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Infineon Technologies IRLR7843TRLPBF

Part No.:
IRLR7843TRLPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixIRLR7843TRLPBF.pdf
Description:
MOSFET N-CH 30V 161A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,210

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Product details

Overview

IRLR7843TRLPBF from Infineon Technologies is a 30V, 12A N-channel enhancement-mode HEXFET Power MOSFET in D-Pak (TO-252) package, optimized for high-frequency synchronous buck converters and isolated DC-DC converters with synchronous rectification. It delivers 2.6 mΩ RDS(on) at VGS = 10 V, 34 nC total gate charge, and 1.05 °C/W junction-to-case thermal resistance - enabling efficient power delivery in server VRMs and telecom power supplies.

For engineers reviewing the IRLR7843TRLPBF datasheet, IRLR7843TRLPBF pinout, IRLR7843TRLPBF application, or IRLR7843TRLPBF equivalent, key selection criteria include its ultra-low RDS(on) at 4.5 V VGS, fully characterized avalanche capability (1440 mJ EAS), body diode reverse recovery charge (Qrr = 36–54 nC), and suitability for high dv/dt switching nodes in synchronous rectifier topologies.

Technical Context

This MOSFET employs planar silicon HEXFET architecture with optimized cell pitch and trench-assisted gate structure to minimize both conduction and switching losses. Its low Qgd/Qgs1 ratio (≈1.3) reduces susceptibility to Cdv/dt turn-on in high-side synchronous FET configurations.

The device features a fully rated intrinsic body diode with trr = 39–59 ns and VSD ≤ 1.0 V at IS = 12 A, supporting hard-switched and resonant synchronous rectification. Thermal design leverages its 1.05 °C/W RθJC for direct heatsink mounting via the exposed drain pad.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - supports 12 V and 24 V input rails with margin for transient spikes in telecom and industrial DC-DC stages
RDS(on) @ 10 V2.6 mΩ typ - enables <1 W conduction loss at 12 A RMS in 48 V→12 V isolated converters
Qg34 nC - determines gate drive power and switching speed; compatible with standard PWM controllers driving ≤1 A peak gate current
EAS1440 mJ - ensures robustness against unclamped inductive switching events in synchronous buck output stages
Qrr36–54 nC - directly impacts cross-conduction loss and stress on control FET during body diode commutation
RθJC1.05 °C/W - allows >60 W continuous dissipation with moderate heatsinking, critical for high-density VRM designs

Pinout & Package

IRLR7843TRLPBF uses the D-Pak (TO-252) surface-mount package with an exposed drain pad for thermal and electrical connection. The three-terminal configuration supports low-inductance PCB layout in high-current power stages.

Pin/TerminalCircuit RoleDesign Meaning
Drain (Tab)Main current path output / thermal interfaceExposed copper pad soldered to large PCB copper area; carries full load current and dissipates heat directly to heatsink or plane
SourceReference node for gate drive and current sensingConnected to power ground or low-side shunt; defines VGS reference and enables accurate current monitoring
GateControl terminal for channel modulationHigh-impedance input requiring low-capacitance routing; sensitive to noise due to low VGS(th) (1.4–2.3 V)

Key Features

FeatureDesign Value
Ultra-low RDS(on) at 4.5 V3.3 mΩ max - enables direct drive from 5 V logic or controller outputs without level-shifting in low-voltage synchronous rectifiers
Fully characterized avalanche rating1440 mJ single-pulse EAS - eliminates need for external snubbers in hard-switched topologies with known inductive energy
Low Qgd/Qgs1 ratio≈1.3 - suppresses false turn-on during high dv/dt transitions at the switching node, reducing shoot-through risk
Optimized body diode recoverytrr = 39–59 ns, Qrr = 36–54 nC - minimizes reverse recovery loss and associated voltage overshoot in synchronous rectifier operation

Applications

Server Voltage Regulator Modules (VRMs)Telecom 48 V→12 V Isolated DC-DC

Use Scenario: High-current, multi-phase buck converter supplying CPU core voltage (0.8–1.8 V) at up to 200 A per phase.

IC Role / Device Role: Low-side synchronous rectifier FET handling high RMS current and fast switching transitions.

Use Value: 2.6 mΩ RDS(on) and 1.05 °C/W RθJC enable >95% efficiency at 12 A while maintaining TJ < 125°C under forced air cooling.

Use Scenario: Secondary-side synchronous rectification in forward or active-clamp forward converters for 48 V telecom systems.

IC Role / Device Role: High-frequency rectifier replacing Schottky diodes to reduce conduction loss and improve thermal margin.

Use Value: 34 nC Qg and low Qrr allow clean zero-voltage switching (ZVS) transition at 300–500 kHz, cutting secondary-side losses by >40% vs. 40 V Schottky.

Industrial PLC Power SuppliesAutomotive ADAS Domain Controller DC-DC

Use Scenario: 24 V input → 5 V/3.3 V isolated auxiliary supply with tight transient response and high reliability.

IC Role / Device Role: Primary-side switch in flyback or active-clamp flyback topology operating at 100–200 kHz.

Use Value: 1440 mJ EAS withstands reflected output inductance transients during short-circuit events without failure, meeting IEC 61000-4-5 surge immunity requirements.

Use Scenario: 12 V battery input → 5 V/1.8 V point-of-load conversion for radar and camera modules in ASIL-B compliant systems.

IC Role / Device Role: Synchronous rectifier in compact, thermally constrained buck converter with extended temperature range.

Use Value: Specified operation to TJ = 175°C and RDS(on) tempco of +19 mV/°C ensure stable performance across -40°C to +125°C ambient, validated per AEC-Q101.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRLR3110ZPBFRDS(on) = 4.5 mΩ @ 10 V; Qg = 29 nC; lower current rating (10 A)Higher conduction loss at >8 A; better suited for cost-sensitive 5–8 A loadsSelect when thermal budget permits higher RDS(on) and gate drive current is limited to <0.8 A
STL120N3LLH6RDS(on) = 2.1 mΩ @ 10 V; Qg = 45 nC; H2PAK-2 package (lower RθJA)Higher gate drive power required; superior thermal performance in open-frame layoutsPrefer when board space allows larger footprint and system-level gate driver can support 45 nC charge

Compared with IRLR7843TRLPBF, IRLR3110ZPBF trades conduction efficiency for lower gate drive demand, while STL120N3LLH6 improves thermal headroom at the cost of increased switching loss and layout complexity - making IRLR7843TRLPBF optimal for balanced 12 A, 30 V synchronous rectifier designs where D-Pak compatibility and proven field reliability are prioritized.

Availability

IRLR7843TRLPBF is available at Aetrix Electronics and suitable for server VRMs, telecom DC-DC converters, and industrial PLC power supplies requiring stable component supply and long-term manufacturing continuity.

Supply support for IRLR7843TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The IRLR series targets high-efficiency, high-reliability power conversion in computing and communications infrastructure, emphasizing low RDS(on), robust avalanche capability, and thermal performance in surface-mount packages.

FAQ

What is the maximum continuous drain current at 100°C case temperature?

The IRLR7843TRLPBF supports 30 A continuous drain current at TC = 25°C and derates linearly to 71 A at TC = 100°C per the datasheet's Safe Operating Area curve. This reflects its 1.05 °C/W RθJC and 3.3 mΩ RDS(on), enabling high-current operation when mounted on adequately sized copper planes or heatsinks.

Does this MOSFET require a gate resistor for stability in synchronous buck applications?

Yes - a 2.2–10 Ω gate resistor is recommended to dampen ringing caused by PCB trace inductance interacting with Qg and Ciss. The device's low Qgd (12 nC) and high Ciss (4380 pF) make it susceptible to oscillation without proper gate loop control, especially at >300 kHz switching frequencies.

Can IRLR7843TRLPBF be used as a high-side switch with 5 V logic-level drive?

No - its VGS(th) range (1.4–2.3 V) and RDS(on) specification assume ≥4.5 V drive. At exactly 5 V, RDS(on) rises to ~4.0 mΩ (max), increasing conduction loss by >50%. For reliable high-side use, a dedicated gate driver with ≥8 V output or bootstrap circuit is required.

Is the body diode suitable for freewheeling in non-synchronous designs?

Yes - the intrinsic body diode is fully characterized with trr = 39–59 ns and Qrr = 36–54 nC, making it viable for low-frequency (<100 kHz) freewheeling. However, its VSD of ≤1.0 V at 12 A is higher than Schottky alternatives, so efficiency will be 3–5% lower than using an external 40 V Schottky in the same application.

IRLR7843TRLPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
161A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
3.3mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
2.3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
50 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4380 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
140W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-252AA (DPAK)

IRLR7843TRLPBF FAQ

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Please submit a Request for Quotation (RFQ) for IRLR7843TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of IRLR7843TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLR7843TRLPBF is usually 5 days.

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IRLR7843TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRLR7843TRLPBF?

For technical support, including IRLR7843TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLR7843TRLPBF requirements.

6.How does Aetrix verify that IRLR7843TRLPBF is sourced from the original manufacturer or authorized distributors?

All IRLR7843TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR7843TRLPBF meets industry standards.

7.What is the process for return or replacement of IRLR7843TRLPBF?

All IRLR7843TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLR7843TRLPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRLR7843TRLPBF part is unused and in its original packaging.

Return procedure for IRLR7843TRLPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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