Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas ISL6532AIRZ

Part No.:
ISL6532AIRZ
Manufacturer:
Renesas
Category:
Power Management - Specialized
Package:
28-VQFN Exposed Pad
Datasheet:
AetrixISL6532AIRZ.pdf
Description:
IC REG/CTRLR ACPI DUAL DDR 28QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,035

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

ISL6532AIRZ from Intersil is an ACPI-compliant dual-channel DDR/DDR2 memory power controller integrating a 250kHz synchronous buck PWM controller, a 3A sink-source VTT linear regulator with precise VDDQ/2 reference, and a standby LDO for VDDQ in S3 state - all in a single 28-pin QFN package. It delivers ±2% output regulation across line, load, and temperature for VDDQ, VTT, and AGP core (1.5V) rails in ATX-based desktop and graphics memory systems.

For engineers reviewing the ISL6532AIRZ datasheet, ISL6532AIRZ pinout, ISL6532AIRZ application, or ISL6532AIRZ equivalent, this device supports cold-start sequencing, glitch-free S0↔S3 transitions, backfeed blocking via NCH control, integrated overcurrent and thermal protection, and RoHS-compliant Pb-free packaging for industrial-temperature (-40°C to +85°C) deployment.

Technical Context

The ISL6532AIRZ implements voltage-mode PWM control with 250kHz fixed-frequency operation and fast transient response for the main VDDQ buck regulator. Its internal 0.8V precision reference sets VDDQ via external resistor divider on FB, while VTT is generated as a buffered, accurate VDDQ/2 using integrated sink-source circuitry - eliminating need for negative supply.

ACPI state management is hardware-driven: S3# and S5# inputs directly control regulator enable/disable sequencing, soft-start reset timing, and PGOOD assertion. The NCH open-drain output synchronizes backfeed-blocking MOSFET switching during sleep transitions, and VTTSNS provides dedicated feedback for VTT regulation accuracy.

Key Specifications

ParameterValue and Actual Design Meaning
PWM Frequency250 kHz ±12% - enables compact magnetics and predictable EMI profile for DDR memory power delivery
VDDQ Output RangeAdjustable down to 0.8V - supports DDR (2.5V), DDR2 (1.8V), and future low-voltage memory standards
VTT Output Capability±3 A peak current - supplies termination current for up to 4 DIMMs in dual-channel configurations
Regulation Tolerance±2% over line/load/temperature - ensures stable VDDQ, VTT, and AGP core (1.5V) under full system operating range
Operating Temp Range-40°C to +85°C - qualified for industrial-grade motherboard and GPU power applications
Package28-pin 6×6 mm QFN with exposed thermal pad - optimized for PCB space efficiency and thermal dissipation in dense memory modules
RoHS CompliancePb-free (e3 matte tin finish) - compatible with SnPb and Pb-free reflow profiles per J-STD-020

Pinout & Package

ISL6532AIRZ uses a JEDEC MO-220-compliant 28-lead 6×6 mm QFN package with exposed thermal pad (PKG DWG # L28.6x6). Pin functions are validated per FN9099 Rev 6.00 datasheet, Page 2 (top view).

Pin/TerminalCircuit RoleDesign Meaning
UGATE (26)Upper gate driver outputDrives control MOSFET gate between GND and P12V; includes adaptive shoot-through protection
LGATE (27)Lower gate driver outputDrives synchronous rectifier MOSFET gate; complements UGATE with dead-time control
VDDQ (7,8,9)VDDQ rail interfaceInput to VTT regulator and VREF divider in S0/S1; output of standby LDO in S3 state
VTT (5,6)VTT termination outputDelivers ±3A sink/source current at VDDQ/2; disabled in S3 state
VTTSNS (10)VTT feedback inputDirect connection point to VTT rail for closed-loop regulation accuracy
NCH (22)Backfeed blocking controlOpen-drain output that disables blocking FET during S3/S4/S5; requires external pull-up to 12V
PGOOD (21)System power statusOpen-drain logic output asserted high only when all three regulators (VDDQ/VTT/AGP) are in spec during S0/S1
S3# (23), S5# (24)ACPI sleep state inputsDirect hardware control of regulator sequencing - no firmware or external logic required

Key Features

FeatureDesign Value
Integrated VDDQ/VTT/AGP triple-regulationReduces BOM count by consolidating three critical DDR memory rails into one IC with shared control logic
Glitch-free S0↔S3 transitionHardware-accelerated state switching eliminates voltage droop or overshoot during sleep/wake cycles
VDDQ overcurrent protectionUses upper MOSFET rDS(ON) sensing - no external sense resistor needed, preserving efficiency and layout simplicity
VREF_OUT buffered referenceProvides stable, low-impedance VDDQ/2 tracking signal for external circuits without loading VTT regulator
Thermal shutdown at 140°CProtects against sustained overload or poor heatsinking; auto-recovery only after junction cools to 110°C and POR or S5# toggle

Applications

Desktop Motherboard Memory PowerGraphics Card Memory Supply

Use Scenario: Dual-channel DDR2 memory subsystem on ATX motherboard requiring ACPI S3 suspend/resume compliance.

IC Role / Device Role / Timing Role: Primary power controller managing VDDQ buck conversion, VTT termination, and AGP core regulation with synchronized state transitions.

Use Value: Eliminates discrete VTT generator and separate standby LDO, reducing component count and improving S3 wake latency by >20% versus multi-IC solutions.

Use Scenario: High-bandwidth GDDR3/GDDR4 memory on PCIe graphics card powered from 12V ATX rail.

IC Role / Device Role / Timing Role: Delivers regulated VDDQ (1.8V) and VTT (0.9V) with fast transient response to handle GPU memory burst loads.

Use Value: ±3A VTT sink/source capability supports 4+ memory chips per channel; NCH-controlled backfeed blocking prevents 12V-to-VDDQ reverse current during GPU power-down.

ASIC Memory Interface PowerEmbedded Industrial DDR Controller

Use Scenario: ASIC-based storage controller with integrated DDR2 memory interface requiring robust power sequencing.

IC Role / Device Role / Timing Role: Regulates VDDQ and VTT while interfacing with ASIC's SLP_S3/S5 signals to coordinate memory power with host processor states.

Use Value: Hardware-based state machine ensures deterministic timing - no software intervention needed for reliable memory power gating.

Use Scenario: Ruggedized industrial computer with DDR2 SO-DIMM slots operating in -40°C to +85°C ambient.

IC Role / Device Role / Timing Role: Industrial-temperature-rated power controller delivering ±2% regulation and thermal shutdown at 140°C junction.

Use Value: Pb-free QFN package and extended temp grade enable long-term reliability in unventilated enclosures without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR memory power controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISL6532ACRZSame silicon, commercial temp range (0°C to +70°C); identical pinout, electrical specs, and functionalityIntended for consumer desktops and non-industrial environments where ambient temperature stays within commercial limitsSelect ISL6532ACRZ only if system ambient never exceeds +70°C and RoHS compliance is required
RT8105DGQWDual-channel DDR3 controller with 300kHz PWM, but lacks integrated VTT sink-source and standalone S3 standby LDORequires external VTT buffer and discrete S3 regulator; supports DDR3-specific features like ZQ calibration interfaceChoose RT8105DGQW only when upgrading to DDR3 and external VTT buffering is acceptable

Compared with ISL6532ACRZ, the ISL6532AIRZ adds industrial temperature qualification and wider thermal margin; compared with RT8105DGQW, it integrates full VTT regulation and S3 standby capability - reducing external components and simplifying layout for DDR2 systems.

Availability

ISL6532AIRZ is available at Aetrix Electronics and suitable for desktop motherboards, graphics cards, ASIC memory interfaces, and embedded industrial DDR2 systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for ISL6532AIRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Intersil (now part of Renesas Electronics) is a semiconductor company specializing in precision analog, power management, and interface ICs for computing, industrial, and communications markets.

The ISL6532AIRZ belongs to Intersil's ACPI-compliant memory power controller product line, designed specifically to consolidate DDR/DDR2 memory rail generation, termination, and state-aware power management into a single-package solution for ATX-based platforms.

FAQ

What is the primary function of the ISL6532AIRZ in a DDR memory system?

The ISL6532AIRZ serves as a complete ACPI-compliant power controller for dual-channel DDR/DDR2 memory systems. It integrates three regulated outputs: a synchronous buck PWM controller for VDDQ, a 3A sink-source linear regulator for VTT (at VDDQ/2), and a standby LDO for VDDQ during S3 sleep state. The ISL6532AIRZ manages all state transitions, overcurrent protection, thermal shutdown, and PGOOD signaling without external firmware or logic.

Does the ISL6532AIRZ support both DDR2 and DDR3 memory standards?

The ISL6532AIRZ is explicitly designed for DDR and DDR2 memory systems, as confirmed by its datasheet title ("ACPI Regulator/Controller for Dual Channel DDR Memory Systems") and supported output ranges (adjustable down to 0.8V, covering DDR 2.5V and DDR2 1.8V). It does not support DDR3-specific requirements such as ZQ calibration or 1.5V VDDQ operation - those are addressed by later-generation controllers like the ISL6537 or RT8105.

How does the ISL6532AIRZ implement overcurrent protection without a sense resistor?

The ISL6532AIRZ uses the upper MOSFET's intrinsic rDS(ON) as the current-sensing element. An internal 20µA current source (IOCSET) flows through an external resistor (ROCSET) tied to the upper FET drain, generating a reference voltage. When the voltage drop across the upper FET exceeds this reference, the overcurrent comparator triggers soft-start reset. This method eliminates the need for a discrete sense resistor, preserving efficiency and board space in the ISL6532AIRZ design.

What is the role of the NCH pin on the ISL6532AIRZ, and how must it be connected?

The NCH pin on the ISL6532AIRZ is an open-drain output that controls an external backfeed-blocking MOSFET during sleep state transitions. It must be pulled up to the 12V rail via a ≥2kΩ resistor. When active, NCH pulls low to disable the blocking FET and prevent reverse current flow from VDDQ to the input rail during S3/S4/S5 states. Even if unused, NCH requires this pull-up to ensure proper PWM enable timing - failure to connect it may cause startup failure or erratic regulation behavior in the ISL6532AIRZ.

Can the ISL6532AIRZ operate with a 3.3V standby input instead of 5VSBY?

Yes - the ISL6532AIRZ supports both 5VSBY and 3.3VSBY inputs for its standby LDO. However, the datasheet specifies higher output current capability when powered from 5VSBY (650mA vs. 550mA at 3.3VSBY), and recommends using the 5V rail for S3-state VDDQ supply due to superior load handling. The 5VSBY pin (Pin 2) serves as the main bias supply, while P5VSBY (Pin 11) selects the standby LDO input source - allowing flexible integration in mixed-rail ATX designs using the ISL6532AIRZ.

ISL6532AIRZ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
28-VQFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Applications:
Memory, DDR/DDR2 Regulator
Current - Supply:
5.25mA
Voltage - Supply:
-
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (6x6)

ISL6532AIRZ FAQ

1.How can I place an order for ISL6532AIRZ through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL6532AIRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL6532AIRZ reliable?

The price and inventory of ISL6532AIRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6532AIRZ is usually 5 days.

3.What payment methods are accepted for ISL6532AIRZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6532AIRZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL6532AIRZ?

ISL6532AIRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL6532AIRZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL6532AIRZ?

For technical support, including ISL6532AIRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6532AIRZ requirements.

6.How does Aetrix verify that ISL6532AIRZ is sourced from the original manufacturer or authorized distributors?

All ISL6532AIRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6532AIRZ meets industry standards.

7.What is the process for return or replacement of ISL6532AIRZ?

All ISL6532AIRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6532AIRZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL6532AIRZ part is unused and in its original packaging.

Return procedure for ISL6532AIRZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

ISL6532AIRZ Tags

  • ISL6532AIRZ
  • ISL6532AIRZ PDF
  • ISL6532AIRZ Datasheet
  • ISL6532AIRZ Specifications
  • ISL6532AIRZ Images
  • Renesas
  • Renesas ISL6532AIRZ
  • Buy ISL6532AIRZ
  • ISL6532AIRZ Price
  • ISL6532AIRZ Distributor
  • ISL6532AIRZ Supplier
  • ISL6532AIRZ Wholesale
Related Products
TPS2511DGNR
TPS2511DGNR

Texas Instruments

UTC2000/MG
UTC2000/MG

Microchip Technology

TUSB320HAIRWBR
TUSB320HAIRWBR

Texas Instruments

TPS61252DSGR
TPS61252DSGR

Texas Instruments

PI5USB30216CXUAEX
PI5USB30216CXUAEX

Diodes Incorporated

SN6501DBVR
SN6501DBVR

Texas Instruments

CYPD3177-24LQXQT
CYPD3177-24LQXQT

Infineon Technologies

SN6501QDBVRQ1
SN6501QDBVRQ1

Texas Instruments

STUSB1600AQTR
STUSB1600AQTR

STMicroelectronics

SN6505BDBVR
SN6505BDBVR

Texas Instruments

SN6501DBVT
SN6501DBVT

Texas Instruments

TPS65150PWPR
TPS65150PWPR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER