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Renesas ISL6532AIRZ-T
- Part No.:
- ISL6532AIRZ-T
- Manufacturer:
- Renesas
- Category:
- Power Management - Specialized
- Package:
- 28-VQFN Exposed Pad
- Datasheet:
-
ISL6532AIRZ-T.pdf
- Description:
- IC REG/CTRLR ACPI DUAL DDR 28QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,572
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Product details
Overview
ISL6532AIRZ-T from Renesas (formerly Intersil) is an ACPI-compliant dual-channel DDR memory power controller integrating a synchronous buck PWM regulator, a 3A sink-source VTT linear regulator, and an LDO for AGP core voltage. It delivers ±2% output regulation over line/load/temperature, supports 0.8V–2.5V VDDQ adjustment, operates at 250kHz, and manages S0/S1/S3 state transitions with glitch-free switching and integrated NCH backfeed control for ATX-based DDR/DDR2 systems.
For engineers reviewing the ISL6532AIRZ-T datasheet, ISL6532AIRZ-T pinout, ISL6532AIRZ-T application, or ISL6532AIRZ-T equivalent, key selection considerations include its industrial temperature range (−40°C to +85°C), Pb-free 28-lead 6×6 QFN package, VDDQ overcurrent hiccup protection via OCSET, VREF_OUT buffered reference tracking VDDQ/2, and seamless S3↔S0 transition timing controlled by SLP_S3#/SLP_S5# and internal soft-start.
Technical Context
The ISL6532AIRZ-T implements a single-loop voltage-mode PWM control architecture with 250kHz fixed-frequency operation, fast transient response, and adaptive shoot-through protection monitoring UGATE/LGATE voltages to prevent simultaneous FET conduction. Its error amplifier features 80dB DC gain and 15MHz gain-bandwidth product for stable loop compensation across DDR load steps.
ACPI state management is hardware-driven: SLP_S3# and SLP_S5# inputs directly control regulator enable/disable sequencing, while NCH provides open-drain gate control for external backfeed-blocking MOSFETs. The internal 0.8V precision reference feeds both VDDQ FB and VTT regulation, and VTTSNS enables remote-sense feedback for accurate VTT rail regulation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDDQ Output Range | Adjustable down to 0.8V using external resistor divider; supports DDR/DDR2 core voltage specs. |
| PWM Switching Frequency | 250kHz (typical); enables compact magnetics and predictable EMI profile in memory power rails. |
| VTT Sink/Source Current | ±3A peak (30% duty cycle); meets DDR termination current requirements during data bursts. |
| Output Regulation Accuracy | ±2% over line, load, and temperature; ensures memory interface signal integrity across operating conditions. |
| Operating Temperature | −40°C to +85°C (industrial grade); validated for graphics cards and embedded systems with thermal cycling. |
| Standby LDO Output | 650mA max from 5VSBY; sustains VDDQ in S3 sleep state without main 12V rail. |
| OCSET Current Source | 20µA (typical); sets VDDQ overcurrent trip point via external ROCSET resistor and MOSFET rDS(ON). |
| PGOOD Threshold | 57.5% rising / 45.0% falling of VVTTSNS or VVDDQ; provides reliable power-good assertion before system wake. |
Pinout & Package
ISL6532AIRZ-T is housed in a RoHS-compliant, Pb-free 28-lead QFN package (6mm × 6mm, JEDEC MO-220 compliant) with exposed thermal pad. The package enables high-density PCB layout and efficient thermal dissipation via direct paddle-to-ground connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| UGATE (26) | Upper MOSFET gate driver | Drives control FET between GND and P12V; supports adaptive shoot-through protection. |
| LGATE (27) | Lower MOSFET gate driver | Drives synchronous rectifier FET; complements UGATE with dead-time control. |
| FB (15) | VDDQ feedback input | Negative input to error amp; sets VDDQ output via resistor divider to internal 0.8V reference. |
| COMP (16) | Error amplifier output | Connects external RC network for loop compensation; critical for stability under dynamic DDR loads. |
| VTT (5,6) | VTT regulator output | Delivers precise VDDQ/2 termination voltage; requires external VTTSNS connection for remote sensing. |
| VREF_OUT (13) | Buffered VDDQ/2 reference | Provides low-impedance 0.8V reference for VTT regulation and external circuitry; needs 0.1µF bypass. |
| NCH (22) | Backfeed blocking control | Open-drain output enabling external MOSFET to isolate VDDQ from input rail during S3/S4/S5 states. |
| SLP_S3# (23) | ACPI S3 sleep command | Active-low input triggering VTT disable, VDDQ standby enable, and PGOOD deassertion. |
| PGOOD (21) | Power-good status indicator | Open-drain output asserted only when all three regulators (VDDQ, VTT, VAGP) are within spec in S0/S1. |
| OCSET (12) | Overcurrent threshold set | 20µA current source developing voltage across ROCSET to detect upper FET current via rDS(ON). |
Key Features
| Feature | Design Value |
|---|---|
| Triple-output regulation | Simultaneous VDDQ (PWM), VTT (sink/source linear), and VAGP (LDO) outputs eliminate need for discrete controllers in DDR memory subsystems. |
| Glitch-free ACPI state transitions | Hardware-synchronized switching between PWM and standby LDO on VDDQ, plus VTT/VAGP enable/disable, prevents rail collapse or overshoot during S0↔S3 transitions. |
| Integrated VREF buffer | VREF_OUT provides stable, low-noise VDDQ/2 reference with 2mA drive capability-critical for DDR reference plane accuracy and noise immunity. |
| Backfeed blocking via NCH | Eliminates need to route 5V Dual to memory supply; NCH drives external MOSFET to block reverse current from VDDQ to input during sleep states. |
| Comprehensive fault protection | Includes VDDQ overcurrent hiccup mode, UV/OV detection on all outputs, thermal shutdown at 140°C, and POR monitoring on 5VSBY/P12V rails. |
Applications
| Graphics Card Memory Power | Desktop DDR2 Memory Module |
|---|---|
Use Scenario: High-performance GPU memory subsystem requiring stable VDDQ and precise VTT termination during 3D rendering and compute workloads. IC Role / Device Role / Timing Role: ISL6532AIRZ-T acts as the primary DDR memory power controller, managing VDDQ switching, VTT sourcing/sinking, and AGP core voltage with ACPI-compliant sleep/wake coordination. Use Value: Enables full S3 resume capability with <8.2ms VDDQ/VTT ramp-up, ±2% regulation under 3A VTT transients, and elimination of external VDDQ/2 divider components via integrated VREF_OUT. | Use Scenario: Dual-channel DDR2 DIMM slot on ATX motherboard where space-constrained layout demands integrated power management. IC Role / Device Role / Timing Role: ISL6532AIRZ-T serves as the centralized memory power IC, coordinating VDDQ generation, VTT termination, and VAGP supply while interfacing directly with chipset SLP_S3#/SLP_S5# signals. Use Value: Reduces BOM count by integrating three regulators, eliminates discrete VTT current-sense resistors via rDS(ON)-based OCSET, and supports industrial temp range for extended reliability in commercial desktops. |
| ASIC Memory Interface Supply | Embedded Industrial DDR Controller |
Use Scenario: ASIC-based storage accelerator board needing tightly regulated DDR memory rails with deterministic power-state behavior. IC Role / Device Role / Timing Role: ISL6532AIRZ-T functions as the memory subsystem PMIC, delivering VDDQ, VTT, and VAGP with synchronized soft-start and fault reporting via PGOOD. Use Value: Provides guaranteed 2048-cycle (8.2ms) soft-start timing, hiccup-mode overcurrent recovery, and UV/OV lockout-ensuring robust operation during firmware updates or unexpected load surges. | Use Scenario: Ruggedized industrial controller with DDR memory operating in wide ambient temperatures and subject to frequent power cycling. IC Role / Device Role / Timing Role: ISL6532AIRZ-T operates as the memory power manager, maintaining VDDQ regulation from 5VSBY in S3 and transitioning cleanly to 12V-powered PWM in S0. Use Value: Delivers −40°C to +85°C operation, Pb-free QFN package for lead-free assembly, and thermal shutdown at 140°C-meeting EN 61000-6-2 and IEC 60747-16 reliability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR memory power controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6532ACRZ-T | Commercial temperature range (0°C to +70°C); identical pinout, electrical specs, and feature set. | Targeted for consumer PCs and non-industrial environments where ambient temperature stays within commercial limits. | Select ISL6532ACRZ-T only if system thermal profile remains ≤70°C ambient; ISL6532AIRZ-T is required for extended temperature deployments. |
| RT8120BGQW | Single-channel DDR3/DDR4 controller; lacks integrated VTT sink-source capability and AGP LDO; uses current-mode control. | Designed for newer DDR generations with higher VDDQ currents; does not support legacy DDR2 S3 standby via 5VSBY-fed LDO. | RT8120BGQW is not a functional replacement for ISL6532AIRZ-T in dual-channel DDR2 systems requiring S3 VDDQ hold-up and VTT termination. |
Compared with ISL6532ACRZ-T, ISL6532AIRZ-T adds industrial temperature qualification and wider thermal margin; compared with RT8120BGQW, it provides full dual-channel DDR2 support, integrated VTT regulation, and S3-compatible standby LDO-making ISL6532AIRZ-T irreplaceable in legacy ATX-based DDR2 platforms.
Availability
ISL6532AIRZ-T is available at Aetrix Electronics and suitable for graphics card memory power, desktop DDR2 memory modules, ASIC memory interface supplies, and embedded industrial DDR controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for ISL6532AIRZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation acquired Intersil in 2017 and maintains full technical and manufacturing continuity for legacy Intersil power management ICs including the ISL6532A family.
The ISL6532A product line was designed specifically for ACPI-compliant DDR/DDR2 memory power systems in ATX-based computing platforms, emphasizing seamless S0/S3 state transitions, integrated VTT regulation, and robust fault protection.
FAQ
What is the operating temperature range for the ISL6532AIRZ-T?
The ISL6532AIRZ-T is rated for industrial temperature operation from −40°C to +85°C ambient. This specification is validated per the datasheet's Recommended Operating Conditions table and confirmed by thermal shutdown activation at 140°C junction temperature. The ISL6532AIRZ-T's QFN package includes an exposed thermal pad that must be soldered to a PCB ground plane to maintain this rating under sustained 3A VTT loads.
How does the ISL6532AIRZ-T implement VDDQ overcurrent protection?
The ISL6532AIRZ-T implements VDDQ overcurrent protection using an internal 20µA current source (OCSET pin) and the upper MOSFET's rDS(ON). A resistor (ROCSET) connected from OCSET to the upper FET drain develops a voltage referenced to the input rail; when the voltage across the FET exceeds this threshold, the IC initiates hiccup-mode soft-start recovery. This method avoids external sense resistors and preserves efficiency-confirmed in the Electrical Specifications table on page 7 of FN9099 Rev 6.00.
Can the ISL6532AIRZ-T support DDR2 memory in S3 sleep state?
Yes, the ISL6532AIRZ-T supports DDR2 memory in S3 sleep state via its integrated standby LDO, which delivers up to 650mA from the 5VSBY rail to maintain VDDQ. During S3, the PWM regulator disables, VTT shuts down, and the standby LDO activates-verified in the Functional Description section (page 9) and Electrical Specifications (page 7, "VDDQ Standby LDO" row). This capability is essential for fast S3→S0 resume in ACPI-compliant systems.
What is the purpose of the NCH pin on the ISL6532AIRZ-T?
The NCH pin on the ISL6532AIRZ-T is an open-drain output that controls an external N-channel MOSFET to block reverse current (backfeed) from VDDQ to the input rail during S3/S4/S5 sleep states. As described in the Functional Pin Description (page 8), NCH must be pulled up to 12V via ≥2kΩ; it goes low during sleep to turn off the blocking FET. This eliminates the need to route 5V Dual to the memory supply-a key design simplification in ATX-based systems.
Does the ISL6532AIRZ-T provide a buffered VDDQ/2 reference?
Yes, the ISL6532AIRZ-T provides a buffered VDDQ/2 reference via the VREF_OUT pin (pin 13), which is a low-impedance, 2mA-capable output tracking the VDDQ rail at exactly half voltage. Per the Functional Pin Description (page 8), this buffer replaces external resistor dividers for DDR reference planes and requires a minimum 0.1µF capacitor to ground for stability-directly supporting JEDEC DDR2 VREF tolerance requirements.
ISL6532AIRZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-VQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Memory, DDR/DDR2 Regulator
- Current - Supply:
- 5.25mA
- Voltage - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-QFN (6x6)
ISL6532AIRZ-T FAQ
1.How can I place an order for ISL6532AIRZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6532AIRZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6532AIRZ-T reliable?
The price and inventory of ISL6532AIRZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6532AIRZ-T is usually 5 days.
3.What payment methods are accepted for ISL6532AIRZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6532AIRZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6532AIRZ-T?
ISL6532AIRZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6532AIRZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6532AIRZ-T?
For technical support, including ISL6532AIRZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6532AIRZ-T requirements.
6.How does Aetrix verify that ISL6532AIRZ-T is sourced from the original manufacturer or authorized distributors?
All ISL6532AIRZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6532AIRZ-T meets industry standards.
7.What is the process for return or replacement of ISL6532AIRZ-T?
All ISL6532AIRZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6532AIRZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6532AIRZ-T part is unused and in its original packaging.
Return procedure for ISL6532AIRZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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