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Renesas ISL2111ABZ

Part No.:
ISL2111ABZ
Manufacturer:
Renesas
Category:
Gate Drivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixISL2111ABZ.pdf
Description:
IC GATE DRVR HALF-BRIDGE 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,966

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Product details

Overview

ISL2111ABZ from Renesas Electronics is a 100V, high-frequency half-bridge N-channel MOSFET driver IC in an 8-lead SOIC package, delivering 3A peak pull-up and 4A peak pull-down output current, with 8V–14V VDD supply range and TTL/3.3V-compatible inputs. It drives high-side and low-side power MOSFETs in telecom DC/DC converters and active-clamp forward topologies.

For engineers reviewing the ISL2111ABZ datasheet, ISL2111ABZ pinout, ISL2111ABZ application, or ISL2111ABZ equivalent, key selection criteria include bootstrap diode integration (1W rating), 9ns/7.5ns rise/fall times into 1nF load, -40°C to +125°C operating temperature, and SOIC package compliance with IPC-2221 100V conductor spacing guidelines.

Technical Context

The ISL2111ABZ implements independent CMOS/TTL-level inputs (HI/LI) with no internal cross-coupling, enabling flexible PWM or complementary control schemes. Its level-shifted high-side driver uses a robust bootstrap architecture with on-chip 1W diode and supports up to 114V HB voltage relative to HS.

Undervoltage lockout (UVLO) operates at 6.6V (rising) on VDD with 0.6V hysteresis and 6.1V (rising) on HB with matching hysteresis, ensuring reliable startup and fault recovery. Propagation delays are tightly matched: tMON ≤ 8ns and tMOFF ≤ 6ns (typical), minimizing shoot-through risk in high-frequency switching.

Key Specifications

ParameterValue and Actual Design Meaning
VDD Range8V to 14V - enables operation from standard 12V rails while supporting derated use down to 8V for brownout resilience
Peak Output Current3A pull-up / 4A pull-down - eliminates need for external totem-pole buffers in most 100V half-bridge designs
Rise/Fall Time9ns / 7.5ns into 1nF - supports multi-MHz switching frequencies with minimal gate drive loss
Input ThresholdsVIH = 1.8V, VIL = 1.4V (TTL/3.3V compatible) - ensures direct interfacing with microcontrollers and PWM controllers
Bootstrap DiodeOn-chip 1W diode with VF = 0.7V @ 100mA - reduces BOM count and improves thermal reliability vs discrete bootstrap solutions
Operating Temp-40°C to +125°C - qualified for industrial and telecom power supply environments
HS Voltage Rating100V continuous, 105V transient (<100ns) - supports primary-side switching in isolated DC/DC converters

Pinout & Package

ISL2111ABZ is housed in an 8-lead narrow-body SOIC package (M8.15), RoHS-compliant, with 100V conductor spacing per IPC-2221. The exposed pad is absent in this SOIC variant.

Pin/TerminalCircuit RoleDesign Meaning
1. VDDPositive supply for low-side driver and logicBypass to VSS with ≥1µF ceramic capacitor; powers internal UVLO and input buffers
2. HBHigh-side bootstrap supply nodeConnects to positive terminal of external bootstrap capacitor; integrates 1W diode from VDD
3. HOHigh-side gate driver outputDrives gate of high-side N-MOSFET; referenced to HS, not VSS
4. HSHigh-side source connectionConnects to source of high-side MOSFET and negative terminal of bootstrap capacitor
5. LOLow-side gate driver outputDrives gate of low-side N-MOSFET; referenced to VSS (ground)
6. LILow-side inputTTL/3.3V-compatible digital input controlling LO; no hysteresis
7. HIHigh-side inputTTL/3.3V-compatible digital input controlling HO; no hysteresis
8. VSSChip ground referenceReturn path for VDD, LO, and logic; must be low-inductance connection to system ground

Key Features

FeatureDesign Value
Integrated bootstrap diode1W rating with 0.7V forward drop @ 100mA - eliminates external diode, saves board space, improves thermal margin
Independent HI/LI inputsNo internal logic coupling - allows asymmetric PWM, dead-time insertion, or external protection circuitry
Robust noise immunityOutputs unaffected by HS ringing below ground or high dv/dt slewing - prevents false turn-on in hard-switching applications
Supply glitch toleranceOutputs remain stable during VDD transients - avoids unintended MOSFET switching during line dips or surges
Wide VDD operating range8V minimum - supports operation under brownout conditions where many drivers fail to start or latch

Applications

Telecom Half-Bridge DC/DC ConvertersTwo-Switch Forward Converters

Use Scenario: Primary-side power stage in 48V-input telecom rectifiers delivering 12V/3.3V outputs at >300kHz switching frequency.

IC Role / Device Role / Timing Role: Half-bridge gate driver providing independent, fast, high-current drive to two N-channel MOSFETs in phase-leg configuration.

Use Value: 3A/4A peak current and 9ns/7.5ns switching times reduce conduction and switching losses, improving efficiency above 94% at full load.

Use Scenario: High-efficiency 48V-to-12V isolated DC/DC module for base station power distribution with synchronous rectification.

IC Role / Device Role / Timing Role: Low-side and high-side gate driver coordinating main switch and auxiliary switch timing in non-isolated forward topology.

Use Value: Independent HI/LI inputs enable precise dead-time control, preventing shoot-through while maintaining ZVS capability across load range.

Active-Clamp Forward ConvertersClass-D Audio Amplifiers

Use Scenario: High-density 54V-input server PSU using active-clamp forward architecture for improved light-load efficiency and reduced EMI.

IC Role / Device Role / Timing Role: Gate driver for main power switch and active-clamp switch, managing high dv/dt transitions at HS node.

Use Value: 100V HS rating and immunity to HS slewing ensure reliable clamp switch timing even during 30V/ns transients.

Use Scenario: 200W bridge-tied load (BTL) audio amplifier with >500kHz carrier frequency for digital input class-D modulation.

IC Role / Device Role / Timing Role: Half-bridge driver delivering high-speed, high-current gate signals to output H-bridge MOSFETs.

Use Value: Matched propagation delays (tMON ≤ 8ns, tMOFF ≤ 6ns) minimize crossover distortion and improve THD+N performance below 0.05%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISL2111AR4ZSame electrical specs, but in 12-lead 4×4mm DFN package with exposed pad for enhanced thermal performance (θJA = 39°C/W vs SOIC's 95°C/W)Preferred for high-power density or thermally constrained PCB layouts where SOIC footprint is insufficientSelect ISL2111AR4Z when junction temperature must stay <125°C under >2.5W dissipation; requires re-layout for DFN land pattern
IRS21844PbF4A/4A peak current, 10–20V VDD range, no integrated bootstrap diode, different pinout (HO/LO swapped), higher quiescent current (0.5mA vs 0.3mA)Requires external bootstrap diode and careful layout to match ISL2111ABZ's noise immunity and propagation matchingChoose IRS21844PbF only if legacy design reuse or cost sensitivity outweighs benefits of integrated diode and tighter delay matching

Compared with ISL2111AR4Z, the ISL2111ABZ offers identical functionality in a through-hole-compatible SOIC package ideal for prototyping and lower-power applications, while IRS21844PbF demands additional components and layout effort to achieve comparable robustness-making ISL2111ABZ the preferred choice for new designs prioritizing integration and noise immunity.

Availability

ISL2111ABZ is available at Aetrix Electronics and suitable for telecom power supplies, server PSUs, and industrial DC/DC converters requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for ISL2111ABZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT applications.

The ISL2111ABZ belongs to Renesas' high-voltage gate driver product line, engineered specifically for efficient, reliable switching in isolated DC/DC topologies operating up to 100V with demanding noise and thermal requirements.

FAQ

What is the maximum bootstrap capacitor voltage rating supported by the ISL2111ABZ?

The ISL2111ABZ supports a maximum bootstrap supply voltage (HB) of 114VDC relative to HS. This is specified in the Absolute Maximum Ratings table and validated across temperature. The device maintains safe operation up to this voltage when the external bootstrap capacitor is rated accordingly. Designers must ensure the capacitor's voltage rating exceeds 114V with sufficient margin for transients. The ISL2111ABZ itself does not regulate HB voltage-it relies on proper external capacitor selection and layout to avoid overstress.

Does the ISL2111ABZ require external bootstrap diodes?

No, the ISL2111ABZ integrates a 1W on-chip bootstrap diode between VDD and HB pins. This eliminates the need for an external diode in standard half-bridge configurations. The diode has a typical forward voltage of 0.7V at 100mA and dynamic resistance of 0.7Ω. Using the internal diode simplifies layout, reduces component count, and improves thermal reliability compared to discrete solutions. External diodes are unnecessary unless special high-reliability redundancy or ultra-low VF requirements exist.

What is the purpose of the HS pin on the ISL2111ABZ?

The HS (High-Side Source) pin on the ISL2111ABZ serves as the return path for the high-side driver and the negative terminal connection point for the external bootstrap capacitor. It must be connected directly to the source of the high-side N-channel MOSFET. This pin establishes the local ground reference for the high-side output (HO), enabling level-shifting functionality. Proper low-inductance routing of HS is critical to prevent shoot-through and ensure clean switching-especially under high dv/dt conditions where ringing can falsely trigger the high-side driver.

Can the ISL2111ABZ drive both high-side and low-side MOSFETs simultaneously in a synchronous buck converter?

No, the ISL2111ABZ is designed exclusively for half-bridge topologies-not synchronous buck converters. Its HO output is level-shifted relative to HS, not VSS, making it unsuitable for low-side drive in buck configurations. In a synchronous buck, the high-side switch requires bootstrapped drive while the low-side switch needs ground-referenced drive-functions handled separately. The ISL2111ABZ provides both outputs but assumes the low-side MOSFET source connects to VSS and the high-side source connects to HS. For buck applications, dedicated high-side/low-side drivers or integrated buck controllers are appropriate.

What is the minimum pulse width the ISL2111ABZ can reliably respond to on its HI and LI inputs?

The ISL2111ABZ guarantees reliable output response to input pulses as short as 50ns, as specified in the Electrical Specifications table under "Minimum Input Pulse Width that Changes the Output" (tPW). This enables use in high-frequency PWM schemes up to ~10MHz duty-cycle resolution. The value is tested across temperature (-40°C to +125°C) and represents the shortest pulse that will fully transition LO or HO. Shorter pulses may result in incomplete switching or metastability, especially near temperature extremes. For robust operation, design margins should keep pulse widths ≥100ns.

ISL2111ABZ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
8V ~ 14V
Logic Voltage - VIL, VIH:
1.4V, 2.2V
Current - Peak Output (Source, Sink):
3A, 4A
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
114 V
Rise / Fall Time (Typ):
9ns, 7.5ns
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

ISL2111ABZ FAQ

1.How can I place an order for ISL2111ABZ through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL2111ABZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL2111ABZ reliable?

The price and inventory of ISL2111ABZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL2111ABZ is usually 5 days.

3.What payment methods are accepted for ISL2111ABZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL2111ABZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL2111ABZ?

ISL2111ABZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL2111ABZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL2111ABZ?

For technical support, including ISL2111ABZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL2111ABZ requirements.

6.How does Aetrix verify that ISL2111ABZ is sourced from the original manufacturer or authorized distributors?

All ISL2111ABZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL2111ABZ meets industry standards.

7.What is the process for return or replacement of ISL2111ABZ?

All ISL2111ABZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL2111ABZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL2111ABZ part is unused and in its original packaging.

Return procedure for ISL2111ABZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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