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Renesas ISL6271ACR-T
- Part No.:
- ISL6271ACR-T
- Manufacturer:
- Renesas
- Category:
- Power Management - Specialized
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
ISL6271ACR-T.pdf
- Description:
- IC PMIC XSCALE PROCESSOR 20-QFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ISL6271ACR-T from Renesas Electronics (formerly Intersil) is a highly integrated power management IC (PMIC) for Intel XScale processors, combining one synchronous buck regulator and two low-dropout linear regulators (1.1V VSRAM and 1.3V VPLL) with I²C-based Dynamic Voltage Management (DVM), overcurrent/overtemperature/undervoltage protection, and shared enable control. It delivers up to 800mA core current at programmable 0.85–1.6V output with 50mV steps, targeting battery-powered mobile computing.
For engineers reviewing the ISL6271ACR-T datasheet, ISL6271ACR-T pinout, ISL6271ACR-T application, or ISL6271ACR-T equivalent, this page provides verified technical context on its Synthetic Ripple Regulation topology, 4×4 mm QFN-20 package mapping, VID/I²C dual-programmability, soft-start slew rate control via SOFT pin capacitor, and real-world use in PDA, tablet, and embedded processor power rails requiring stable multi-rail sequencing and DVM compliance.
Technical Context
The ISL6271ACR-T implements a proprietary Synthetic Ripple Regulation (SRR) control architecture for its core buck regulator-eliminating reliance on output capacitor ESR while delivering fast transient response and <5mV ripple in CCM. Its I²C interface supports standard/fast-mode communication for dynamic voltage and slew rate updates, with VID pins offering fixed-voltage fallback when VIDEN is high.
All three regulators share a common EN pin and are internally compensated; the buck uses an integrated PMOS/NMOS synchronous rectifier (rDS(ON) = 275mΩ/140mΩ), while the LDOs accept LVCC input from 1.7–5.5V and deliver 50mA (VSRAM) and 40mA (VPLL) with ±2.5% output tolerance. Fault signaling includes open-drain PGOOD (all-rail monitoring), active-low BFLT# (battery fault), and thermal shutdown at 130–150°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Output Voltage Range | 0.85V to 1.6V in 50mV increments - enables precise DVM alignment with XScale frequency scaling requirements. |
| Core DC Output Current | 800mA - sufficient for Intel XScale processor core loads under typical operating conditions. |
| Switching Frequency | ≥1.2MHz - allows use of small 4.7µH inductors and compact 10µF ceramic output capacitors. |
| VSRAM / VPLL Outputs | 1.1V / 1.3V fixed LDOs - dedicated low-noise supplies for SRAM retention and PLL circuitry internal to XScale. |
| Input Supply Range | PVCC/VCC: 2.76V–5.5V - compatible with single-cell Li-ion batteries and regulated system rails. |
| Package | 20-pin 4×4 mm QFN - JEDEC MO-220 compliant, near chip-scale footprint with exposed thermal pad for PCB-level thermal management. |
| I²C Interface | Fully Phillips-compliant, supports standard (100kHz) and fast (400kHz) modes - enables host-controlled voltage transitions without external logic. |
| Protection Features | Overcurrent (950–1300mA limit), overtemperature (130–150°C shutdown), undervoltage (86% VOUT), overvoltage (114% VOUT) - ensures robust operation during load transients and thermal stress. |
Pinout & Package
ISL6271ACR-T is housed in a 20-lead, 4×4 mm QFN package (JEDEC MO-220, pkg drawing L20.4x4) with exposed thermal pad. Pin functions are validated per FN9171 Rev 2.00 datasheet, Page 7 (Functional Pin Description).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PVCC | Core regulator input supply | Accepts 2.76–5.5V main battery input; powers synchronous buck stage and internal gate drivers. |
| VOUT | Core regulator output | Programmable 0.85–1.6V output; connects directly to XScale VCORE rail with feedback via FB pin. |
| PHASE | Switching node | Drives external output inductor; features integrated 50Ω ring-damping circuit during diode-emulation mode. |
| VIDEN, SCL/VID0, SDA/VID1, VID2, VID3 | Dual-mode programming interface | Selects I²C (VIDEN = low) or 4-bit VID (VIDEN = high); enables DVM or fixed-voltage configuration. |
| SOFT | Soft-start/slew rate control | External capacitor sets ramp rate for startup and DVM transitions; supports four programmable current sources (3.4–64µA). |
| PGOOD | Open-drain power-good indicator | Asserts low if any regulator (VOUT/VSRAM/VPLL) falls outside ±2.5% tolerance - used for system sequencing and fault detection. |
| BFLT# | Battery fault status output | Active-low signal indicating main battery adequacy (high = ≥2.8V; low = ≤2.6V or absent); powered by BBAT when PVCC fails. |
| EN | Global enable input | High (>2.0V) enables all regulators; low disables outputs and enters ultra-low-quiescent (2–5µA) standby while retaining last VID/slew settings. |
Key Features
| Feature | Design Value |
|---|---|
| Synthetic Ripple Regulation (SRR) | Proprietary hysteretic-derived topology eliminating ESR dependency - achieves <5mV output ripple and superior transient response without external compensation. |
| Dynamic Voltage Management (DVM) | I²C-programmable core voltage and slew rate (0.5–5mV/µs) - enables Intel XScale frequency scaling while meeting Intel-specified VCORE transition limits. |
| Dual Programming Mode | Hardware-selectable I²C or 4-bit VID control - supports flexible integration: full DVM in host-managed systems or fixed-voltage operation in resource-constrained designs. |
| Integrated Protection Logic | Single-chip monitoring of overcurrent, overtemperature, undervoltage, and overvoltage - eliminates need for discrete fault-detection circuitry and reduces BOM count. |
| Low-Power Standby Retention | 2–5µA quiescent current with EN = low while preserving last programmed voltage and slew rate - extends battery life during processor sleep states. |
| Optimized LDO Architecture | 1.1V/50mA VSRAM and 1.3V/40mA VPLL regulators with internal compensation - designed specifically for XScale SRAM retention and PLL biasing, minimizing noise coupling. |
Applications
| Mobile Handheld Computing | Embedded XScale Systems |
|---|---|
|
Use Scenario: Power delivery for Intel PXA270/PXA320-based PDAs and early smartphones with aggressive battery life targets. IC Role / Device Role / Timing Role: Primary PMIC managing core, SRAM, and PLL rails with synchronized enable/disable and DVM-triggered voltage scaling. Use Value: Enables >20% reduction in processor core power dissipation via dynamic VCORE adjustment, extending runtime without compromising peak performance. |
Use Scenario: Compact industrial controller using XScale for real-time data acquisition and wireless connectivity. IC Role / Device Role / Timing Role: Single-chip power solution providing sequenced, protected, and thermally managed multi-rail supply for SoC and peripherals. Use Value: Reduces board area by 40% versus discrete regulator solutions while maintaining ±2.5% output accuracy across -25°C to 85°C ambient. |
| Tablet Device Power Subsystem | Portable Medical Instrumentation |
|
Use Scenario: Power management in 7-inch ARM/XScale hybrid tablets requiring low-noise analog supply integrity. IC Role / Device Role / Timing Role: Core regulator with SRR control + isolated LDOs for clean VSRAM/VPLL - minimizes switching noise coupling into sensitive analog front-ends. Use Value: Achieves <5mV core ripple in CCM and <10mV in DCM, preventing digital noise from degrading ADC/DAC performance. |
Use Scenario: Battery-powered portable ECG monitor with XScale-based signal processing and Bluetooth LE transmission. IC Role / Device Role / Timing Role: Ultra-low-quiescent (2–5µA) standby mode with retained VID state - preserves calibration settings and enables instant wake-up from deep sleep. Use Value: Extends single-charge battery life beyond 72 hours in monitoring mode while supporting rapid transition to full processing capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6271CRZ-T | Same die, Pb-free 20-lead QFN but rated for -40°C to 85°C industrial temp range (vs. -25°C to 85°C for ISL6271ACR-T). | Required for extended-temperature deployments (e.g., automotive infotainment, outdoor industrial tablets). | Select ISL6271CRZ-T when operating below -25°C ambient or requiring broader thermal qualification. |
| TPS65023RGZR | TI triple-output PMIC with 3 buck + 2 LDOs; supports 1.0–1.5V core range (not 0.85–1.6V), no SRR topology, uses conventional current-mode control. | Used in OMAP-based systems; lacks XScale-specific VID mapping and DVM timing compliance per Intel spec. | Choose TPS65023RGZR only for non-XScale platforms where I²C DVM timing constraints do not apply. |
Compared with ISL6271CRZ-T, the ISL6271ACR-T offers tighter thermal qualification for consumer-grade handhelds but lacks extended low-temp support; compared with TPS65023RGZR, it delivers XScale-optimized DVM timing and SRR efficiency but is not drop-in compatible due to differing pinout, VID encoding, and register map.
Availability
ISL6271ACR-T is available at Aetrix Electronics and suitable for PDA, tablet device, and embedded XScale processor applications requiring stable component supply, long-term lifecycle continuity, and RoHS-compliant packaging.
Supply support for ISL6271ACR-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Intersil in 2017 and maintains full technical and supply chain support for legacy Intersil power management products including the ISL6271 series.
The ISL6271A product line was engineered specifically for Intel XScale processor families, integrating DVM, multi-rail sequencing, and battery-aware fault signaling into a single QFN package for space-constrained mobile computing.
FAQ
What is the maximum supported core output current for the ISL6271ACR-T?
The ISL6271ACR-T guarantees 800mA DC output current for its synchronous buck regulator under recommended operating conditions (PVCC = 3.7V, TA = -25°C to 85°C). Its current limit threshold is specified at 950–1300mA (wafer-level test), with overcurrent protection triggering before sustained exceedance of 800mA causes undervoltage faults or PGOOD assertion.
Does the ISL6271ACR-T support both I²C and VID programming simultaneously?
No - the ISL6271ACR-T uses VIDEN pin state to select mode: when VIDEN is low, SCL/SDA function as I²C clock/data lines for DVM; when VIDEN is high, those same pins become VID0/VID1 bits alongside VID2/VID3 for fixed-voltage selection. The two modes are mutually exclusive and cannot operate concurrently.
What is the purpose of the SOFT pin on the ISL6271ACR-T?
The SOFT pin on the ISL6271ACR-T controls soft-start ramp rate and DVM slew rate via an external capacitor. Four programmable current sources (3.4–64µA) route into this pin based on I²C register bits D5/D4, enabling precise control of voltage transition speed - critical for meeting Intel's VCORE slew rate specifications and minimizing overshoot during startup or frequency scaling.
How does the BFLT# pin indicate battery status on the ISL6271ACR-T?
The BFLT# pin on the ISL6271ACR-T is an active-low battery fault indicator: it outputs high when main battery voltage (PVCC) exceeds 2.8V (rising POR threshold), remains high until PVCC drops below 2.6V (falling POR threshold), and pulls low when the battery is absent or inadequate - powered by BBAT backup voltage if PVCC fails, ensuring continuous fault visibility.
Can the ISL6271ACR-T operate with LVCC disconnected from PVCC?
Yes - the ISL6271ACR-T supports independent LVCC sourcing: when not tied to PVCC, LVCC may be supplied from a pre-regulated 1.7–3.5V rail (e.g., 1.8V or 2.5V system supply), reducing power loss across the VSRAM/VPLL LDO pass elements and improving overall conversion efficiency versus direct battery connection.
ISL6271ACR-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Processor
- Current - Supply:
- 380µA
- Voltage - Supply:
- 2.76V ~ 5.5V
- Operating Temperature:
- -25°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-QFN (4x4)
ISL6271ACR-T FAQ
1.How can I place an order for ISL6271ACR-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6271ACR-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6271ACR-T reliable?
The price and inventory of ISL6271ACR-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6271ACR-T is usually 5 days.
3.What payment methods are accepted for ISL6271ACR-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6271ACR-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6271ACR-T?
ISL6271ACR-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6271ACR-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6271ACR-T?
For technical support, including ISL6271ACR-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6271ACR-T requirements.
6.How does Aetrix verify that ISL6271ACR-T is sourced from the original manufacturer or authorized distributors?
All ISL6271ACR-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6271ACR-T meets industry standards.
7.What is the process for return or replacement of ISL6271ACR-T?
All ISL6271ACR-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6271ACR-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6271ACR-T part is unused and in its original packaging.
Return procedure for ISL6271ACR-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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