STMicroelectronics ISM330DHCXTR

Overview

ISM330DHCXTR from STMicroelectronics is a high-accuracy 3D accelerometer and 3D gyroscope system-in-package optimized for Industry 4.0 applications. It delivers ±2/±4/±8/±16 g acceleration range, ±125 to ±4000 dps angular rate range, embedded Machine Learning Core (MLC), programmable Finite State Machine (FSM), and 9 kbyte smart FIFO - enabling real-time motion analytics in industrial IoT edge nodes, optical image stabilization (OIS), and robotic navigation systems.

For engineers reviewing the ISM330DHCXTR datasheet, ISM330DHCXTR pinout, ISM330DHCXTR application, or ISM330DHCXTR equivalent, key selection considerations include dual SPI/I²C interfaces with auxiliary SPI for closed-loop OIS, temperature-stable bias (<±3 dps zero-rate drift), synchronized 6-channel output, and on-device pedometer/tilt/wakeup interrupt generation without host CPU intervention.

Technical Context

The ISM330DHCXTR integrates accelerometer and gyroscope sensing elements on a single silicon die, ensuring superior mechanical coupling and thermal tracking. Its dual-path architecture supports simultaneous high-bandwidth sensor data streaming via main interface and low-latency control-loop feedback via dedicated auxiliary SPI - critical for lens stabilization and motion-critical robotics.

Embedded MLC executes up to 8 independent classification flows using configurable "if-then-else" nodes (max 512 total), processing raw accelerometer/gyro data or fused external sensor inputs from the Sensor Hub. The FSM block runs 16 independent state machines for deterministic motion pattern detection - both blocks operate autonomously at <1.5 mA total supply current in high-performance mode.

Key Specifications

Pinout & Package

LGA-14L package (2.5 × 3.0 × 0.83 mm), land grid array with exposed thermal pad (not electrically connected). Pin functions vary by interface mode (I²C/SPI/main/auxiliary); all configurations supported without external hardware change.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar inertial measurement applications.

Compared with LSM6DSRXTR and ICM-42688-P, the ISM330DHCXTR uniquely combines auxiliary SPI for OIS, 8-flow MLC, and single-die co-location - delivering superior thermal stability, lower system latency, and higher on-sensor intelligence for Industry 4.0 edge nodes.

Availability

ISM330DHCXTR is available at Aetrix Electronics and suitable for industrial IoT gateways, optical image stabilization modules, and robotic motion controllers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for ISM330DHCXTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in MEMS, power management, microcontrollers, and automotive ICs with vertical manufacturing capability.

The ISM330DHCXTR belongs to ST's iNEMO inertial module family, engineered specifically for high-reliability industrial edge sensing - emphasizing on-device intelligence, thermal robustness, and dual-interface flexibility for closed-loop control.

FAQ

What is the maximum angular rate range supported by the ISM330DHCXTR?

The ISM330DHCXTR supports six selectable gyroscope full-scale ranges: ±125, ±250, ±500, ±1000, ±2000, and ±4000 dps. The ±4000 dps range enables high-dynamic applications such as drone propeller speed monitoring and CNC spindle vibration analysis, with factory-calibrated sensitivity of 140 mdps/LSB and <±3 dps zero-rate offset over temperature.

How does the auxiliary SPI interface differ from the main SPI interface?

The auxiliary SPI (pins OCS_Aux, SDO_Aux, SCx, SDx) is physically and logically isolated from the main SPI/I²C interface. It operates independently with its own clock and chip select, allowing concurrent high-priority OIS data streaming (e.g., 6667 Hz gyro samples) while the main interface handles configuration, diagnostics, and fused sensor data - eliminating bus contention and latency jitter.

Can the Machine Learning Core run custom models trained externally?

Yes - the MLC accepts user-defined decision trees compiled via ST's Unico-GUI or X-CUBE-MEMS1 firmware. Up to 8 flows can be loaded, each comprising up to 256 results derived from 512 configurable "if-then-else" nodes that evaluate features (e.g., RMS acceleration, spectral centroid) against programmable thresholds - no host CPU involvement required during inference.

What is the role of the Sensor Hub feature in Mode 2 operation?

In Mode 2, the Sensor Hub acts as an I²C master, polling up to four external sensors (e.g., magnetometer, humidity sensor) and feeding their data into the FSM and MLC alongside internal accelerometer/gyro streams. This enables full 9-DoF fusion and context-aware classification (e.g., distinguishing walking on concrete vs. grass) without adding a separate hub IC or host software overhead.