Infineon Technologies IRLR7821TRPBF
- Part No.:
- IRLR7821TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRLR7821TRPBF.pdf
- Description:
- MOSFET N-CH 30V 65A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:6,001
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Product details
Overview
IRLR7821TRPBF from Infineon Technologies is a 30V, 7.5mΩ (typ), 65A N-channel D-Pak power MOSFET optimized for high-frequency synchronous buck converters in CPU core voltage regulation and telecom DC-DC modules. It features ultra-low gate charge (10nC typ), 2.0°C/W junction-to-case thermal resistance, and fully characterized avalanche capability (230mJ single-pulse).
For engineers reviewing the IRLR7821TRPBF datasheet, IRLR7821TRPBF pinout, IRLR7821TRPBF application, or IRLR7821TRPBF equivalent, key selection criteria include RDS(on) at 4.5V VGS, Qg/Qgd ratio for Cdv/dt immunity, body diode reverse recovery (Qrr = 15–23nC), and SOA limits under repetitive switching at TC = 100°C.
Technical Context
This HEXFET device uses planar vertical DMOS structure with optimized cell pitch and trench-free gate oxide to achieve low RDS(on) while maintaining robust 30V breakdown (BVDSS ≥ 30V) and tight VGS(th) distribution (1.0–2.5V). Its gate threshold exhibits negative temperature coefficient (−5.3mV/°C), enabling stable current sharing in parallel configurations.
Designed for synchronous rectification, it delivers low conduction loss (Pcond = Irms² × RDS(on)) and minimized switching loss via low Qgd (2.5nC) and Qoss (8.5nC), critical for efficiency above 500kHz in isolated forward and LLC topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V - Maximum blocking voltage compatible with 24V input rails and transient overvoltage margins in telecom systems. |
| RDS(on) @ 4.5V | 10mΩ max - Enables efficient operation directly from 5V gate drivers without level-shifting in low-voltage synchronous FETs. |
| Qg | 10nC typ - Reduces gate drive power loss and enables fast turn-on with standard PWM controllers (e.g., IR35201). |
| Qgd/Qgs1 | 2.5nC / 2.0nC - Low ratio minimizes Cdv/dt induced turn-on risk in high-dV/dt node applications like half-bridge outputs. |
| TJ max | +175°C - Supports continuous operation in thermally constrained server VRMs and industrial DC-DC modules. |
| EAS | 230mJ - Withstands unclamped inductive energy during startup/fault conditions without failure in synchronous rectifier circuits. |
| Qrr | 15–23nC - Limits cross-conduction losses and stress on control FET during body diode commutation in buck converters. |
Pinout & Package
D-Pak (TO-252AA) package with exposed drain pad for low thermal resistance (RθJC = 2.0°C/W) and high-current PCB mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (S) | Low-side reference node; connects to ground plane or output inlay for minimal loop inductance. |
| Pin 2 (Gate) | Control input (G) | High-impedance MOS gate requiring <2.0nC pre-threshold charge for reliable 4.5V logic-level drive. |
| Pin 3 (Drain) | Power output (D) | Exposed copper pad tied to internal drain; must be soldered to large copper area for thermal and current handling. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) at 4.5V | 10mΩ max enables direct 5V gate drive in synchronous rectifiers without bootstrap complexity. |
| Low Qgd/Qgs1 ratio | 1.25 supports stable operation in high-dV/dt nodes (e.g., secondary side of flyback or LLC converters). |
| Characterized avalanche energy | 230mJ single-pulse rating allows safe operation under unclamped inductive switching stress. |
| Optimized body diode | Qrr = 15–23nC and trr = 26–38ns reduce shoot-through risk and improve light-load efficiency. |
| Lead-free D-Pak | RoHS-compliant TO-252AA package with 2.0°C/W RθJC supports high-power density designs up to 75W per device. |
Applications
| Server CPU Core VRM | Telecom 48V-to-12V Isolated DC-DC |
|---|---|
Use Scenario: High-current, multi-phase buck converter supplying 1.0V/150A to modern x86 processors with <1% voltage ripple. IC Role / Device Role / Timing Role: Synchronous FET operating at 500–1000kHz, replacing Schottky diodes to reduce conduction loss and improve efficiency >92%. Use Value: 7.5mΩ RDS(on) at 4.5V reduces I²R loss by 40% vs. legacy 15mΩ devices, lowering thermal load on VRM heatsinks. | Use Scenario: Secondary-side synchronous rectifier in active-clamp forward converter delivering 12V/20A from 48V telecom input. IC Role / Device Role / Timing Role: Low-side switch clamped between transformer secondary and output capacitor, driven by self-driven or controller-synchronized gate signal. Use Value: 230mJ EAS withstands leakage inductance spikes during reset, eliminating need for external snubbers. |
| Industrial PLC Power Module | Automotive ADAS Camera Power Supply |
Use Scenario: 24V-to-5V non-isolated buck regulator powering FPGA, ADCs, and communication interfaces in programmable logic controllers. IC Role / Device Role / Timing Role: Main power switch operating at 300kHz with forced-air cooling, supporting 100% duty cycle capability via low RDS(on). Use Value: 175°C TJ max and −5.3mV/°C VGS(th) drift ensure stable current sharing across parallel devices in extended ambient environments. | Use Scenario: Compact 12V-to-3.3V point-of-load converter powering image sensor and ISP in automotive rear-view camera module. IC Role / Device Role / Timing Role: Synchronous rectifier in monolithic buck IC or discrete controller-based design meeting AEC-Q101 stress requirements. Use Value: Lead-free D-Pak package passes vibration and thermal cycling tests; Qrr < 23nC prevents false triggering during cold-crank transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLR3714TRPBF | RDS(on) = 12mΩ @ 4.5V; Qg = 12nC; same D-Pak package | Slightly higher conduction loss but identical footprint and drive compatibility | Select when marginally higher RDS(on) is acceptable for cost-sensitive industrial designs. |
| SI7842DP-T1-GE3 | RDS(on) = 8.5mΩ @ 4.5V; Qg = 14nC; SO-8 package (not D-Pak) | Lower RDS(on) but requires PCB redesign due to different thermal pad layout and pinout | Choose only if board space allows SO-8 integration and thermal performance justifies re-layout. |
Compared with IRLR3714TRPBF and SI7842DP-T1-GE3, the IRLR7821TRPBF offers optimal balance of low RDS(on), moderate Qg, and D-Pak thermal performance-making it preferred for high-current, high-reliability synchronous rectification where footprint and thermal management are fixed constraints.
Availability
IRLR7821TRPBF is available at Aetrix Electronics and suitable for server VRMs, telecom DC-DC converters, and industrial PLC power modules requiring stable component supply and long-term lifecycle support.
Supply support for IRLR7821TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The IRLR7821TRPBF belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-frequency DC-DC conversion in computing, communications, and industrial power systems.
FAQ
Is IRLR7821TRPBF suitable for 4.5V gate drive without level-shifting?
Yes. Its guaranteed RDS(on) ≤ 10mΩ at VGS = 4.5V and VDS = 12A confirms full enhancement at logic-level drive. The 1.0–2.5V VGS(th) range ensures reliable turn-on even with ±10% supply tolerance, eliminating need for gate boosters in most 5V-controlled buck stages.
What is the maximum continuous drain current at 100°C case temperature?
The datasheet specifies 47A continuous drain current at TC = 100°C with VGS = 10V. At 4.5V drive, derating applies: based on RDS(on) increase and thermal limits, practical continuous current is ~38A with 2-layer 2oz copper and 200mm² exposed drain pad.
Does IRLR7821TRPBF have avalanche ruggedness rated for repetitive operation?
No. While EAS = 230mJ is specified for single-pulse unclamped inductive switching, the datasheet does not define repetitive avalanche energy (EAR). Designers must avoid repeated avalanche events and use appropriate snubbing or clamp circuits in hard-switched topologies.
How does its body diode reverse recovery compare to Schottky alternatives?
The body diode has Qrr = 15–23nC and trr = 26–38ns-significantly lower than older MOSFETs but higher than SiC Schottkys. In synchronous rectification, this enables >90% efficiency at 500kHz, though Schottky diodes remain preferable in ultra-light-load (<5% load) scenarios due to zero Qrr.
IRLR7821TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 65A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 10mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1030 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 75W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRLR7821TRPBF FAQ
1.How can I place an order for IRLR7821TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRLR7821TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
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6.How does Aetrix verify that IRLR7821TRPBF is sourced from the original manufacturer or authorized distributors?
All IRLR7821TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR7821TRPBF meets industry standards.
7.What is the process for return or replacement of IRLR7821TRPBF?
All IRLR7821TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLR7821TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRLR7821TRPBF part is unused and in its original packaging.
Return procedure for IRLR7821TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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