STMicroelectronics L6387ED013TR

Overview

L6387ED013TR from STMicroelectronics is a high-voltage half-bridge gate driver IC designed to control power MOSFETs and IGBTs in switching topologies. It integrates high-side (up to 600 V rail) and low-side drivers with 400 mA source / 650 mA sink capability, 50/30 ns rise/fall times into 1 nF load, and built-in interlocking logic to prevent shoot-through. It is used in motor drives for PMDC and PMAC motors, induction heating systems, and HVAC inverters.

For engineers reviewing the L6387ED013TR datasheet, L6387ED013TR pinout, L6387ED013TR application, or L6387ED013TR equivalent, key selection criteria include dV/dt immunity (±50 V/ns), bootstrap diode integration, UVLO thresholds (6.0 V turn-on), and SO-8 package thermal resistance (150 °C/W).

Technical Context

The L6387ED013TR implements independent CMOS/TTL-compatible Schmitt-trigger inputs with hysteresis and internal pull-down, enabling robust noise immunity across industrial temperature ranges. Its interlocking logic (Table 7) ensures HVG and LVG never simultaneously assert high, eliminating external dead-time circuitry.

The integrated bootstrap driver uses a patented high-voltage DMOS + series diode structure, replacing external fast-recovery diodes. It operates only when LVG is active and VOUT is near GND, with typical Rdson of 125 Ω - introducing a calculable voltage drop (e.g., ~0.8 V at 30 nC gate charge and 5 µs charging time) that impacts effective VBS margin.

Key Specifications

Pinout & Package

Available in SO-8 package (ECOPACK® compliant), 5.0 mm × 6.0 mm body, 1.27 mm pitch, with exposed pad for thermal enhancement (not electrically connected). Pin 1 marked by notch or dot.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage half-bridge gate driver applications.

Compared with IR2110STRPBF and UCC27324DR, the L6387ED013TR uniquely combines integrated bootstrap, interlock logic, and 600 V high-side capability in SO-8 - reducing component count and improving reliability in compact inverter modules where layout area and thermal management are constrained.

Availability

L6387ED013TR is available at Aetrix Electronics and suitable for motor drives, induction heating systems, and HVAC inverters requiring stable component supply across extended production lifecycles.

Supply support for L6387ED013TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, analog, microcontrollers, and automotive-grade ICs.

The L6387E belongs to ST's high-voltage gate driver product line, engineered for robustness in industrial motor control and resonant power conversion - emphasizing integration, noise immunity, and long-term manufacturability.

FAQ

What is the maximum allowable bootstrap capacitor discharge voltage drop for reliable L6387ED013TR operation?

The effective VBS must remain ≥8 V to sustain high-side drive. With typical VBOOT = 17 V and minimum VOUT = –3 V, the maximum allowable CBOOT voltage drop is ~9 V. However, design practice limits drop to ≤1.5 V to maintain margin against Rdson loss, temperature drift, and gate threshold variation - requiring CBOOT ≥ 10× CEXT (e.g., 100 nF for 3 nF MOSFET gate capacitance).

Can L6387ED013TR drive 1200 V SiC MOSFETs?

No. The L6387ED013TR is rated for 600 V high-side rail operation (VBOOT – VOUT ≤ 618 V). Driving 1200 V SiC devices would exceed absolute maximum ratings and risk catastrophic failure. For 1200 V systems, ST recommends the STGAP2SICSN or similar 1200 V-rated isolated gate drivers.

How does the interlocking function behave when both HIN and LIN are high?

Per Table 7 in the datasheet, when HIN = 1 and LIN = 1, both HVG and LVG are forced low - ensuring shoot-through prevention. This is hardwired logic, not software-configurable, and operates independently of propagation delays or temperature, making it fail-safe across all operating conditions.

Is the SO-8 package of L6387ED013TR lead-free and RoHS-compliant?

Yes. The L6387ED013TR in SO-8 packaging carries ST's ECOPACK®2 designation, confirming full compliance with RoHS Directive 2011/65/EU and halogen-free status per IEC 61249-2-21. The device uses matte tin (Sn) termination finish and meets JEDEC J-STD-020 moisture sensitivity level MSL3.