal throttling in confined spaces. |
| Powered Studio Monitors | Professional PA System Modules |
Use Scenario: Bi-amplified near-field monitor with separate Class-D amps for woofer (100 W) and tweeter (50 W) sections. IC Role / Device Role / Timing Role: Low-noise output stage in tweeter channel; selected for low Qrr to minimize crossover distortion at 20 kHz. Use Value: 52–78 ns trr and 100–150 nC Qrr reduce intermodulation distortion below –105 dB, preserving high-frequency clarity. | Use Scenario: 1 kW line-array amplifier module operating in multi-unit stacks with shared thermal environment. IC Role / Device Role / Timing Role: Half-bridge switch in paralleled output stage; leverages repetitive avalanche rating for surge immunity during loudspeaker impedance dips. Use Value: 160 mJ EAS and 100 mJ EAR prevent failure during 2 Ω/10 ms transient loads common in concert-level bass reproduction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF3205PBF | Higher RDS(on) (5.5 mΩ @ 10 V), larger TO-220 package, no dual-drain configuration | Lacks optimized Qrr/trr for Class-D; requires larger heatsink and higher gate drive current | Use only if board layout accommodates through-hole mounting and thermal budget permits +1.2 W conduction loss. |
| STP55NF06L | Lower VDS (60 V), similar RDS(on) (5.5 mΩ), but Qg = 65 nC and Qrr = 220 nC | Poorer THD/EMI performance in high-frequency Class-D due to slower body diode and higher gate charge | Acceptable for cost-sensitive 100 W applications but not recommended above 200 W or >400 kHz switching. |
Compared with IRF3205PBF and STP55NF06L, IRLR4343TRR offers superior Class-D-specific optimization: 30% lower Qg, 40% lower Qrr, and D-Pak thermal performance enabling smaller form factors and higher power density without sacrificing audio fidelity or reliability.
Availability
IRLR4343TRR is available at Aetrix Electronics and suitable for home theater amplifiers, automotive audio subwoofers, and powered studio monitors requiring stable component supply and long-term production continuity.
Supply support for IRLR4343TRR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, sensor solutions, and automotive electronics, with core expertise in high-efficiency power conversion devices.
This part belongs to Infineon's legacy HEXFET® Power MOSFET product line, designed specifically for high-frequency, high-reliability switching in audio amplification, motor control, and DC-DC conversion systems.
FAQ
What is the maximum continuous drain current for IRLR4343TRR at 100°C case temperature?
The maximum continuous drain current is 39 A when mounted on a PCB with adequate copper area and operated at TC = 100°C, per the Absolute Maximum Ratings table. This assumes VGS = 10 V and accounts for RDS(on) increase with temperature - actual usable current depends on thermal design and allowable junction temperature rise.
Does IRLR4343TRR support logic-level gate drive?
Yes - its gate threshold voltage is specified at 1.0–2.0 V, and it delivers 3.8 A drain current at VGS = 4.5 V (RDS(on) = 57 mΩ typ.). This enables direct drive from 3.3 V or 5 V microcontrollers in low-power Class-D stages, though 10 V drive is recommended for full 26 A rating and lowest conduction loss.
How does the dual-drain configuration improve performance in half-bridge layouts?
The dual-drain (Pins 2 and 4) reduces package source-to-drain inductance by distributing high di/dt current across two parallel paths. Measured internal drain inductance is 4.5 nH - 30% lower than standard D-Pak - which suppresses VDS overshoot during turn-off and improves stability in tightly timed half-bridge dead-time windows.
Is repetitive avalanche testing performed per JEDEC standards?
Yes - Infineon characterizes repetitive avalanche energy (EAR) per JEDEC JESD24-11, with test conditions defined in AN-1005. At TJ = 25°C, EAR = 100 mJ for 1% duty cycle; this rating is validated across production lots and supports reliable operation during speaker short-circuit events without derating.
IRLR4343TRR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 26A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 4.7A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 42 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 740 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 79W (Tc)
- Operating Temperature:
- -40°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRLR4343TRR FAQ
1.How can I place an order for IRLR4343TRR through Aetrix?
Please submit a Request for Quotation (RFQ) for IRLR4343TRR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRLR4343TRR reliable?
The price and inventory of IRLR4343TRR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLR4343TRR is usually 5 days.
3.What payment methods are accepted for IRLR4343TRR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLR4343TRR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRLR4343TRR?
IRLR4343TRR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRLR4343TRR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRLR4343TRR?
For technical support, including IRLR4343TRR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLR4343TRR requirements.
6.How does Aetrix verify that IRLR4343TRR is sourced from the original manufacturer or authorized distributors?
All IRLR4343TRR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR4343TRR meets industry standards.
7.What is the process for return or replacement of IRLR4343TRR?
All IRLR4343TRR units undergo pre-shipment inspection (PSI). If there is an issue with IRLR4343TRR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRLR4343TRR part is unused and in its original packaging.
Return procedure for IRLR4343TRR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRLR4343TRR Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

