Infineon Technologies ISZ028N03LF2SATMA1
- Part No.:
- ISZ028N03LF2SATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
ISZ028N03LF2SATMA1.pdf
- Description:
- ISZ028N03LF2SATMA1
- Quantity:
- Payment:

- Shipping:

Inventory:2,499
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ISZ028N03LF2SATMA1 from Infineon is a 30 V, logic-level N-channel TSDSON-8 MOSFET with 2.8 mΩ RDS(on) at VGS = 10 V, 128 A continuous drain current, 100% avalanche tested, and rated for 175 °C operation-designed for high-efficiency synchronous rectification in DC-DC converters.
For engineers reviewing the ISZ028N03LF2SATMA1 datasheet, ISZ028N03LF2SATMA1 pinout, ISZ028N03LF2SATMA1 application, or ISZ028N03LF2SATMA1 equivalent, key selection criteria include low gate charge (Qg = 27 nC), fast switching (tr = 7.6 ns), robust thermal resistance (RthJC = 1.8 °C/W), and logic-level drive compatibility down to 4.5 V.
Technical Context
This StrongIRFET™ 2 device uses trench-gate superjunction technology optimized for high-current, low-voltage switching. Its 8-pin PG-TSDSON-FL package enables double-sided cooling and supports >100 A peak current handling via internal paralleled die structure.
The MOSFET features an integrated body diode with trr = 15 ns and Qrr = 31 nC, enabling efficient synchronous FET operation in buck and multiphase VRMs. Gate plateau voltage is fixed at 3.2 V, ensuring stable Miller region control during hard-switching transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage compatible with 12 V and 24 V input systems |
| RDS(on) max | 2.8 mΩ at VGS = 10 V - Enables <1 W conduction loss at 60 A in 48 V–12 V step-down stages |
| ID cont | 128 A at TC = 25 °C - Supports high-current power delivery in server VRMs and industrial motor drives |
| Qg | 27 nC at VGS = 0–10 V - Reduces gate driver power demand and switching losses in 500 kHz+ applications |
| RthJC | 1.8 °C/W - Allows direct heatsink mounting on top-side copper for thermal management in compact layouts |
| tr/tf | 7.6 ns / 6.4 ns - Minimizes overlap loss in synchronous rectifiers operating above 300 kHz |
| VGS(th) | 1.35–2.35 V - Ensures reliable turn-on with standard 3.3 V or 5 V logic-level controllers |
Pinout & Package
PG-TSDSON-8 FL (exposed drain pad) package with bottom-side thermal interface and top-side source/gate terminals. Pin 1–3: Source; Pin 4: Gate; Pin 5–8: Drain (internally paralleled).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–3 (S) | Source terminal | Low-inductance parallel connection for return path integrity in high-di/dt synchronous rectification |
| 4 (G) | Gate input | Logic-compatible control node requiring <27 nC charge for full enhancement; isolated from drain by 20 Ω gate resistance |
| 5–8 (D) | Drain terminal | Exposed copper pad (pins 5–8) forms primary thermal and current path-must be soldered to ≥6 cm² PCB copper for rated 128 A operation |
| Internal body diode | Anti-parallel freewheeling path | Optimized for low Qrr (31 nC) and fast trr (15 ns); enables zero-voltage switching in resonant topologies |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche rated | Withstands single-pulse EAS = 171 mJ-eliminates need for external snubbers in inductive load switching |
| 175 °C junction rating | Enables operation in sealed enclosures or high-ambient environments without derating below 128 A |
| Logic-level gate drive | Turns fully on at VGS = 4.5 V-compatible with microcontroller GPIOs and low-voltage PWM controllers |
| Pb-free & halogen-free | Complies with RoHS and IEC61249-2-21-qualified for automotive and industrial end-equipment compliance |
| StrongIRFET™ 2 architecture | Reduces RDS(on) × Qg figure-of-merit by 35% vs. prior generation-improves efficiency in 300–1000 kHz SMPS |
Applications
| Server VRM Synchronous Rectifier | Industrial DC-DC Converter |
|---|---|
Use Scenario: High-current 48 V–12 V step-down conversion in AI accelerator racks with >600 A per rail. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in multiphase buck converter; switches at 600 kHz with dead-time control. Use Value: 2.8 mΩ RDS(on) and 27 nC Qg reduce conduction + switching losses by 22% vs. legacy 3.5 mΩ devices at 100 A. | Use Scenario: Isolated 400 V–24 V auxiliary supply in PLC backplanes with tight thermal constraints. IC Role / Device Role / Timing Role: Primary-side switch in active clamp forward topology; operates at 250 kHz with ZVS capability. Use Value: 175 °C rating and 1.8 °C/W RthJC allow full 128 A rating without forced air-enabling fanless industrial designs. |
| Automotive On-Board Charger | Telecom Power Supply |
Use Scenario: Bidirectional AC/DC stage in 11 kW OBC using dual-active-bridge topology. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in DAB transformer interface; handles 50–150 kHz variable frequency. Use Value: Fast 15 ns reverse recovery and low Qrr minimize body diode conduction loss during soft-switching transitions. | Use Scenario: 48 V intermediate bus converter feeding 12 V/54 A loads in 5G base station RF modules. IC Role / Device Role / Timing Role: High-side switch in interleaved buck controller; driven by dedicated gate driver IC. Use Value: 30 V VDS margin ensures reliability against 48 V bus transients up to 60 V; JEDEC-qualified for telecom lifecycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB028N03LGATMA1 | Same RDS(on) (2.8 mΩ), but TO-263 package; higher RthJC (2.2 °C/W); no top-side cooling | Better suited for through-hole assembly and legacy PCB layouts; lower current density due to larger footprint | Select when mechanical mounting requires screw terminals or thermal interface to heatsink via backside tab |
| IRLHS6342TRPBF | Higher RDS(on) (3.7 mΩ); lower Qg (16 nC); same TSDSON-8 package | Preferred in ultra-low-noise 50–150 kHz applications where switching loss dominates over conduction loss | Select when gate drive strength is limited or EMI filtering priority exceeds efficiency targets |
Compared with IPB028N03LGATMA1 and IRLHS6342TRPBF, ISZ028N03LF2SATMA1 delivers superior power density via its FL-packaged exposed drain, lowest RDS(on) × Qg FoM, and validated 175 °C operation-making it optimal for space-constrained, high-frequency, high-current DC-DC stages.
Availability
ISZ028N03LF2SATMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, and automotive on-board chargers requiring stable component supply across multi-year production cycles.
Supply support for ISZ028N03LF2SATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and qualification infrastructure.
This part belongs to the StrongIRFET™ 2 family-engineered specifically for high-efficiency, high-current, low-voltage power conversion in datacenter, industrial, and e-mobility applications.
FAQ
What is the maximum allowable case temperature for continuous 128 A operation?
The datasheet specifies 128 A continuous drain current at TC = 25 °C with a 40 mm × 40 mm × 1.5 mm FR4 PCB and 6 cm² copper area. At TC = 100 °C, derating reduces ID to 90 A. Full 128 A requires active cooling or ambient ≤40 °C with adequate copper thermal mass.
Does ISZ028N03LF2SATMA1 support gate drive from a 3.3 V microcontroller directly?
Yes-its VGS(th) range (1.35–2.35 V) and logic-level design ensure turn-on at 3.3 V. However, full RDS(on) optimization requires ≥4.5 V; for 2.8 mΩ performance, a 5 V gate driver or level shifter is recommended in high-current applications.
How is the "FL" suffix in PG-TSDSON-8 FL physically implemented?
The "FL" denotes "flat lead" construction: pins 5–8 form a single exposed copper drain pad on the bottom surface, while gate (pin 4) and source (pins 1–3) are accessible on the top side. This enables simultaneous top-side signal routing and bottom-side thermal coupling to PCB copper or heatsinks.
Is the body diode suitable for reverse conduction in bidirectional topologies?
Yes-the diode is 100% avalanche tested and characterized with trr = 15 ns and Qrr = 31 nC. It supports controlled reverse recovery in DAB and LLC resonant converters, but synchronous gate control is required to avoid hard commutation losses above 100 kHz.
ISZ028N03LF2SATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- StrongIRFET™ 2
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 22A (Ta), 128A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 2.8mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.35V @ 30µA
- Gate Charge (Qg) (Max) @ Vgs:
- 19 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1780 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3W (Ta), 83W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSDSON-8 FL
ISZ028N03LF2SATMA1 FAQ
1.How can I place an order for ISZ028N03LF2SATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for ISZ028N03LF2SATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISZ028N03LF2SATMA1 reliable?
The price and inventory of ISZ028N03LF2SATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISZ028N03LF2SATMA1 is usually 5 days.
3.What payment methods are accepted for ISZ028N03LF2SATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISZ028N03LF2SATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISZ028N03LF2SATMA1?
ISZ028N03LF2SATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISZ028N03LF2SATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISZ028N03LF2SATMA1?
For technical support, including ISZ028N03LF2SATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISZ028N03LF2SATMA1 requirements.
6.How does Aetrix verify that ISZ028N03LF2SATMA1 is sourced from the original manufacturer or authorized distributors?
All ISZ028N03LF2SATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISZ028N03LF2SATMA1 meets industry standards.
7.What is the process for return or replacement of ISZ028N03LF2SATMA1?
All ISZ028N03LF2SATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with ISZ028N03LF2SATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISZ028N03LF2SATMA1 part is unused and in its original packaging.
Return procedure for ISZ028N03LF2SATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ISZ028N03LF2SATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

