Infineon Technologies IRLR8103VTRLPBF
- Part No.:
- IRLR8103VTRLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRLR8103VTRLPBF.pdf
- Description:
- MOSFET N-CH 30V 91A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:7,115
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Product details
Overview
IRLR8103VTRLPBF from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode power MOSFET in D-Pak (TO-252) package, rated for 30 V VDS, 7.9 mΩ RDS(on) at VGS = 4.5 V, 27 nC total gate charge, and 91 A continuous drain current at TC = 25°C. It is engineered for synchronous buck converters in CPU core power delivery.
For engineers reviewing the IRLR8103VTRLPBF datasheet, IRLR8103VTRLPBF pinout, IRLR8103VTRLPBF application, or IRLR8103VTRLPBF equivalent, key selection criteria include low RDS(on)/QG ratio, body diode Qrr = 103 nC, Ciss = 2672 pF, and thermal resistance RθJC = 1.09 °C/W - all critical for high-efficiency, high-frequency DC-DC converter design.
Technical Context
This MOSFET employs HEXFET technology optimized for synchronous rectification in single-phase and multiphase CPU VRMs. Its gate threshold voltage (1.0–3.0 V) enables direct drive from 3.3 V or 5 V controllers, and its low Qsw (12 nC) and QOSS (29 nC) minimize switching losses at >500 kHz operation.
The device features a robust body diode with VSD = 0.9–1.3 V at 15 A and reverse recovery charge Qrr = 103 nC under di/dt = 700 A/µs, supporting hard-switched and synchronous FET configurations without external Schottky assist in many designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - supports 12 V input rails with margin for transient spikes in CPU core supplies |
| RDS(on) | 7.9 mΩ @ VGS = 4.5 V - enables <1 W conduction loss at 15 A, reducing heatsink requirements |
| QG | 27 nC - determines gate driver power demand and switching speed in 300–1000 kHz VRMs |
| QSW | 12 nC - governs turn-on/turn-off energy loss during hard switching transitions |
| RθJC | 1.09 °C/W - allows >60 W power dissipation with moderate heatsinking on PCB copper |
| QOSS | 29 nC - impacts turn-off loss and resonant behavior in ZVS/ZCS topologies |
| ID (TC = 25°C) | 91 A - supports high-current single-FET phases in compact VRM layouts |
Pinout & Package
IRLR8103VTRLPBF uses the D-Pak (TO-252) surface-mount package with exposed drain pad for thermal and electrical performance. The package supports vapor phase, IR, convection, and wave soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (S) | Common return path for load current; tied to power ground plane in buck output stage |
| Pin 2 (Gate) | Control input (G) | Drives channel conduction; requires low-impedance gate driver due to 27 nC QG |
| Pin 3 (Drain) | Drain terminal (D) | Connected to input rail and inductor node; electrically and thermally coupled to large copper area |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on)/QG ratio | 0.29 Ω·nC - improves figure-of-merit for high-frequency, high-current synchronous FETs |
| 100% RG tested | RG = 0.8–3.1 Ω - ensures consistent gate drive timing and reduces risk of oscillation |
| Optimized for synchronous buck converters | Low QSW/QOSS and Cdv/dt-induced turn-on immunity - minimizes shoot-through and cross-conduction loss |
| Lead-free and RoHS-compliant | "PbF" suffix indicates lead-free termination - meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1) |
Applications
| Server CPU Core VRM | Laptop CPU Voltage Regulator |
|---|---|
Use Scenario: Single-phase or multi-phase buck converter delivering 0.8–1.5 V @ up to 120 A to Intel/AMD server CPUs. IC Role / Device Role / Timing Role: Synchronous rectifier (low-side FET) operating at 300–600 kHz with tight dead-time control. Use Value: 7.9 mΩ RDS(on) reduces conduction loss by >25% vs. legacy 12 mΩ devices, enabling higher efficiency at full load. | Use Scenario: Compact dual-phase VRM powering mobile processors in thin-and-light notebooks with strict thermal envelope. IC Role / Device Role / Timing Role: Control FET (high-side) driven directly from 5 V PWM controller with fast 10 ns td(on). Use Value: 27 nC QG and 1.09 °C/W RθJC allow high switching frequency without excessive gate drive loss or junction overheating. |
| GPU Power Delivery Module | ASIC Core Supply |
Use Scenario: High-current, low-voltage power stage for discrete or integrated GPUs requiring dynamic current slew rates >200 A/µs. IC Role / Device Role / Timing Role: Low-side synchronous FET handling bidirectional current during light-load discontinuous conduction mode (DCM). Use Value: Body diode Qrr = 103 nC and VSD = 0.9 V enable efficient freewheeling with minimal reverse recovery loss. | Use Scenario: Point-of-load regulator for AI accelerator ASICs with 0.6–0.85 V output and peak currents >80 A. IC Role / Device Role / Timing Role: Primary power switch in interleaved 3-phase buck topology operating at 1 MHz. Use Value: Ciss = 2672 pF and Crss = 109 pF provide stable Miller plateau behavior and predictable gate drive timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLR8729PBF | RDS(on) = 4.5 mΩ @ 4.5 V, QG = 22 nC, VDS = 30 V - lower on-resistance but higher cost and same package | Better suited for ultra-high-efficiency single-phase VRMs where <5 mΩ is required | Select when conduction loss dominates and board space permits identical D-Pak footprint |
| SI7850DP-T1-GE3 | RDS(on) = 8.5 mΩ @ 4.5 V, QG = 24 nC, RθJC = 1.2 °C/W - slightly higher RDS(on) and thermal resistance | Preferred in automotive infotainment power stages requiring AEC-Q101 qualification | Choose only if AEC-Q101 compliance is mandatory; otherwise IRLR8103VTRLPBF offers superior thermal performance |
Compared with IRLR8729PBF and SI7850DP-T1-GE3, the IRLR8103VTRLPBF delivers the best balance of low RDS(on), moderate QG, and industry-leading RθJC, making it optimal for cost-sensitive, thermally constrained server and laptop VRMs where 7–8 mΩ performance is sufficient.
Availability
IRLR8103VTRLPBF is available at Aetrix Electronics and suitable for server CPU core VRMs, laptop voltage regulators, GPU power modules, and ASIC point-of-load supplies requiring stable component supply across long production cycles.
Supply support for IRLR8103VTRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with heritage from International Rectifier's power MOSFET innovation.
The IRLR8103VTRLPBF belongs to Infineon's HEXFET® N-channel logic-level MOSFET product line, designed specifically for high-efficiency, high-density DC-DC conversion in computing and communications infrastructure.
FAQ
Is IRLR8103VTRLPBF suitable for 3.3 V gate drive?
Yes. With VGS(th) = 1.0–3.0 V and RDS(on) = 7.9 mΩ specified at VGS = 4.5 V, the device fully enhances under 3.3 V drive in most practical layouts - confirmed by typical transfer characteristics showing >50 A ID at VGS = 3.3 V and VDS = 100 mV. Layout-dependent gate ringing must be controlled.
What is the maximum safe operating area (SOA) limitation at 100°C case temperature?
At TC = 100°C, the absolute maximum continuous drain current is derated to 63 A per datasheet Fig 9. The SOA curve (Fig 8) shows that operation above 10 V VDS is limited by RDS(on) at pulse widths >1 ms, and by thermal limits at shorter pulses - confirming suitability for repetitive 100 µs pulses up to 91 A with proper heatsinking.
Does IRLR8103VTRLPBF require a gate resistor for stability?
Yes. Although RG is internally tested (0.8–3.1 Ω), external gate resistors (typically 2–10 Ω) are recommended to dampen parasitic oscillation caused by PCB trace inductance interacting with Ciss = 2672 pF and QGD = 9.7 nC. This ensures clean switching waveforms and prevents unintended turn-on during high dv/dt events.
Can IRLR8103VTRLPBF replace IRLR8103PBF in existing designs?
Yes - IRLR8103VTRLPBF is the tape-and-reel, lead-free version of IRLR8103PBF with identical electrical specifications, package dimensions, and thermal performance. The "VTRLPBF" suffix denotes Pb-free, halogen-free, and RoHS-compliant packaging; no layout or schematic changes are required for drop-in replacement.
IRLR8103VTRLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 91A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 9mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 27 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2672 pF @ 16 V
- FET Feature:
- -
- Power Dissipation (Max):
- 115W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRLR8103VTRLPBF FAQ
1.How can I place an order for IRLR8103VTRLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRLR8103VTRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRLR8103VTRLPBF reliable?
The price and inventory of IRLR8103VTRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLR8103VTRLPBF is usually 5 days.
3.What payment methods are accepted for IRLR8103VTRLPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLR8103VTRLPBF transactions.
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4.How is shipping managed for IRLR8103VTRLPBF?
IRLR8103VTRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRLR8103VTRLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRLR8103VTRLPBF?
For technical support, including IRLR8103VTRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLR8103VTRLPBF requirements.
6.How does Aetrix verify that IRLR8103VTRLPBF is sourced from the original manufacturer or authorized distributors?
All IRLR8103VTRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLR8103VTRLPBF meets industry standards.
7.What is the process for return or replacement of IRLR8103VTRLPBF?
All IRLR8103VTRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLR8103VTRLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRLR8103VTRLPBF part is unused and in its original packaging.
Return procedure for IRLR8103VTRLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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