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STMicroelectronics ISM330ISN
- Part No.:
- ISM330ISN
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 14-VFLGA
- Datasheet:
-
ISM330ISN.pdf
- Description:
- INEMO INERTIAL MODULE: ALWAYS-ON
- Quantity:
- Payment:
- Shipping:
Inventory:1,956
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Product details
Overview
ISM330ISN from STMicroelectronics is a 6-axis inertial measurement unit (IMU) system-in-package integrating a 3-axis digital accelerometer (±2/±4/±8/±16 g FS), a 3-axis digital gyroscope (±125–±2000 dps FS), and an Intelligent Sensor Processing Unit (ISPU) - enabling on-sensor AI inference for anomaly detection, gesture recognition, and condition monitoring in industrial IoT edge nodes. It operates at 0.59 mA in high-performance mode and supports SPI/I²C interfaces with independent IO supply (1.62–3.6 V).
For engineers reviewing the ISM330ISN datasheet, ISM330ISN pinout, ISM330ISN application, or ISM330ISN equivalent, this device is selected for ultra-low-power always-on motion sensing where real-time edge AI execution (via NanoEdge AI Studio libraries), sensor hub aggregation of up to four external sensors, and compact LGA-14L (2.5 × 3.0 × 0.83 mm) packaging are critical design requirements.
Technical Context
The ISM330ISN implements a dual-core architecture: a sensor core (8-bit register interface) managing accelerometer/gyroscope configuration and raw data output, and a dedicated ISPU core (32-bit STRED architecture) with 32 KB program RAM and 8 KB data RAM executing C-programmed signal processing and ML inference directly on sensor data. The ISPU accesses raw sensor data via mapped registers (e.g., ISPU_ARAW_X_L at 6880h) and outputs results through 64-byte ISPU_DOUT registers.
It supports two hardware modes: Mode 1 enables I²C/SPI host communication only; Mode 2 adds master I²C capability (MSDA/MSCL pins) to interface with up to four external sensors. Programmable interrupts (INT1/INT2) allow event-driven wake-up of host MCUs, reducing system-level power consumption in battery-operated asset trackers and smart industrial nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accelerometer FS | ±2/±4/±8/±16 g - selectable full-scale range determines dynamic range and resolution (e.g., 0.061 mg/LSB at ±2 g) |
| Gyroscope FS | ±125/±250/±500/±1000/±2000 dps - higher ranges support fast rotational motion capture without clipping |
| Current (HP mode) | 0.59 mA - total active current for accel + gyro only; excludes ISPU, enabling <1 µA system sleep when ISPU handles wake-up |
| Accel noise density | 70 µg/√Hz - defines minimum detectable vibration amplitude in high-performance mode for precision condition monitoring |
| ODR range | 1.6–6667 Hz - supports low-frequency asset tracking (1.6 Hz) and high-speed motion capture (6.6 kHz) from single device |
| ISPU memory | 32 KB program RAM + 8 KB data RAM - sufficient for NanoEdge AI Studio-generated ML models targeting binary classification or regression |
| Temp sensor | 16-bit ADC, 256 LSB/°C sensitivity - provides calibrated on-die temperature reference for thermal compensation of IMU bias drift |
Pinout & Package
ISM330ISN uses a 14-pin LGA package (2.5 mm × 3.0 mm × 0.83 mm), RoHS-compliant and ECOPACK certified. Pin functions support dual-mode operation (I²C/SPI host + optional I²C master for external sensors).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 SDO/SA0 | I²C address LSB / SPI data output | Selects I²C slave address bit (Mode 1) or outputs SPI serial data (Mode 2); enables multi-device I²C bus sharing |
| 2 MSDA | I²C master serial data | Drives SDA line when ISM330ISN acts as master to read external sensors (Mode 2 only) |
| 3 MSCL | I²C master serial clock | Generates clock for external sensor reads in master mode; requires pull-up to Vdd_IO |
| 4 INT1 | Programmable interrupt output | Asserts on configurable events (e.g., motion detection, FIFO threshold, ISPU result ready) to wake host MCU |
| 5 Vdd_IO | Digital I/O supply | Independent 1.62–3.6 V rail powers all digital interfaces; decoupling capacitor required |
| 6–7 GND | Ground reference | Dual ground pins reduce impedance and improve noise immunity for analog and digital sections |
| 8 Vdd | Analog/sensor core supply | 1.71–3.6 V supply for MEMS sensing elements and internal regulators; separate from Vdd_IO |
| 9 INT2 | Secondary interrupt / MDRDY | Second interrupt source or master I²C ready signal (Mode 2), enabling synchronized external sensor reads |
| 10–11 RES | Reserved | Electrically unconnected; must be soldered to PCB but left floating per datasheet |
| 12 CS | Interface mode select | High = I²C enabled / SPI idle; Low = SPI enabled / I²C disabled - configures physical layer protocol |
| 13 SCL/SPC | I²C clock / SPI clock | Shared pin: SCL in I²C mode, SPC in SPI mode; timing compliant with Fast Mode (400 kHz) and Fast Mode Plus (1 MHz) |
| 14 SDA/SDI/SDO | I²C data / SPI input-output | Tri-state bidirectional pin: SDA (I²C), SDI (SPI input), or SDO (3-wire SPI output) |
Key Features
| Feature | Design Value |
|---|---|
| ISPU programmability | C-language development supported via NanoEdge AI Studio; enables on-sensor ML inference without host CPU involvement |
| Sensor hub | Aggregates data from internal accel/gyro + up to four external I²C sensors (e.g., pressure, humidity) using integrated master I²C |
| Low-noise accel | 70 µg/√Hz noise density at ±2 g FS enables sub-millig detection of subtle vibrations in predictive maintenance systems |
| Dual ODR control | Independent output data rate selection for accelerometer (1.6–6667 Hz) and gyroscope (12.5–6667 Hz) optimizes power vs. bandwidth trade-offs |
| Self-test capability | Hardware-accelerated self-test (50–1700 mg accel / 20–700 dps gyro) validates sensor functionality during power-up or runtime diagnostics |
Applications
| Industrial Asset Tracking | Anomaly Detection |
|---|---|
|
Use Scenario: Real-time location and orientation monitoring of mobile machinery (AGVs, forklifts) across factory floors with periodic BLE/Wi-Fi upload. IC Role / Device Role / Timing Role: 6-axis IMU provides fused motion state (tilt, acceleration, rotation) while ISPU executes lightweight motion classification to trigger uploads only on movement events. Use Value: Reduces wireless transmission frequency by >90% versus continuous streaming, extending battery life to >2 years on coin cell. |
Use Scenario: Vibration-based health monitoring of rotating equipment (pumps, motors) to detect bearing wear or imbalance before failure. IC Role / Device Role / Timing Role: Accelerometer captures high-fidelity time-domain vibration waveforms; ISPU runs FFT + spectral feature extraction to identify fault frequencies locally. Use Value: Eliminates need for cloud-based analytics; enables immediate local alerting and reduces data bandwidth by 95% vs. raw waveform streaming. |
| Smart Home Event Detection | Personal Health Gesture Recognition |
|
Use Scenario: Occupancy-aware lighting and HVAC control triggered by door opening, fall detection, or glass break events in residential environments. IC Role / Device Role / Timing Role: Gyroscope detects rapid angular displacement (door swing); ISPU fuses accel/gyro data to distinguish intentional motion from false triggers (e.g., pets). Use Value: Achieves >99.5% detection accuracy with <10 µA average current draw, enabling maintenance-free operation for 5+ years. |
Use Scenario: Wearable devices identifying hand gestures (swipe, tap, rotate) for hands-free UI control in fitness trackers or AR glasses. IC Role / Device Role / Timing Role: High-ODR (≥416 Hz) accel/gyro captures transient motion transients; ISPU executes CNN-based gesture classifier trained via NanoEdge AI Studio. Use Value: Delivers <50 ms end-to-end latency from gesture to system response, with zero cloud dependency and GDPR-compliant on-device processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 6-axis IMU with edge AI applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BMI323 (Bosch) | No embedded programmable AI core; relies on host MCU for ML inference; lower current (0.35 mA HP) but no on-sensor processing | Lacks ISPU-level autonomy; requires host processor for all AI tasks, increasing system power and latency | Select when system already has capable MCU and AI workload is light; avoid when ultra-low-power edge inference is mandatory |
| ICM-42688-P (TDK InvenSense) | Includes DMP (digital motion processor) with fixed firmware for basic gestures; no C-programmable core or NanoEdge AI Studio support | Supports pre-defined motion features only (tap, pick-up); cannot run custom ML models or adapt to new anomalies | Choose for cost-sensitive consumer applications needing standard motion features; not suitable for evolving industrial AI use cases |
Compared with BMI323 and ICM-42688-P, the ISM330ISN uniquely delivers field-upgradable, C-programmable edge AI execution with full toolchain support - making it the only option among the three that enables true on-sensor learning and adaptive anomaly detection without host intervention.
Availability
ISM330ISN is available at Aetrix Electronics and suitable for industrial asset tracking, predictive maintenance systems, smart home security nodes, and wearable health monitors requiring stable component supply, long-term lifecycle assurance, and verified NanoEdge AI Studio compatibility.
Supply support for ISM330ISN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and automotive chips with vertical fabrication capabilities.
The ISM330ISN belongs to ST's intelligent inertial module product line, engineered specifically for Industry 4.0/5.0 edge intelligence - integrating MEMS sensing, ultra-low-power processing, and AI toolchain integration to enable autonomous, self-diagnosing industrial endpoints.
FAQ
What distinguishes ISM330ISN from ISM330ISTR?
The ISM330ISN is the NanoEdge AI Studio–enabled variant, featuring a dedicated ISPU configuration that supports loading and executing machine learning libraries generated by ST's NanoEdge AI Studio tool. The ISM330ISTR lacks this ISPU firmware capability and cannot run NanoEdge AI models - it supports only standard sensor hub and interrupt functions. Both share identical mechanical, electrical, and pinout specifications.
Can the ISPU execute custom C code beyond NanoEdge AI Studio libraries?
Yes - the ISPU is a fully programmable 32-bit STRED core with 32 KB program RAM and 8 KB data RAM. Developers may write, compile, and load custom C applications using ST's ISPU SDK, provided memory and instruction set constraints are met. NanoEdge AI Studio is one supported workflow, not an exclusive requirement.
How does the sensor hub interface with external I²C sensors?
In Mode 2, pins MSDA (pin 2) and MSCL (pin 3) become active I²C master lines. The ISPU or sensor core can initiate reads from up to four external sensors via these lines, storing raw data in ISPU_ERAW registers (6898h–68A1h). No host MCU intervention is required - the hub operates autonomously under ISPU or register-based control.
What is the role of the two RES pins (10 and 11)?
Pins 10 and 11 are reserved and must be left electrically unconnected - neither tied to Vdd_IO nor GND. Per ST's DS13763 specification, they are physically soldered to the PCB pad but kept floating to ensure signal integrity and avoid unintended coupling into sensitive analog paths within the LGA package.
ISM330ISN Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 14-VFLGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Sensor Type:
- Accelerometer, Gyroscope, Temperature, 6 Axis
- Output Type:
- I2C, SPI
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 14-LGA (2.5x3)
- Mounting Type:
- Surface Mount
ISM330ISN FAQ
1.How can I place an order for ISM330ISN through Aetrix?
Please submit a Request for Quotation (RFQ) for ISM330ISN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISM330ISN reliable?
The price and inventory of ISM330ISN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISM330ISN is usually 5 days.
3.What payment methods are accepted for ISM330ISN?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISM330ISN transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISM330ISN?
ISM330ISN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISM330ISN order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISM330ISN?
For technical support, including ISM330ISN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISM330ISN requirements.
6.How does Aetrix verify that ISM330ISN is sourced from the original manufacturer or authorized distributors?
All ISM330ISN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISM330ISN meets industry standards.
7.What is the process for return or replacement of ISM330ISN?
All ISM330ISN units undergo pre-shipment inspection (PSI). If there is an issue with ISM330ISN, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISM330ISN part is unused and in its original packaging.
Return procedure for ISM330ISN:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ISM330ISN Tags
-
BMI323
Bosch Sensortec
-
ICM-42670-P
TDK InvenSense
-
ICM-42605
TDK InvenSense
-
LSM6DSO32TR
STMicroelectronics
-
LSM6DSOTR
STMicroelectronics
-
LSM6DSVTR
STMicroelectronics
-
LSM6DSRTR
STMicroelectronics
-
BMI270
Bosch Sensortec
-
LSM6DSOXTR
STMicroelectronics
-
LSM6DSV16XTR
STMicroelectronics
-
LSM6DSO16ISTR
STMicroelectronics
-
LSM303AGRTR
STMicroelectronics
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