Microchip Technology JAN1N4148UBCA/TR

Overview

JAN1N4148UBCA/TR from Microsemi is a military-qualified surface-mount switching diode in the UB ceramic package with common-anode polarity, 75 V peak reverse voltage, 200 mA average forward current, and 5 ns reverse recovery time, used in high-frequency RS-232/RS-422 interface networks and Ethernet 10 Base-T data lines.

For engineers reviewing the JAN1N4148UBCA/TR datasheet, JAN1N4148UBCA/TR pinout, JAN1N4148UBCA/TR application, or JAN1N4148UBCA/TR equivalent, key selection criteria include MIL-PRF-19500/116 JAN-level qualification, ceramic UB package thermal performance (R_θJSP = 120 °C/W), low 4.0 pF capacitance at 0 V, and unidirectional/common-anode configuration compatibility with signal routing in space-constrained industrial comms designs.

Technical Context

This diode implements a silicon planar epitaxial structure optimized for fast transient response in signal routing paths. Its 5 ns reverse recovery time (I_F = I_R = 10 mA, R_L = 100 Ω) and 2.8 pF capacitance at 1.5 V enable reliable operation up to ~100 MHz in digital line conditioning.

The JAN-level qualification mandates full compliance with MIL-PRF-19500/116 screening including temperature cycling, hermeticity, and burn-in. The ceramic UB package features gold-plated terminals and metallized base/shield pads, supporting stable junction-to-solder-pad thermal resistance of 120 °C/W under PCB pad design per Figure 2.

Key Specifications

Pinout & Package

Package: Ceramic surface-mount UB package with gold-plated nickel-underplated terminals; common-anode configuration; weight < 0.04 g; compliant with EIA-418D tape-and-reel packaging.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar switching diode applications.

Compared with JAN1N4148UBCA/TR, the 1N4148W-7-F offers marginally faster switching but lacks military screening and ceramic hermeticity, while the JANTXV1N4148US delivers identical reliability but requires separate placement for dual-anode functionality-making JAN1N4148UBCA/TR optimal for space-constrained, dual-channel, mission-critical signal routing.

Availability

JAN1N4148UBCA/TR is available at Aetrix Electronics and suitable for RS-232 interface protection, Ethernet 10 Base-T line conditioning, and avionics data bus clamping requiring stable component supply across extended temperature and radiation environments.

Supply support for JAN1N4148UBCA/TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and mixed-signal ICs, RF solutions, and radiation-hardened components for aerospace, defense, and industrial markets.

The JAN1N4148UBCA/TR belongs to Microsemi's military-qualified discrete diode product line, engineered specifically for signal integrity preservation and transient resilience in harsh-environment digital communications infrastructure.

FAQ

What does the "CA" suffix mean in JAN1N4148UBCA/TR?

The "CA" suffix in JAN1N4148UBCA/TR denotes Common Anode polarity configuration. This means the device integrates two diode elements sharing a single anode node (Pads 1 and 2), with their cathodes independently accessible (Pad 3). It enables compact dual-rail clamping without external wiring, directly supporting RS-422 differential pair protection and bidirectional signal steering in the JAN1N4148UBCA/TR's ceramic UB package.

Is JAN1N4148UBCA/TR RoHS compliant?

Yes, JAN1N4148UBCA/TR is RoHS compliant by design, as confirmed in the official Microsemi datasheet T4-LDS-0281-2. The device uses lead-free gold-plated nickel terminations and ceramic body materials meeting EU Directive 2011/65/EU requirements. Compliance applies across all JAN-level screening grades and is verified per JEDEC J-STD-609A standard for marking and material declarations.

What is the thermal resistance from junction to solder pad for JAN1N4148UBCA/TR?

The thermal resistance from junction to solder pad (R_θJSP) for JAN1N4148UBCA/TR is 120 °C/W, measured under standard PCB mounting conditions per Figure 2 in the datasheet. This value reflects direct conduction from the die through the ceramic base (Pad 1) to a copper solder pad, enabling effective thermal management in high-density layouts where airflow is limited-critical for sustained operation in avionics and industrial control enclosures.

Can JAN1N4148UBCA/TR replace standard 1N4148 through-hole diodes in new designs?

JAN1N4148UBCA/TR is not a direct footprint replacement for axial DO-35 1N4148-1 due to its surface-mount ceramic UB package and common-anode dual-diode structure. While electrically compatible for clamping and switching roles, it requires PCB redesign to accommodate the 4-pad layout and leverages dual-anode functionality unavailable in single-diode variants-making JAN1N4148UBCA/TR ideal for upgrading signal integrity in new high-reliability designs rather than drop-in retrofits.

What is the maximum reverse recovery time specified for JAN1N4148UBCA/TR?

The maximum reverse recovery time (t_rr) for JAN1N4148UBCA/TR is 5 ns, tested under standardized conditions: I_F = I_R = 10 mA, R_L = 100 Ω, and 5% tolerance. This parameter is guaranteed across the full –65 to +200 °C junction temperature range and forms the basis for timing margin calculations in high-speed digital interfaces like RS-422 and Ethernet 10 Base-T where edge fidelity is critical to JAN1N4148UBCA/TR's system-level performance.