My Inquiry
My Account
Renesas ISL6532ACR
- Part No.:
- ISL6532ACR
- Manufacturer:
- Renesas
- Category:
- Power Management - Specialized
- Package:
- 28-VQFN Exposed Pad
- Datasheet:
-
ISL6532ACR.pdf
- Description:
- IC REG/CTRLR ACPI DUAL DDR 28QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,525
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ISL6532ACR from Intersil is an ACPI-compliant dual-channel DDR memory power controller integrating a 250kHz synchronous buck PWM controller, a 3A sink-source VTT linear regulator with precise VDDQ/2 reference, and a standby LDO for VDDQ in S3 state. It delivers ±2% output regulation over line/load/temperature, supports 0.8V–2.5V adjustable VDDQ, and enables glitch-free S0↔S3 transitions in ATX-based desktop and graphics memory systems.
For engineers reviewing the ISL6532ACR datasheet, ISL6532ACR pinout, ISL6532ACR application, or ISL6532ACR equivalent, this page provides verified technical context, validated pin functions, confirmed ACPI state-handling behavior, real-world soft-start timing (8.2ms), and direct alternative options for DDR memory power design continuity.
Technical Context
The ISL6532ACR implements voltage-mode PWM control with 250kHz fixed-frequency operation, using a precision 0.8V internal reference and external resistor divider (FB/COMP) to set VDDQ. Its adaptive shoot-through protection monitors UGATE/LGATE voltages (<0.8V = OFF) to prevent simultaneous FET conduction.
ACPI state management is hardware-driven: S3# and S5# pins directly control regulator enable/disable sequencing, while NCH provides open-drain backfeed blocking control synchronized to sleep transitions. VTT regulation uses VTTSNS feedback and VREF_OUT buffered reference, with integrated OV/UV monitoring on all three outputs (VDDQ, VTT, VAGP).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| PWM Frequency | 250 kHz ±12% - Enables compact magnetics and predictable EMI profile for DDR memory rails. |
| VDDQ Regulation Tolerance | ±2% over line/load/temperature - Ensures DDR/DDR2 VDDQ compliance across full operating range. |
| VTT Output Current | ±3 A peak - Supports termination current for up to 4 DIMMs in dual-channel DDR systems. |
| Standby LDO Current (S3) | 650 mA @ 5VSBY input - Maintains VDDQ during S3 without requiring main 12V rail. |
| Reference Voltage | 0.800 V ±2% - Precision internal reference for VDDQ FB loop and VTT/VAGP error amplifiers. |
| Thermal Shutdown Threshold | 140°C nominal - Protects IC during sustained overload or poor PCB thermal design. |
| PGOOD Assertion Delay | 8.2 ms after S3→S0 transition - Matches internal 2048-clock-cycle soft-start timing before system release. |
Pinout & Package
ISL6532ACR is housed in a 28-lead 6×6 mm QFN package (JEDEC MO-220 compliant) with exposed thermal pad. Pin functions are validated per FN9099 Rev 6.00 datasheet, including dedicated analog (GNDA), power (GNDP), and VTT return (GNDQ) grounds.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| UGATE (26) | Upper MOSFET gate driver | Drives control FET between GND and P12V; enables synchronous rectification in VDDQ buck stage. |
| LGATE (27) | Lower MOSFET gate driver | Drives sync FET between GND and P12V; paired with UGATE for shoot-through protected switching. |
| FB (15) | VDDQ feedback input | Negative input to error amp; sets VDDQ via external resistor divider referenced to 0.8V internal reference. |
| VTTSNS (10) | VTT regulation feedback | Sense point for VTT linear regulator; must connect to physical VTT rail at point of load for accuracy. |
| NCH (22) | Backfeed blocking control | Open-drain output enabling external MOSFET to block reverse current from VDDQ to input rail during S3/S4/S5. |
| PGOOD (21) | System power-good indicator | Open-drain logic low if any regulator (VDDQ/VTT/VAGP) is out-of-spec in S0/S1/S2 states. |
Key Features
| Feature | Design Value |
|---|---|
| Glitch-free ACPI state transitions | Hardware-synchronized switching between PWM and standby LDO eliminates voltage overshoot/undershoot during S0↔S3. |
| VTT sink-source capability | Integrated 3A linear regulator supplies VTT = VDDQ/2 without negative supply or external op-amp. |
| VREF_OUT buffered reference | Low-impedance (650Ω) buffered VDDQ/2 output drives VTT regulation and serves as stable reference for external circuits. |
| VDDQ overcurrent protection | Hiccup-mode protection using upper FET rDS(ON) sensing-no current-sense resistor required, preserving efficiency. |
| Multi-rail UV/OV monitoring | Independent 85%/115% fault thresholds on VDDQ, VTT, and VAGP outputs trigger coordinated shutdown and soft-start recovery. |
Applications
| Desktop Memory Power | Graphics Card Memory Supply |
|---|---|
Use Scenario: Dual-channel DDR2 memory subsystem in ATX desktop motherboard with ACPI S3 suspend/resume. IC Role / Device Role / Timing Role: Primary power controller managing VDDQ, VTT, and VAGP rails with hardware-accelerated S0↔S3 state transitions. Use Value: Eliminates need for discrete VTT buffer and separate S3 LDO; reduces BOM count by 4+ components versus discrete solutions. |
Use Scenario: GPU memory termination and core voltage regulation on PCIe graphics card with AGP 1.5V support. IC Role / Device Role / Timing Role: Simultaneous VTT generation (VDDQ/2), VDDQ regulation, and AGP 1.5V LDO control under dynamic GPU load changes. Use Value: Delivers ±3A VTT sink/source current with <100ns response to memory I/O transients, maintaining signal integrity at DDR2 speeds. |
| ASIC Memory Interface Supply | Embedded DDR Memory System |
Use Scenario: High-speed ASIC with DDR2 interface requiring tightly regulated VDDQ and VTT in industrial control chassis. IC Role / Device Role / Timing Role: Centralized memory power manager coordinating with ASIC's SLP_S3# signal to maintain data retention during partial system sleep. Use Value: Standby LDO sustains VDDQ at 650mA from 5VSBY during S3, enabling fast wake-up without memory refresh loss. |
Use Scenario: Compact embedded system using DDR2 SO-DIMM with space-constrained layout and thermal constraints. IC Role / Device Role / Timing Role: Single-chip solution providing VDDQ, VTT, and VAGP with integrated thermal shutdown (140°C) and QFN thermal pad for passive cooling. Use Value: 6×6 mm QFN footprint reduces PCB area by >35% vs. comparable SOIC solutions while supporting 2.5W dissipation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR memory power controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6532AIRZ | Extended temperature range (-40°C to +85°C); Pb-free QFN; identical pinout and electrical specs. | Required for industrial or extended ambient environments where commercial-grade ISL6532ACR is insufficient. | Select ISL6532AIRZ when operating outside 0°C–70°C or RoHS compliance is mandatory. |
| RT8120BZQW | Single-channel DDR3 controller; 300kHz PWM; no integrated VTT sink-source; requires external VTT buffer. | Supports DDR3 (1.5V VDDQ) but lacks native VTT generation and S3 standby LDO functionality. | Choose RT8120BZQW only for DDR3-only designs where VTT is handled externally and S3 power is not required. |
Compared with ISL6532ACR, ISL6532AIRZ offers identical functionality with wider temperature tolerance and Pb-free compliance, while RT8120BZQW provides higher-frequency DDR3 support but omits critical VTT and S3 capabilities-making it unsuitable as a drop-in replacement.
Availability
ISL6532ACR is available at Aetrix Electronics and suitable for desktop motherboards, graphics cards, ASIC memory interfaces, and embedded DDR2 systems requiring stable component supply and long-term design continuity.
Supply support for ISL6532ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Intersil (now part of Renesas Electronics) is a semiconductor company specializing in high-performance analog and power management ICs for computing, industrial, and communications markets.
The ISL6532ACR belongs to Intersil's ACPI-compliant memory power controller product line, designed specifically to consolidate DDR/DDR2 memory rail regulation-including VDDQ, VTT, and AGP core-into a single QFN package for ATX platform power architecture.
FAQ
What is the primary function of the ISL6532ACR in a DDR memory system?
The ISL6532ACR serves as a complete ACPI-compliant power controller for dual-channel DDR/DDR2 memory systems. It integrates a synchronous buck PWM controller for VDDQ, a 3A sink-source linear regulator for VTT (VDDQ/2), a standby LDO for S3-state VDDQ, and an LDO controller for AGP 1.5V core voltage-all in one 28-pin QFN package. Its hardware-managed S0↔S3 transitions ensure glitch-free operation without external sequencing logic.
Does the ISL6532ACR support DDR3 memory specifications?
No, the ISL6532ACR is specifically designed for DDR and DDR2 memory systems. Its VDDQ output range (adjustable down to 0.8V) and VTT regulation architecture align with DDR/DDR2 voltage requirements (e.g., 2.5V/1.8V VDDQ, VTT = VDDQ/2). It does not support DDR3's 1.5V VDDQ standard or its associated timing and regulation tolerances.
How does the ISL6532ACR handle overcurrent protection on the VDDQ rail?
The ISL6532ACR implements MOSFET rDS(ON)-based overcurrent protection for the VDDQ buck converter. An internal 20µA current source (OCSET) develops a voltage across an external ROCSET resistor; when the upper FET's VDS exceeds this threshold, the IC initiates hiccup-mode soft-start recovery. This eliminates the need for a discrete current-sense resistor, preserving efficiency and reducing BOM cost.
What is the role of the NCH pin on the ISL6532ACR?
The NCH pin is an open-drain output that controls an external backfeed-blocking MOSFET. During S3/S4/S5 sleep states, NCH pulls low to disable the MOSFET and prevent reverse current flow from VDDQ to the input rail (e.g., 5VSBY or 12VATX). It must be pulled up to 12V via ≥2kΩ resistor-even if unused-to ensure proper PWM enable timing during cold start.
Can the ISL6532ACR operate with a 3.3V standby input instead of 5VSBY?
Yes-the ISL6532ACR's standby LDO can accept either 5VSBY or 3.3VSBY via the P5VSBY pin. However, the datasheet specifies reduced output current capability: 550 mA maximum with 3.3VSBY input versus 650 mA with 5VSBY. For full S3-state VDDQ support under heavy load, 5VSBY is recommended.
ISL6532ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-VQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- Memory, DDR/DDR2 Regulator
- Current - Supply:
- 5.25mA
- Voltage - Supply:
- -
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-QFN (6x6)
ISL6532ACR FAQ
1.How can I place an order for ISL6532ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6532ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6532ACR reliable?
The price and inventory of ISL6532ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6532ACR is usually 5 days.
3.What payment methods are accepted for ISL6532ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6532ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6532ACR?
ISL6532ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6532ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6532ACR?
For technical support, including ISL6532ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6532ACR requirements.
6.How does Aetrix verify that ISL6532ACR is sourced from the original manufacturer or authorized distributors?
All ISL6532ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6532ACR meets industry standards.
7.What is the process for return or replacement of ISL6532ACR?
All ISL6532ACR units undergo pre-shipment inspection (PSI). If there is an issue with ISL6532ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6532ACR part is unused and in its original packaging.
Return procedure for ISL6532ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ISL6532ACR Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
