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Renesas ISL6532CRZ

Part No.:
ISL6532CRZ
Manufacturer:
Renesas
Category:
Power Management - Specialized
Package:
20-VQFN Exposed Pad
Datasheet:
AetrixISL6532CRZ.pdf
Description:
IC CTRLR PWM 2CHAN DDR 20QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,463

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Product details

Overview

ISL6532CRZ from Renesas Electronics (formerly Intersil) is an ACPI-compliant dual-rail power controller for DDR/DDR2 memory systems, integrating a 250kHz synchronous buck PWM controller for VDDQ (adjustable down to 0.8V), a 3A sink-source VTT linear regulator with precise VDDQ/2 reference, and a buffered VREF_OUT. It delivers ±2% static regulation over line/load/temperature and enables glitch-free S0/S3/S5 state transitions in ATX-based PCs and graphics cards.

For engineers reviewing the ISL6532CRZ datasheet, ISL6532CRZ pinout, ISL6532CRZ application, or ISL6532CRZ equivalent, key selection considerations include its integrated NCH backfeed control logic, dual-input support (5VSBY or 3.3VSBY for standby VDDQ), thermal shutdown at 140°C, PGOOD monitoring of both VDDQ and VTT rails, and QFN-20 package compatibility with DDR2 termination requirements.

Technical Context

The ISL6532CRZ implements voltage-mode PWM control with 250kHz fixed-frequency operation, fast transient response, and internal soft-start timing (6.5–9.5ms). Its dual-regulator architecture separates VDDQ generation (synchronous buck) from VTT generation (integrated sink-source LDO), with independent under/over-voltage protection (85–115% thresholds) and adaptive shoot-through protection on UGATE/LGATE.

ACPI state management is hardware-driven via dedicated S3# and S5# inputs, enabling automatic switching between PWM and standby LDO modes without external sequencing. The NCH open-drain output synchronizes backfeed MOSFET control during sleep transitions, while VREF_IN capacitor sets VTT soft-start ramp time based on RU||RL divider network.

Key Specifications

Parameter Value and Actual Design Meaning
PWM Frequency 250 kHz ±12% - Enables compact magnetics and predictable EMI profile for DDR memory rail design.
VDDQ Output Range Adjustable down to 0.8 V - Supports DDR and DDR2 core voltage specifications with external resistor divider.
VTT Output Current ±3 A peak - Delivers bidirectional current required for DDR memory termination without external op-amps.
Regulation Accuracy ±2% over line, load, temperature - Ensures stable VDDQ and VTT compliance across industrial ambient range (0°C to 70°C).
Standby VDDQ Drive 650 mA @ 5VSBY - Supplies sufficient current for S3 (Suspend-to-RAM) state without auxiliary regulators.
Thermal Shutdown 140°C junction limit - Protects against sustained overload or poor PCB thermal design in dense memory modules.
PGOOD Thresholds VDDQ/VTT monitored at 45–57.5% of target - Provides robust power-good assertion before system initialization.

Pinout & Package

ISL6532CRZ is housed in a Pb-free, JEDEC MO-220 compliant 20-lead 6×6 mm QFN package with exposed thermal pad (Pin 21). The package supports high-density DDR memory power delivery and efficient heat dissipation via direct ground-plane connection through ≥4 vias.

Pin/Terminal Circuit Role Design Meaning
5VSBY (1) Bias supply input Provides low-power bias during S4/S5; draws <800 µA in shutdown; requires local 0.1 µF bypass.
P12V (18) High-side gate drive supply Supplies UGATE/LGATE drivers and VTT regulator only during S0/S1/S2; not used in sleep states.
P5VSBY (8) Standby VDDQ source Accepts 5V or 3.3V standby rail to power integrated LDO for S3-state VDDQ output.
UGATE (20) / LGATE (19) Synchronous buck gate drivers Drive N-channel MOSFETs with ±0.8 A peak current; incorporate adaptive shoot-through protection.
NCH (15) Backfeed blocking control Open-drain output that disables PWM until 12V rail exceeds 9.5 V; must be pulled up externally.
VDDQ (5,6) VDDQ rail interface Dual pins serve as output (S3) or input (S0/S1); connect externally to VDDQ plane and VTT divider.
VTT (3,4) VTT rail output Dual pins deliver ±3 A sink/source current; disabled in all sleep states except S0/S1/S2.
VTTSNS (7) VTT feedback sense Connects directly to VTT output at point-of-load for accurate closed-loop regulation.
VREF_OUT (9) Buffered VDDQ/2 reference Provides 2 mA drive capability; used as VTT reference and for system-level VREF distribution.
S3# (16) / S5# (17) ACPI sleep state inputs CMOS-compatible inputs (1.5 V threshold) that trigger automatic regulator mode switching per ACPI spec.

Key Features

Feature Design Value
Glitch-free ACPI state transitions Hardware-controlled switching between PWM and standby LDO eliminates voltage droop or overshoot during S0↔S3↔S5 transitions.
Integrated VTT sink-source regulation Eliminates need for discrete op-amp + pass transistor; reduces BOM count and layout area for DDR termination.
VREF_OUT buffer Delivers stable, low-noise VDDQ/2 reference to memory controller and DIMMs without external buffering components.
Single-loop voltage-mode PWM Simplifies compensation design with predictable gain-bandwidth (15 MHz) and slew rate (6 V/µs) for stable loop tuning.
Comprehensive fault protection Includes UV/OV on both outputs, thermal shutdown at 140°C, and hiccup-mode recovery for persistent faults.

Applications

Desktop PC Memory Power Graphics Card Memory Supply

Use Scenario: Dual-channel DDR2 memory subsystem in ATX desktop motherboard requiring ACPI S3/S4/S5 compliance.

IC Role / Device Role / Timing Role: Primary power controller managing VDDQ and VTT rails, coordinating with MCH and SLP_S3#/SLP_S5# signals.

Use Value: Eliminates need for separate VTT generator IC and simplifies power sequencing with integrated NCH backfeed control.

Use Scenario: GPU memory power delivery on PCIe graphics card with tight space constraints and thermal limits.

IC Role / Device Role / Timing Role: Regulator for GDDR2/GDDR3 memory termination and core voltage, synchronized to GPU power states.

Use Value: ±3 A VTT sourcing/sinking capability meets high-speed memory I/O current demands without external amplification.

ASIC Memory Interface Supply Embedded DDR Memory System

Use Scenario: High-performance ASIC with embedded DDR2 controller requiring clean, low-noise VDDQ and VTT rails.

IC Role / Device Role / Timing Role: Dedicated memory power manager interfacing with ASIC's sleep control logic and DDR PHY.

Use Value: ±2% regulation accuracy ensures signal integrity margin for high-speed DDR2 data eye compliance.

Use Scenario: Industrial embedded system using DDR2 memory in fanless enclosure with limited airflow.

IC Role / Device Role / Timing Role: Thermal-aware power controller providing S3 suspend capability and 140°C shutdown protection.

Use Value: Exposed thermal pad and QFN-20 footprint enable effective heat transfer in thermally constrained environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR memory power controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISL6537CRZ Higher VTT current (±4 A), added VPP rail support, same 20-pin QFN package and pinout. Targeted at DDR3 systems requiring higher termination current and additional voltage rail. Select ISL6537CRZ when upgrading to DDR3 or needing VPP generation; ISL6532CRZ remains optimal for DDR2 cost-sensitive designs.
RT8205AZSP Single-chip DDR3 solution with integrated VDDQ, VTT, VPP, and VREF; uses different control architecture (current-mode PWM). Designed for newer DDR3 platforms with tighter voltage tolerances and faster transient response needs. RT8205AZSP offers broader feature set but lacks direct ACPI S3/S5 hardware state logic; requires firmware coordination.

Compared with ISL6532CRZ, ISL6537CRZ provides higher VTT current and VPP support in identical packaging, while RT8205AZSP integrates more rails but replaces hardware ACPI logic with software-managed sequencing-making ISL6532CRZ the preferred choice for legacy DDR2 systems requiring deterministic, low-latency state transitions.

Availability

ISL6532CRZ is available at Aetrix Electronics and suitable for desktop motherboards, graphics cards, ASIC memory interfaces, and embedded DDR2 systems requiring stable component supply, long-term lifecycle support, and Pb-free compliance.

Supply support for ISL6532CRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics acquired Intersil in 2017 and maintains full technical and manufacturing continuity for legacy Intersil power management products.

The ISL6532CRZ belongs to Intersil's ACPI-compliant memory power controller family, designed specifically for DDR/DDR2 memory subsystems in PC, graphics, and embedded computing platforms where deterministic power-state transitions and tight voltage regulation are critical.

FAQ

What is the primary function of the ISL6532CRZ in a DDR memory system?

The ISL6532CRZ serves as a complete ACPI-compliant power controller for DDR/DDR2 memory, generating and regulating both the VDDQ core voltage (via synchronous buck PWM) and the VTT termination voltage (via integrated sink-source LDO). It manages seamless transitions between S0, S3, and S5 states using dedicated S3# and S5# inputs, and provides buffered VREF_OUT for system-level reference distribution. This functionality is fully implemented in the ISL6532CRZ without requiring external sequencing logic.

Does the ISL6532CRZ support both 5VSBY and 3.3VSBY inputs for standby VDDQ operation?

Yes, the ISL6532CRZ supports either 5VSBY or 3.3VSBY on the P5VSBY pin to power the integrated standby LDO during S3 state. When supplied from 5VSBY, the LDO delivers up to 650 mA; from 3.3VSBY, it delivers up to 550 mA. This dual-input flexibility allows the ISL6532CRZ to operate across ATX power supplies with varying standby rail configurations without redesigning the power stage.

How does the NCH pin function in the ISL6532CRZ, and what external component is required?

The NCH pin on the ISL6532CRZ is an open-drain output that controls the backfeed-blocking MOSFET during sleep transitions. It must be externally pulled up to the 12V rail using a resistor ≥2 kΩ. The ISL6532CRZ holds NCH low until the P12V rail exceeds 9.5 V, preventing premature PWM activation. If unused, NCH still requires this pull-up; adding a capacitor to the NCH node can delay PWM start-up in 5V-dual input configurations. This behavior is intrinsic to the ISL6532CRZ's hardware state machine.

What is the maximum VTT load current supported by the ISL6532CRZ, and how is it measured?

The ISL6532CRZ supports a maximum VTT load current of ±3 A, measured under periodic loading conditions (30% duty cycle, 10 ms period) using the ISL6532EVAL1 evaluation board per Application Note AN1055. This rating reflects the device's ability to both source and sink current simultaneously-critical for DDR memory I/O bus termination-and is validated at the VTTSNS feedback node. The ISL6532CRZ achieves this with no external components beyond the recommended RU/RL divider network.

Is the ISL6532CRZ pin-compatible with any newer Renesas alternatives for DDR2-to-DDR3 migration?

No, the ISL6532CRZ is not pin-compatible with DDR3-targeted successors like the ISL6537CRZ, despite sharing the same 20-pin QFN package and footprint. While ISL6537CRZ retains identical pin assignments for power, ground, and control signals, its enhanced VTT current (±4 A) and added VPP rail require updated layout for decoupling and thermal management. Migration from ISL6532CRZ to ISL6537CRZ necessitates validation of VTT loop stability and VPP sequencing-not just drop-in replacement-due to differences in internal protection thresholds and startup timing.

ISL6532CRZ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
20-VQFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Applications:
Memory, DDR/DDR2 Regulator
Current - Supply:
5.25mA
Voltage - Supply:
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (6x6)

ISL6532CRZ FAQ

1.How can I place an order for ISL6532CRZ through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL6532CRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL6532CRZ reliable?

The price and inventory of ISL6532CRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6532CRZ is usually 5 days.

3.What payment methods are accepted for ISL6532CRZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6532CRZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL6532CRZ?

ISL6532CRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL6532CRZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL6532CRZ?

For technical support, including ISL6532CRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6532CRZ requirements.

6.How does Aetrix verify that ISL6532CRZ is sourced from the original manufacturer or authorized distributors?

All ISL6532CRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6532CRZ meets industry standards.

7.What is the process for return or replacement of ISL6532CRZ?

All ISL6532CRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6532CRZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL6532CRZ part is unused and in its original packaging.

Return procedure for ISL6532CRZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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