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Renesas ISL6532CR-T

Part No.:
ISL6532CR-T
Manufacturer:
Renesas
Category:
Power Management - Specialized
Package:
20-VQFN Exposed Pad
Datasheet:
AetrixISL6532CR-T.pdf
Description:
IC REG/CTRLR ACPI DUAL DDR 20QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,194

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Product details

Overview

ISL6532CR-T from Intersil is an ACPI-compliant dual-channel DDR/DDR2 memory power controller integrating a 250kHz synchronous buck PWM controller for VDDQ (adjustable down to 0.8V), a 3A sink-source VTT linear regulator with precise VDDQ/2 reference, and a standby LDO delivering up to 650mA during S3 state. It enables glitch-free S0↔S3 transitions in ATX-powered desktop and graphics memory systems.

For engineers reviewing the ISL6532CR-T datasheet, ISL6532CR-T pinout, ISL6532CR-T application, or ISL6532CR-T equivalent, key selection considerations include its 0.8V reference accuracy (±2%), integrated NCH backfeed control, thermal shutdown at 140°C, PGOOD monitoring of both VDDQ and VTT, and QFN-20 package compatibility with DDR2 termination requirements.

Technical Context

The ISL6532CR-T implements voltage-mode PWM control with 250kHz fixed-frequency operation, fast transient response, and internal soft-start timing (6.5–9.5ms). Its dual-regulator architecture separates VDDQ generation (synchronous buck) from VTT regulation (linear sink-source), with independent UV/OV fault detection on both outputs and adaptive shoot-through protection monitoring UGATE/LGATE voltages.

ACPI state management is hardware-driven via dedicated S3# and S5# inputs, enabling automatic switching between PWM and standby LDO modes without external sequencing. The NCH open-drain output controls external backfeed-blocking MOSFETs, while VREF_OUT provides a buffered, low-impedance VDDQ/2 reference for system-level termination stability.

Key Specifications

ParameterValue and Actual Design Meaning
PWM Frequency250 kHz ±12% - Enables compact magnetics and predictable EMI filtering for DDR2 memory rails.
VDDQ Reference Voltage0.800 V ±2% - Sets minimum programmable VDDQ output; supports DDR/DDR2 compliance down to 0.8V.
VTT Output Current±3 A peak - Delivers bidirectional current required for DDR memory termination under dynamic load conditions.
Standby LDO Current650 mA @ 5VSBY - Sustains VDDQ rail during S3 (Suspend-to-RAM) without requiring main ATX 12V activation.
Thermal Shutdown Threshold140 °C - Disables all regulators to prevent damage during sustained overload or poor PCB thermal design.
PGOOD Accuracy±12.5% window (45–57.5% of target) - Ensures reliable power-good assertion only when both VDDQ and VTT are within specification.
Input Supply Tolerance±10% on 5VSBY and 12V rails - Matches standard ATX power supply tolerances without external regulation.

Pinout & Package

ISL6532CR-T is housed in a 20-lead 6×6 mm QFN package (JEDEC MO-220 compliant) with exposed thermal pad (Pin 21) requiring direct connection to PCB ground plane via ≥4 vias for thermal and electrical integrity.

Pin/TerminalCircuit RoleDesign Meaning
5VSBY (1)Bias supply inputProvides operating power during S4/S5; draws <800 µA in shutdown, enabling low-power wake-on-LAN support.
UGATE (20) / LGATE (19)N-channel MOSFET gate driversDrive upper/lower FETs with ±0.8A peak current; incorporate adaptive shoot-through protection based on gate voltage thresholds.
VDDQ (5,6)VDDQ rail interfaceDual pins serve as output during S3 (LDO mode) and input during S0/S1 (feedback source for VTT divider and VTT regulator).
VTT (3,4)VTT termination outputDelivers ±3A sink/source current; disabled automatically in all sleep states except S0/S1/S2.
VTTSNS (7)VTT feedback senseConnects directly to VTT net at point-of-load to compensate for IR drop and ensure accurate regulation.
VREF_OUT (9)Buffered VDDQ/2 referenceSupplies low-impedance 0.8V reference to memory controller; requires 0.1µF bypass to GND for stability.
S3# (16) / S5# (17)ACPI sleep state inputsDirect hardware interface to chipset SLP_S3#/SLP_S5# signals; no software or firmware dependency for state transitions.
NCH (15)Backfeed blocking controlOpen-drain output that disables PWM until 12V rail exceeds 9.5V; prevents reverse current flow from VDDQ to input during power-up.
PGOOD (14)Power status indicatorOpen-drain signal asserted high only when both VDDQ and VTT are within ±12.5% of target; used by chipset for boot validation.

Key Features

FeatureDesign Value
Glitch-free S0↔S3 transitionHardware-controlled regulator handoff eliminates voltage droop or overshoot during memory suspend/resume cycles.
Integrated VDDQ/2 reference bufferVREF_OUT delivers stable, low-noise 0.8V reference with 2mA drive capability-eliminates need for external op-amp buffer in DDR2 designs.
ACPI-compliant sleep logicDedicated S3#/S5# inputs and internal state machine enforce Intel ACPI 2.0+ timing requirements without external glue logic.
Thermal and fault protectionIndependent UV/OV detection on VDDQ and VTT, plus 140°C thermal shutdown, ensures robust operation under fault conditions.
QFN-20 near-chip-scale package6×6 mm footprint with exposed thermal pad improves PCB space efficiency and thermal performance over SOIC alternatives.

Applications

Desktop Memory PowerGraphics Card Memory

Use Scenario: Dual-channel DDR2 memory subsystem in ATX desktop motherboard with S3/S4/S5 ACPI sleep states.

IC Role / Device Role / Timing Role: Primary power controller managing VDDQ (1.8V), VTT (0.9V), and VREF (0.9V) with hardware-coordinated state transitions.

Use Value: Eliminates discrete supervisor ICs and external VDDQ/2 buffers; reduces BOM count by 4+ components versus discrete solutions.

Use Scenario: GPU memory power on PCIe graphics card requiring fast wake-from-sleep and tight VTT regulation.

IC Role / Device Role / Timing Role: VTT sink-source regulator and VDDQ controller synchronized to GPU power state signals (SLP_S3#, SLP_S5#).

Use Value: ±3A VTT current capacity meets DDR2-800 timing margins; NCH control prevents backfeed during GPU reset sequences.

ASIC Memory InterfaceEmbedded Processor DDR

Use Scenario: High-speed ASIC with DDR2 interface requiring compliant power sequencing and low-noise VREF.

IC Role / Device Role / Timing Role: Integrated VDDQ/VTT/VREF generator with programmable soft-start and PGOOD validation for ASIC boot sequence.

Use Value: VREF_OUT buffer provides <10mV noise floor at 2mA load-meets ASIC I/O reference stability requirements.

Use Scenario: Industrial embedded system using DDR2 memory with extended temperature operation and S3 suspend capability.

IC Role / Device Role / Timing Role: Single-chip DDR2 power solution supporting 0°C to 70°C ambient with thermal shutdown and fault latching.

Use Value: Standby LDO delivers 650mA from 5VSBY during S3-enables full system suspend without memory refresh loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR memory power controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISL6537CRZ-TSame pinout, enhanced thermal performance (θJC = 3.5°C/W vs. 5°C/W), Pb-free only, rated for 0°C to 85°C.Supports higher ambient temperatures in dense graphics or server memory modules.Select ISL6537CRZ-T when operating above 70°C or requiring Pb-free compliance without requalification.
TPS51116PWR28-pin TSSOP, supports DDR3 (1.5V VDDQ), includes integrated MOSFET drivers but no VREF buffer; requires external VDDQ/2 divider.Targeted at DDR3 systems; lacks native VREF_OUT buffer and NCH backfeed control.Choose TPS51116PWR only for DDR3 upgrades where board layout allows larger package and external reference buffering.

Compared with ISL6532CR-T, ISL6537CRZ-T offers extended temperature range and improved thermal resistance but shares identical functionality and pinout; TPS51116PWR supports newer DDR3 standards but requires additional external components and does not provide buffered VREF or hardware NCH control.

Availability

ISL6532CR-T is available at Aetrix Electronics and suitable for desktop motherboards, graphics cards, ASIC memory interfaces, and embedded DDR2 systems requiring stable component supply across industrial temperature ranges and long product lifecycles.

Supply support for ISL6532CR-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Intersil (now part of Renesas Electronics) is a semiconductor company specializing in precision analog and power management ICs for computing, industrial, and communications applications.

The ISL6532 belongs to Intersil's ACPI-compliant memory power controller product line, designed specifically to replace multi-IC DDR2 power solutions with single-chip integration of VDDQ, VTT, and VREF functions in ATX-based platforms.

FAQ

What is the primary function of the ISL6532CR-T in DDR2 memory systems?

The ISL6532CR-T serves as a complete ACPI-compliant power controller for DDR2 memory, generating regulated VDDQ (via synchronous buck), VTT (via integrated sink-source linear regulator), and VREF (buffered VDDQ/2) from ATX 5VSBY and 12V rails. It manages seamless S0↔S3 state transitions without external sequencing logic, making it essential for desktop and graphics memory power architectures.

Does the ISL6532CR-T support DDR3 memory voltage requirements?

No, the ISL6532CR-T is specifically designed for DDR and DDR2 memory systems with VDDQ down to 0.8V and VTT at VDDQ/2. It does not support DDR3's 1.5V VDDQ or 0.75V VTT specifications. For DDR3, designers should consider alternatives such as the TPS51116PWR, which targets DDR3 compliance but lacks the ISL6532CR-T's integrated VREF buffer and NCH control.

How does the NCH pin on the ISL6532CR-T improve system reliability?

The NCH pin on the ISL6532CR-T is an open-drain output that controls an external backfeed-blocking MOSFET. It remains low until the 12V ATX rail exceeds 9.5V, preventing reverse current flow from the VDDQ rail into the input during power-up transients. This eliminates risk of damaging the ATX supply or causing system instability during cold start-directly enhancing reliability in ATX-based platforms using the ISL6532CR-T.

Can the ISL6532CR-T operate with a 3.3V standby supply instead of 5VSBY?

Yes, the ISL6532CR-T supports 3.3V standby input via the P5VSBY pin for the VDDQ standby LDO, though 5VSBY is preferred for higher current capability (650mA vs. 550mA). The 5VSBY pin itself must be supplied with 5V ±10% as specified in the absolute maximum ratings; substituting 3.3V on 5VSBY violates the datasheet and may cause improper POR or functional failure of the ISL6532CR-T.

What thermal design practices are required for reliable ISL6532CR-T operation?

Reliable ISL6532CR-T operation requires connecting the exposed thermal pad (Pin 21) to the PCB ground plane using at least four thermal vias, minimizing θJA via a solid inner-layer ground plane, and avoiding copper voids beneath the QFN body. The device's thermal shutdown triggers at 140°C junction temperature; maintaining θJA ≤32°C/W (per datasheet) ensures safe operation at 70°C ambient with typical DDR2 memory loads.

ISL6532CR-T Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
20-VQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Memory, DDR/DDR2 Regulator
Current - Supply:
5.25mA
Voltage - Supply:
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (6x6)

ISL6532CR-T FAQ

1.How can I place an order for ISL6532CR-T through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL6532CR-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL6532CR-T reliable?

The price and inventory of ISL6532CR-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6532CR-T is usually 5 days.

3.What payment methods are accepted for ISL6532CR-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6532CR-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL6532CR-T?

ISL6532CR-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL6532CR-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL6532CR-T?

For technical support, including ISL6532CR-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6532CR-T requirements.

6.How does Aetrix verify that ISL6532CR-T is sourced from the original manufacturer or authorized distributors?

All ISL6532CR-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6532CR-T meets industry standards.

7.What is the process for return or replacement of ISL6532CR-T?

All ISL6532CR-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6532CR-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL6532CR-T part is unused and in its original packaging.

Return procedure for ISL6532CR-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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