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STMicroelectronics L6390DTR

Part No.:
L6390DTR
Manufacturer:
STMicroelectronics
Category:
Gate Drivers
Package:
16-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixL6390DTR.pdf
Description:
IC GATE DRVR HALF-BRIDGE 16SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,349

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Product details

Overview

L6390DTR from STMicroelectronics is a high-voltage half-bridge gate driver IC for N-channel MOSFETs and IGBTs, featuring 600 V high-side rail capability, ±50 V/ns dV/dt immunity, 290 mA source / 430 mA sink output drive, 75/35 ns rise/fall times (1 nF load), and integrated bootstrap diode. It enables robust motor control in inverter stages for PMAC and sensorless BEMF systems.

For engineers reviewing the L6390DTR datasheet, L6390DTR pinout, L6390DTR application, or L6390DTR equivalent, key selection criteria include deadtime adjustability (0.1–3.4 µs), smart shutdown propagation delay (<250 ns), operational amplifier for current sensing (±6 mV offset), and comparator-based fault protection with open-drain SD/OD pin.

Technical Context

The L6390DTR integrates matched high-side and low-side drivers with interlocking logic and programmable deadtime to prevent cross-conduction in half-bridge topologies. Its floating high-side section operates up to 600 V with UVLO on both VCC and VBO rails, ensuring safe gate driving under brownout conditions.

It embeds a rail-to-rail op amp (8–12 MHz GBWP, 2.5–3.8 V/µs slew rate) for precision current sensing and a comparator with internal 540 mV reference for fast overcurrent detection. The smart shutdown architecture bypasses external RC timing, delivering sub-250 ns fault-to-output disable latency.

Key Specifications

Parameter Value and Actual Design Meaning
High-side voltage rating 600 V max - supports direct connection to 400 V DC bus with margin for transients
dV/dt immunity ±50 V/ns - prevents false triggering during fast switching in noisy industrial environments
Output drive strength 290 mA source / 430 mA sink - ensures fast MOSFET turn-on/turn-off with <100 ns propagation delays
Rise/fall time 75/35 ns @ 1 nF - enables reliable operation up to 800 kHz switching frequency
Logic input compatibility 3.3 V / 5 V TTL/CMOS with hysteresis - simplifies interface with microcontrollers and FPGAs
Deadtime range 0.1–3.4 µs adjustable via external resistor - allows precise tuning to match MOSFET gate charge and layout parasitics
Op amp input offset ±6 mV max - supports accurate shunt-based current measurement without calibration
Comparator response delay 90–130 ns - delivers rapid fault reaction before destructive current levels are reached

Pinout & Package

Package: SO-16 (Small Outline, 16-pin, surface-mount, 1.27 mm pitch). Thermal resistance Rth(JA) = 120 °C/W.

Pin/Terminal Circuit Role Design Meaning
1 LIN Low-side logic input Active-low signal controlling LVG output; hysteresis prevents noise-induced toggling
2 SD/OD Shutdown input / open-drain fault output Shared pin for active-low shutdown command and comparator fault reporting; internal pull-down eliminates external bleeder resistor
3 HIN High-side logic input Active-high signal controlling HVG output; matched delay with LIN ensures synchronous edge alignment
4 VCC Low-side supply 12.5–20 V input powering logic, op amp, and low-side driver; includes UVLO with 1.5 V hysteresis
5 DT Deadtime setting Analog input accepting resistor to ground; sets symmetric deadtime between HVG and LVG transitions
6 OP− Op amp inverting input Connects to shunt resistor low side for differential current sensing; referenced to GND
7 OPOUT Op amp output Drives ADC or external circuitry; rail-to-rail swing (0.07 V to VCC−4 V) enables full-scale signal capture
8 GND Power and signal ground Common reference for low-side section, op amp, and comparator; must be low-impedance for noise immunity
9 OP+ Op amp non-inverting input Connects to shunt resistor high side; common-mode range extends to VCC−4 V for wide dynamic range
10 CP+ Comparator input Accepts voltage from current-sense amplifier output; triggers shutdown when exceeding internal 540 mV reference
11 LVG Low-side gate driver output Drives N-MOSFET source-connected gate; 430 mA sink capability ensures fast turn-off
12,13 NC No connect Internally unconnected pins; must remain unpopulated and unconnected on PCB
14 OUT Floating high-side common Reference node for high-side section; connects to phase output of half-bridge (e.g., motor winding)
15 HVG High-side gate driver output Drives N-MOSFET drain-connected gate; operates with floating ground referenced to OUT
16 BOOT Bootstrap supply input Charged via integrated DMOS diode during LVG on-time; supplies high-side driver with VBOOT − VOUT up to 20 V

Key Features

Feature Design Value
Integrated bootstrap diode Replaces external fast-recovery diode, reducing leakage, board area, and BOM count by one component
Smart shutdown function Direct fault-to-output disable path cuts propagation delay to <250 ns-no dependency on external RC timing network
Matched HS/LS propagation delays ≤30 ns skew ensures zero cycle distortion at high frequencies, critical for field-oriented control stability
Dedicated op amp + comparator Enables single-chip current sensing and protection-no external amplifiers or comparators required
Interlocking + programmable deadtime Hardware-enforced shoot-through prevention plus fine-grained deadtime tuning avoids MOSFET overlap conduction
UVLO on both VCC and VBO rails Independent undervoltage lockout on low-side and bootstrap supplies prevents partial operation and device stress

Applications

Industrial Motor Drives Home Appliance Inverters

Use Scenario: Field-oriented control (FOC) of 3-phase PMSM motors in CNC spindles and servo drives.

IC Role / Device Role / Timing Role: Half-bridge gate driver providing synchronized, deadtime-controlled HVG/LVG signals to power stage; op amp feeds current feedback to MCU ADC.

Use Value: Matched propagation delays and <30 ns skew preserve PWM timing integrity across phases, enabling stable torque ripple <2% at 20 kHz switching.

Use Scenario: Variable-speed compressor control in inverter air conditioners using sensorless BEMF detection.

IC Role / Device Role / Timing Role: Gate driver with integrated op amp conditioning BEMF zero-crossing signals; comparator monitors overcurrent during startup surge.

Use Value: On-chip op amp (8–12 MHz GBWP) resolves BEMF edges within 100 ns, supporting reliable commutation at <100 RPM.

HVAC Blower Systems Induction Heating Power Stages

Use Scenario: High-efficiency centrifugal blower control in commercial HVAC units with 400 V DC link.

IC Role / Device Role / Timing Role: High-side capable driver (600 V) directly interfacing IGBTs; smart shutdown responds to overtemperature faults in real time.

Use Value: ±50 V/ns dV/dt immunity maintains reliable operation despite EMI from adjacent rectifier and transformer circuits.

Use Scenario: Resonant LLC half-bridge in induction cooktops operating at 20–100 kHz with 500 V peak bus voltage.

IC Role / Device Role / Timing Role: Fast-switching gate driver (75/35 ns) minimizing switching losses; adjustable deadtime optimizes ZVS window across load range.

Use Value: 0.1–3.4 µs deadtime range allows precise tuning to maintain zero-voltage switching from 10% to 100% power output.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage half-bridge gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
IR2110STRPBF No integrated op amp or comparator; external bootstrap diode required; 500 V max high-side rating Lacks embedded current sensing and smart shutdown-requires additional ICs for protection and feedback Select when cost sensitivity outweighs integration benefits and system already includes discrete sensing/protection circuitry
UCC27211D 600 V rating but no bootstrap diode or op amp; dual-input with independent enable; 4 A peak drive Higher drive strength suits GaN FETs, but lacks analog functions-needs external current sense amplifier Prefer for high-frequency GaN designs where raw drive performance > integrated analog features

Compared with IR2110STRPBF and UCC27211D, the L6390DTR uniquely combines 600 V capability, integrated bootstrap diode, op amp, and comparator in SO-16-reducing total component count by ≥4 while enabling single-chip current sensing and fault response under 250 ns.

Availability

L6390DTR is available at Aetrix Electronics and suitable for industrial motor drives, HVAC blower systems, and induction heating power stages requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for L6390DTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, microcontroller, and sensor solutions for industrial, automotive, and consumer markets.

The L6390DTR belongs to ST's high-voltage gate driver product line, engineered specifically for robust, integrated half-bridge control in motor inverters and resonant power converters demanding reliability, compactness, and analog integration.

FAQ

What is the maximum recommended switching frequency for the L6390DTR?

The L6390DTR supports up to 800 kHz switching frequency with a 1 nF capacitive load, as confirmed in Section 3.3 of the datasheet (DocID14493 Rev 11). This limit assumes proper thermal management (SO-16 Rth(JA) = 120 °C/W) and stable bootstrap capacitor charging during each low-side conduction period.

Does the L6390DTR require an external bootstrap diode?

No. The L6390DTR integrates a patented high-voltage DMOS-based bootstrap driver that replaces the external fast-recovery diode. As described in Section 9 of the datasheet, this structure reduces leakage, saves PCB area, and eliminates one BOM item while maintaining reliable high-side supply under all operating conditions.

How does the smart shutdown function differ from conventional shutdown inputs?

Unlike standard shutdown inputs that rely on external RC networks for timing, the L6390DTR's smart shutdown uses a dedicated internal path from comparator output directly to driver outputs-achieving <250 ns fault-to-disable latency. This bypasses external timing components and ensures immediate protection regardless of RC values, as detailed in Section 7 of the datasheet.

Can the op amp in the L6390DTR be used for voltage sensing instead of current sensing?

Yes-the op amp supports differential input (OP+ and OP−) with common-mode range from 0 V to VCC−4 V, making it suitable for isolated DC-link voltage monitoring when paired with appropriate resistive dividers. However, its primary design intent and characterization (Table 7) focus on current-sense applications with shunt resistors.

L6390DTR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
16-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
IGBT, N-Channel MOSFET
Voltage - Supply:
12.5V ~ 20V
Logic Voltage - VIL, VIH:
1.1V, 1.9V
Current - Peak Output (Source, Sink):
290mA, 430mA
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
600 V
Rise / Fall Time (Typ):
75ns, 35ns
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SO

L6390DTR FAQ

1.How can I place an order for L6390DTR through Aetrix?

Please submit a Request for Quotation (RFQ) for L6390DTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for L6390DTR reliable?

The price and inventory of L6390DTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L6390DTR is usually 5 days.

3.What payment methods are accepted for L6390DTR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L6390DTR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for L6390DTR?

L6390DTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your L6390DTR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for L6390DTR?

For technical support, including L6390DTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L6390DTR requirements.

6.How does Aetrix verify that L6390DTR is sourced from the original manufacturer or authorized distributors?

All L6390DTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L6390DTR meets industry standards.

7.What is the process for return or replacement of L6390DTR?

All L6390DTR units undergo pre-shipment inspection (PSI). If there is an issue with L6390DTR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The L6390DTR part is unused and in its original packaging.

Return procedure for L6390DTR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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