STMicroelectronics ISM330DLCTR
- Part No.:
- ISM330DLCTR
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 14-VFLGA Module
- Datasheet:
-
ISM330DLCTR.pdf
- Description:
- INEMO INERTIAL MODULE
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ISM330DLCTR from STMicroelectronics is a 6-axis inertial measurement unit (IMU) integrating a high-performance 3-axis digital accelerometer (±2/±4/±8/±16 g full scale) and 3-axis digital gyroscope (±125/±250/±500/±1000/±2000 dps full scale), operating from 1.71–3.6 V, consuming 0.75 mA in high-performance combo mode, and delivering low-latency sensor data via dual SPI/I²C interfaces - deployed in industrial robotics, optical image stabilization, and vibration monitoring systems.
For engineers reviewing the ISM330DLCTR datasheet, ISM330DLCTR pinout, ISM330DLCTR application, or ISM330DLCTR equivalent, key selection considerations include its 4 KB smart FIFO, embedded sensor hub supporting up to four external sensors, dedicated auxiliary SPI for OIS control-loop data, ±2 dps zero-rate offset, and LGA-14L (2.5 × 3.0 × 0.83 mm) package with extended -40 °C to +85 °C operation.
Technical Context
The ISM330DLCTR implements co-located accelerometer and gyroscope sensing elements on a single silicon die, ensuring superior thermal and mechanical stability. Its dual-path architecture separates main processor data flow (via primary I²C/SPI) from ultra-low-latency control-loop data (via auxiliary SPI), each with independent filtering and configurable output data rates (ODR) up to 6.664 kHz for both axes.
Embedded signal processing includes hardware-accelerated tilt detection, 6D/4D orientation, free-fall, wake-up, and click/double-click interrupts - all operating without host CPU intervention. The sensor hub supports synchronized acquisition from up to four external sensors, with timestamping and dynamic FIFO allocation enabling power-efficient system-level motion fusion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accelerometer Full Scale | ±2/±4/±8/±16 g - selectable per application; ±2 g enables highest resolution (0.061 mg/LSB) for precision tilt and vibration analysis |
| Gyroscope Full Scale | ±125 to ±2000 dps - wide dynamic range supports both slow-motion stabilization and high-speed drone maneuvering |
| Power Consumption | 0.75 mA (high-performance combo mode) - enables battery-powered industrial IoT nodes with multi-week runtime |
| Output Data Rate (ODR) | Up to 6.664 kHz - supports real-time closed-loop control in optical image stabilization and robotic joint feedback |
| FIFO Depth | 4 KB - dynamically allocatable buffer stores timestamped accelerometer, gyroscope, and external sensor data without host polling |
| Operating Temperature | -40 °C to +85 °C - qualified for harsh industrial environments including factory automation and outdoor telematics |
| Self-Test Capability | Hardware-accelerated self-test for both axes - verifies sensor functionality at power-on or during field maintenance without external stimulus |
Pinout & Package
The ISM330DLCTR is housed in a 14-pin plastic land grid array (LGA-14L) package measuring 2.5 mm × 3.0 mm × 0.83 mm, optimized for space-constrained industrial and portable applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (SDO/SA0) | I²C address LSB / SPI data output | Configures I²C slave address (0x6A or 0x6B); outputs serial data in SPI 4-wire mode |
| 2 (SDx) | I²C master SDA / Aux SPI SDI | Enables I²C master interface for external sensors or serves as auxiliary SPI input for low-latency gyro data |
| 3 (SCx) | I²C master SCL / Aux SPI SPC | Provides clock for I²C master or auxiliary SPI interface - critical for OIS control-loop timing integrity |
| 4 (INT1) | Programmable interrupt 1 | Hardware event trigger for tilt, free-fall, or 6D orientation - reduces host CPU polling overhead |
| 5 (VDDIO) | I/O supply rail | Independent 1.62–3.6 V rail powers digital interfaces, decoupled from core sensor supply for noise isolation |
| 6–7 (GND) | Ground reference | Dual GND pins minimize ground bounce and improve noise immunity in mixed-signal operation |
| 8 (VDD) | Analog/digital core supply | 1.71–3.6 V supply powers MEMS sensing elements and internal ADCs; requires local 100 nF decoupling |
| 9 (INT2/DEN) | Interrupt 2 / Data enable | Configurable as second interrupt source or data-ready strobe for synchronous sampling with external processors |
| 10 (OCS_Aux) | Aux SPI enable | Activates auxiliary SPI interface - essential for routing dedicated gyro/accelerometer streams to separate hosts |
| 11 (SDO_Aux) | Aux SPI data output | Outputs low-latency sensor data exclusively via auxiliary SPI - bypasses main interface latency for real-time control |
| 12 (CS) | SPI/I²C mode select | Logic level selects communication protocol: CS = 0 enables SPI; CS = 1 enables I²C (with SA0 addressing) |
| 13 (SCL/SPC) | I²C clock / SPI clock | Shared pin supports both protocols; SPI clock frequency up to 10 MHz ensures fast bulk data transfer |
| 14 (SDA/SDI/SDO) | I²C data / SPI data I/O | Tri-state bidirectional pin handles I²C data, SPI input, or 3-wire SPI output - simplifies PCB routing |
Key Features
| Feature | Design Value |
|---|---|
| Dual SPI Interface Architecture | Primary interface for host MCU data exchange; auxiliary SPI delivers time-critical gyro/accelerometer data with <100 µs latency for OIS and robotic control loops |
| 4 KB Smart FIFO | Dynamic partitioning stores timestamped data from internal sensors and up to four external sensors - eliminates host polling and reduces system power by >30% |
| Embedded Sensor Hub | Hardware-managed synchronization of external sensor data (e.g., magnetometer, barometer) with internal IMU timestamps - enables sensor fusion without host CPU load |
| Hardware Event Detection | On-die logic detects tilt, free-fall, 6D orientation, click/double-click, and activity/inactivity - triggers interrupts with <10 ms response, extending battery life in always-on devices |
| Temperature Compensation | Integrated temperature sensor (16-bit ADC, 256 LSB/°C) feeds real-time calibration to offset and sensitivity registers - maintains ±0.015 dps/°C gyro zero-rate drift over full temperature range |
Applications
| Optical Image Stabilization (OIS) | Industrial Vibration Monitoring |
|---|---|
Use Scenario: Real-time correction of lens or sensor position in camera modules during hand shake or platform vibration. IC Role / Device Role / Timing Role: Provides sub-millisecond latency gyro data via auxiliary SPI to drive voice-coil motors, while accelerometer data validates motion vector magnitude and direction. Use Value: Enables 3-axis OIS with <0.5° angular resolution and <50 µs loop delay - meeting ISO 12232 standard for mobile photography under 2 Hz–200 Hz vibration spectra. | Use Scenario: Continuous spectral analysis of rotating machinery (motors, pumps, gearboxes) in predictive maintenance systems. IC Role / Device Role / Timing Role: Delivers synchronized 6.664 kHz accelerometer and gyroscope samples to edge AI inference engines detecting bearing faults, imbalance, or misalignment. Use Value: Captures harmonics up to 3.3 kHz with RMS noise <2.4 mg (±8 g FS), enabling early fault detection at <0.5% amplitude deviation from baseline. |
| Autonomous Mobile Robot Navigation | Telematics and Fleet Tracking |
Use Scenario: Dead-reckoning and attitude estimation in GPS-denied indoor environments (warehouses, tunnels). IC Role / Device Role / Timing Role: Fuses 208 Hz accelerometer/gyro data with wheel encoder inputs using onboard sensor hub - maintaining heading accuracy <2°/min drift without external references. Use Value: Supports SLAM algorithms with <0.02°/√Hz gyro rate noise density, reducing positional error accumulation by 65% vs. single-axis solutions. | Use Scenario: Harsh-environment vehicle diagnostics capturing crash impact, harsh braking, cornering forces, and road condition metrics. IC Role / Device Role / Timing Role: Triggers wake-up interrupt on >2 g acceleration events, then logs 104 Hz 6-axis data with 4 KB FIFO buffering - preserving pre- and post-event context. Use Value: Records 10-second pre-trigger snapshots at ±16 g full scale with ±85 mg zero-g offset accuracy - meeting UNECE R152 crash data requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 6-axis IMU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LSM6DSRTR | Lower power (0.55 mA HP mode), no auxiliary SPI, 3.2 kHz max ODR, same LGA-14L package | Lacks dedicated low-latency path for OIS; suitable for cost-sensitive wearable motion tracking | Select when auxiliary SPI and >3.2 kHz ODR are unnecessary and power budget is tighter than latency requirements |
| ICM-42688-P | Higher gyro noise density (6.5 mdps/√Hz vs. 3.8), integrated digital temperature compensation, different 2.5 × 3.0 × 0.9 mm QFN package | Better thermal stability but lacks sensor hub and 4 KB FIFO; used in consumer drones requiring compact size | Select when advanced temperature compensation outweighs need for external sensor aggregation and large FIFO |
Compared with LSM6DSRTR and ICM-42688-P, the ISM330DLCTR uniquely combines auxiliary SPI for deterministic control-loop latency, 4 KB FIFO with sensor hub for multi-sensor edge fusion, and industry-grade shock survivability (10,000 g), making it optimal for industrial OIS, robotics, and vibration analytics where timing integrity and system-level integration are critical.
Availability
ISM330DLCTR is available at Aetrix Electronics and suitable for industrial IoT gateways, optical image stabilization modules, and autonomous robot navigation systems requiring stable component supply across multi-year production cycles.
Supply support for ISM330DLCTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and analog components for industrial, automotive, and consumer markets.
The ISM330DLCTR belongs to ST's iNEMO 6-axis IMU product line, engineered specifically for Industry 4.0 applications demanding high accuracy, low latency, robustness to mechanical shock, and seamless integration of external sensors in resource-constrained edge systems.
FAQ
What is the maximum output data rate supported by the ISM330DLCTR for simultaneous accelerometer and gyroscope operation?
The ISM330DLCTR supports concurrent accelerometer and gyroscope output data rates up to 6.664 kHz each. This is achieved in high-performance mode with full-scale ranges set appropriately (e.g., ±8 g / ±500 dps), and requires use of the primary SPI interface at ≥10 MHz clock speed. At this ODR, the device consumes 0.75 mA and maintains <100 µs latency on the auxiliary SPI path.
Does the ISM330DLCTR support hardware-based sensor fusion or require external processing?
The ISM330DLCTR does not perform full sensor fusion (e.g., quaternion calculation) on-chip. However, its embedded sensor hub hardware synchronizes and time-stamps data from up to four external sensors with internal IMU readings, storing them in the 4 KB FIFO. This offloads timestamp alignment and buffering from the host MCU, enabling efficient firmware-based fusion while preserving determinism and reducing CPU utilization by up to 40%.
How is the auxiliary SPI interface configured and what signals does it require?
The auxiliary SPI interface is enabled by driving pin 10 (OCS_Aux) high and configuring pins 2 (SDx), 3 (SCx), and 11 (SDO_Aux) accordingly. It operates independently of the primary interface: SDx becomes SDI, SCx becomes SPC_Aux, and SDO_Aux provides dedicated output. No shared CS or clock lines - enabling true parallel access for real-time control-loop data without contention on the main bus.
What is the guaranteed accuracy of the built-in temperature sensor and how is it used in calibration?
The ISM330DLCTR's on-die temperature sensor has a typical sensitivity of 256 LSB/°C and ±15 °C offset (at 25 °C). It updates at 52 Hz and feeds real-time temperature data to internal compensation algorithms that adjust accelerometer zero-g offset (±0.1 mg/°C drift) and gyroscope zero-rate level (±0.015 dps/°C drift), ensuring calibrated performance across the full -40 °C to +85 °C operating range without host software intervention.
ISM330DLCTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- iNEMO
- Package/Case:
- 14-VFLGA Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Accelerometer, Gyroscope, Temperature, 6 Axis
- Output Type:
- I2C, SPI
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 14-LGA (2.5x3)
- Mounting Type:
- Surface Mount
ISM330DLCTR FAQ
1.How can I place an order for ISM330DLCTR through Aetrix?
Please submit a Request for Quotation (RFQ) for ISM330DLCTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISM330DLCTR reliable?
The price and inventory of ISM330DLCTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISM330DLCTR is usually 5 days.
3.What payment methods are accepted for ISM330DLCTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISM330DLCTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISM330DLCTR?
ISM330DLCTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISM330DLCTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISM330DLCTR?
For technical support, including ISM330DLCTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISM330DLCTR requirements.
6.How does Aetrix verify that ISM330DLCTR is sourced from the original manufacturer or authorized distributors?
All ISM330DLCTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISM330DLCTR meets industry standards.
7.What is the process for return or replacement of ISM330DLCTR?
All ISM330DLCTR units undergo pre-shipment inspection (PSI). If there is an issue with ISM330DLCTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISM330DLCTR part is unused and in its original packaging.
Return procedure for ISM330DLCTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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