Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies IRLU7843PBF

Part No.:
IRLU7843PBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-251-3 Short Leads, IPAK, TO-251AA
Datasheet:
AetrixIRLU7843PBF.pdf
Description:
MOSFET N-CH 30V 161A IPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,690

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IRLU7843PBF from Infineon Technologies is a 30V, 12A N-channel D-Pak power MOSFET optimized for high-frequency synchronous buck converters in CPU core voltage regulation and telecom DC-DC applications. It delivers 2.6 mΩ typical RDS(on) at VGS = 4.5V, 34 nC total gate charge, and fully characterized avalanche capability (1440 mJ EAS), enabling efficient low-side switching in compact, high-efficiency power stages.

For engineers reviewing the IRLU7843PBF datasheet, IRLU7843PBF pinout, IRLU7843PBF application, or IRLU7843PBF equivalent, key selection criteria include its ultra-low gate impedance, body diode reverse recovery charge (Qrr = 36–54 nC), junction-to-case thermal resistance (1.05 °C/W), and validated performance under clamped inductive switching at 125°C junction temperature.

Technical Context

This HEXFET device uses planar vertical DMOS technology with an integrated body diode optimized for synchronous rectification. Its gate threshold voltage (VGS(th) = 1.4–2.3 V) enables direct drive from 3.3V/5V controllers, while the low Qgd/Qgs1 ratio minimizes Cdv/dt turn-on risk in high-dV/dt switching nodes.

The MOSFET is characterized for linear derating above 25°C case temperature (0.95 W/°C), supports pulsed drain current up to 620 A, and maintains stable RDS(on) across -55°C to +175°C operating range-critical for automotive-grade transient robustness and industrial thermal cycling.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum blocking voltage compatible with 24V input rails and 12V output stages without derating.
RDS(on) @ 4.5V2.6 mΩ typ - Enables <1W conduction loss at 12A RMS in 12V/100A VRM designs.
Qg34 nC - Low gate charge reduces driver power and enables >1 MHz switching with standard gate drivers.
EAS1440 mJ - Single-pulse avalanche energy rating ensures reliability during load dump or short-circuit transients.
Qrr36–54 nC - Quantified reverse recovery charge enables accurate loss modeling in synchronous FET position.
RθJC1.05 °C/W - Enables direct heatsinking to PCB copper or external heatsink for 71W continuous dissipation at TC = 100°C.
ID @ 100°C71 A - Continuous current rating at elevated case temperature supports high-power density board layouts.

Pinout & Package

IRLU7843PBF is housed in a surface-mount D-Pak (TO-252AA) package with exposed drain pad for thermal and electrical connection. The package features gull-wing leads and is lead-free (PbF) compliant per JEDEC J-STD-020.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Source terminalLow-impedance return path for load current; tied to ground plane in low-side switch configuration.
Pin 2 (Gate)Control inputHigh-impedance MOSFET gate requiring <34 nC charge for full enhancement; sensitive to ESD and dV/dt coupling.
Pin 3 (Drain)Power outputExposed metal pad connected internally to drain; must be soldered to large copper area for thermal management and current conduction.

Key Features

FeatureDesign Value
Ultra-low RDS(on) at 4.5V2.6 mΩ typ - Enables use with 3.3V/5V PWM controllers without level-shifting, reducing BOM count.
Fully characterized avalanche1440 mJ EAS - Eliminates need for external snubbers in hard-switched topologies with inductive loads.
Optimized body diodeQrr = 36–54 nC, trr = 39–59 ns - Minimizes shoot-through risk and commutation losses in synchronous rectification.
Thermally enhanced D-PakRθJC = 1.05 °C/W - Supports >70W power handling with minimal heatsink area on 2oz copper PCB.

Applications

Server VRM Power StageTelecom 48V-to-12V DC-DC

Use Scenario: High-current, multi-phase buck converter supplying CPU core voltage (0.8–1.5V @ up to 200A).

IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET in each phase leg, switching at 500 kHz–1 MHz with precise dead-time control.

Use Value: 2.6 mΩ RDS(on) at 4.5V reduces conduction loss by 35% vs. legacy 5V-gate devices, improving full-load efficiency by ≥1.2%.

Use Scenario: Isolated forward or active-clamp forward converter delivering 12V/30A for base station RF modules.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier replacing Schottky diodes, driven by transformer-coupled gate signals.

Use Value: 1440 mJ EAS withstands reflected primary-side transients; Qrr < 54 nC prevents cross-conduction during zero-voltage switching transitions.

Industrial PLC Power SupplyAutomotive ADAS Camera Module

Use Scenario: Non-isolated buck converter powering 5V/3A logic and analog circuitry in programmable logic controllers.

IC Role / Device Role / Timing Role: Primary low-side switch in 200 kHz fixed-frequency regulator with overcurrent protection.

Use Value: -55°C to +175°C TJ rating ensures operation in sealed enclosures; 620 A pulsed ID supports 10× overload fault clearing.

Use Scenario: Compact 12V-to-3.3V point-of-load regulator for image sensor and ISP in rear-view camera systems.

IC Role / Device Role / Timing Role: High-efficiency synchronous buck FET operating in automotive ambient (-40°C to +105°C case).

Use Value: RDS(on) drift <15% from 25°C to 125°C ensures stable efficiency across temperature; PbF compliance meets automotive RoHS requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRLR7843PbFSame die, I-Pak package; RθJA = 110 °C/W (vs. 50 °C/W for D-Pak); higher thermal resistance limits power density.Better suited for through-hole prototyping or lower-power (<30W) applications where manual assembly is preferred.Select when mechanical mounting stability outweighs thermal performance, or when existing I-Pak footprint is locked.
SiR872DP-T1-GE330V, 12A TrenchFET; RDS(on) = 2.9 mΩ @ 4.5V; Qg = 29 nC; no published EAS rating.Lacks documented avalanche ruggedness; requires external clamping in inductive switching circuits.Prefer for cost-sensitive consumer applications where transient stress is controlled by system-level design.

Compared with IRLU7843PBF, IRLR7843PbF trades thermal performance for mechanical robustness, while SiR872DP offers lower gate charge but no guaranteed avalanche capability-making IRLU7843PBF the optimal choice for unclamped inductive loads and high-reliability industrial power stages.

Availability

IRLU7843PBF is available at Aetrix Electronics and suitable for server VRM power stages, telecom DC-DC converters, and industrial PLC power supplies requiring stable component supply and long-term manufacturability.

Supply support for IRLU7843PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

The HEXFET Power MOSFET product line was developed specifically for high-efficiency, high-frequency switching applications in computing, telecom, and industrial power conversion-emphasizing low RDS(on), fast switching, and rugged avalanche performance.

FAQ

What is the maximum continuous drain current at 100°C case temperature?

The IRLU7843PBF supports 71 A continuous drain current at TC = 100°C with VGS = 10 V, as specified in the Absolute Maximum Ratings table. This rating assumes proper PCB copper area for heat spreading and accounts for linear derating beyond 25°C at 0.95 W/°C.

Does this MOSFET require a gate resistor for safe operation in a 1 MHz buck converter?

Yes-a gate resistor (typically 2–10 Ω) is recommended to dampen ringing and limit peak gate current during fast switching. With 34 nC Qg and typical driver rise times <20 ns, uncontrolled gate drive can cause overshoot exceeding ±20 V, risking gate oxide damage or spurious turn-on.

Can the body diode be used for freewheeling in non-synchronous designs?

Yes-the intrinsic body diode is rated for 161 A continuous source current and 620 A pulsed current, with VSD ≤ 1.0 V at 12 A. However, its 39–59 ns reverse recovery time and 36–54 nC Qrr make it less efficient than Schottky diodes in high-frequency freewheeling; synchronous operation is strongly preferred.

Is the D-Pak package suitable for reflow soldering per IPC-J-STD-020?

Yes-the IRLU7843PBF is qualified for lead-free reflow per JEDEC J-STD-020D, with peak temperature tolerance of 260°C for 10 seconds. The exposed drain pad must be stencil-printed with sufficient solder paste volume (≥120% coverage) to ensure void-free thermal interface and mechanical integrity.

IRLU7843PBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-251-3 Short Leads, IPAK, TO-251AA
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
161A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
3.3mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
2.3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
50 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4380 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
140W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
IPAK (TO-251AA)

IRLU7843PBF FAQ

1.How can I place an order for IRLU7843PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRLU7843PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRLU7843PBF reliable?

The price and inventory of IRLU7843PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRLU7843PBF is usually 5 days.

3.What payment methods are accepted for IRLU7843PBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRLU7843PBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRLU7843PBF?

IRLU7843PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRLU7843PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRLU7843PBF?

For technical support, including IRLU7843PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRLU7843PBF requirements.

6.How does Aetrix verify that IRLU7843PBF is sourced from the original manufacturer or authorized distributors?

All IRLU7843PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRLU7843PBF meets industry standards.

7.What is the process for return or replacement of IRLU7843PBF?

All IRLU7843PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRLU7843PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRLU7843PBF part is unused and in its original packaging.

Return procedure for IRLU7843PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IRLU7843PBF Tags

  • IRLU7843PBF
  • IRLU7843PBF PDF
  • IRLU7843PBF Datasheet
  • IRLU7843PBF Specifications
  • IRLU7843PBF Images
  • Infineon Technologies
  • Infineon Technologies IRLU7843PBF
  • Buy IRLU7843PBF
  • IRLU7843PBF Price
  • IRLU7843PBF Distributor
  • IRLU7843PBF Supplier
  • IRLU7843PBF Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER