STMicroelectronics L6399D
- Part No.:
- L6399D
- Manufacturer:
- STMicroelectronics
- Category:
- Gate Drivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
L6399D.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:1,784
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
L6399D from STMicroelectronics is a high-voltage half-bridge gate driver IC for N-channel MOSFETs and IGBTs, featuring integrated bootstrap diode, 600 V high-side rail capability, ±50 V/ns dV/dt immunity, and internal 320 ns deadtime. It delivers 290 mA source / 430 mA sink drive current with 75/35 ns rise/fall times (1 nF load), and supports 3.3 V/5 V TTL/CMOS logic inputs - used in motor control stages of HVAC compressors and industrial AC drives.
For engineers reviewing the L6399D datasheet, L6399D pinout, L6399D application, or L6399D equivalent, key selection criteria include bootstrap diode integration, interlocking logic behavior, dV/dt noise immunity at full temperature range, and SO-8 package compatibility with high-voltage floating output routing.
Technical Context
The L6399D implements dual-channel complementary logic with hardware interlocking to prevent shoot-through: simultaneous HIN/LIN high states force both outputs low, and a fixed 225–415 ns deadtime enforces minimum off-time before opposite channel activation. Its high-side section uses a floating structure referenced to OUT, sustaining up to 600 V rail voltage while maintaining logic-level input compatibility down to 3.3 V.
Bootstrap charging is managed via an integrated DMOS-based diode (RDS(on) = 120 Ω typ.) synchronized with LVG, eliminating external fast-recovery diodes. UVLO thresholds are independently set for VCC (9.5 V turn-on, 8.0 V turn-off) and VBO (9.0 V turn-on, 8.0 V turn-off), each with hysteresis to suppress noise-induced toggling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| High-side voltage rating | 600 V max - enables direct interface with 400 V DC bus systems without level-shifting. |
| dV/dt immunity | ±50 V/ns - prevents false triggering during fast switching transients in noisy industrial environments. |
| Output drive strength | 290 mA source / 430 mA sink - ensures fast MOSFET turn-on/turn-off with ≤1 nF gate load. |
| Propagation delay | 50–200 ns (typ. 125 ns) - supports precise timing control in high-frequency motor PWM up to 800 kHz. |
| Deadtime | 225–415 ns (typ. 320 ns) - hardwired safety margin preventing cross-conduction in half-bridge topologies. |
| Logic input voltage | 3.3 V/5 V TTL/CMOS compatible - allows direct connection to microcontrollers and DSPs without level translators. |
| Bootstrap diode | Integrated DMOS + series diode - removes need for external HV diode, reducing BOM count and leakage risk. |
Pinout & Package
Package: SO-8 (ECOPACK® compliant), surface-mount, 150 °C/W junction-to-ambient thermal resistance. Pin 1–4 on left side (LIN, HIN, VCC, GND), pins 5–8 on right (LVG, OUT, HVG, BOOT).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 LIN | Low-side logic input | Active-high CMOS/TTL signal controlling LVG output; includes 150–1500 kΩ internal pull-down. |
| 2 HIN | High-side logic input | Active-high CMOS/TTL signal controlling HVG output; includes 57–137 kΩ internal pull-down. |
| 3 VCC | Low-side supply | 10–20 V power for logic and low-side driver; UVLO threshold 9.5 V with 1.5 V hysteresis. |
| 4 GND | Power ground | Reference for VCC, LIN, HIN, and LVG; must be low-inductance connection to minimize noise coupling. |
| 5 LVG | Low-side gate driver output | Drives N-MOSFET source-connected to GND; capable of 430 mA sink for fast turn-off. |
| 6 OUT | Floating common node | Connects to source of high-side MOSFET; defines reference for HVG and BOOT voltage swing. |
| 7 HVG | High-side gate driver output | Drives N-MOSFET gate referenced to OUT; withstands 600 V differential vs. GND. |
| 8 BOOT | Bootstrap supply input | Charged via internal DMOS diode when LVG is active; supplies floating high-side driver stage. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware interlocking logic | Prevents simultaneous HVG/LVG activation even if both HIN and LIN are high - eliminates software dependency for shoot-through protection. |
| Integrated bootstrap diode | Replaces discrete 600 V fast-recovery diode, reducing board area, leakage current, and component count by one. |
| Independent UVLO monitoring | Dual undervoltage lockout (VCC and VBO) with separate thresholds and hysteresis ensures safe operation under brownout conditions. |
| High dV/dt noise immunity | ±50 V/ns tolerance across -40 °C to +125 °C - maintains reliable operation in EMI-heavy motor drive environments. |
| Compact SO-8 layout | Enables dense half-bridge driver placement near power switches, minimizing parasitic inductance in gate loops. |
Applications
| Compressor Motor Control | HVAC Fan Driver |
|---|---|
|
Use Scenario: Variable-speed compressor in residential air conditioning units using PMSM motors with 400 V DC bus. IC Role / Device Role / Timing Role: Half-bridge gate driver providing synchronized, interlocked HVG/LVG signals to upper/lower IGBTs in inverter leg. Use Value: Integrated deadtime and dV/dt immunity prevent shoot-through during rapid bus voltage transitions caused by refrigerant load changes. |
Use Scenario: Brushless DC fan module in commercial HVAC rooftop units requiring silent, efficient airflow modulation. IC Role / Device Role / Timing Role: Gate driver enabling 20–80 kHz PWM control of N-channel MOSFET half-bridge with minimal gate loop inductance. Use Value: 3.3 V logic compatibility allows direct interface with HVAC controller MCU, eliminating level-shifter components. |
| Industrial AC Drive Inverter | Home Appliance Motor Module |
|
Use Scenario: 0.75 kW vector-controlled AC induction motor drive in packaging machinery with regenerative braking. IC Role / Device Role / Timing Role: High-side capable driver managing floating gate bias for 600 V IGBTs in three-phase inverter half-bridges. Use Value: 600 V rail rating supports direct use with 400–450 V DC link without derating or auxiliary clamping circuits. |
Use Scenario: Washing machine drum motor control using sensorless FOC algorithm with 24 V–48 V DC bus. IC Role / Device Role / Timing Role: Compact SO-8 gate driver delivering precise timing and bootstrap charging for cost-sensitive appliance inverters. Use Value: Bill-of-material reduction via integrated bootstrap diode lowers total system cost and improves long-term reliability over discrete solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage half-bridge gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR2104S | No integrated bootstrap diode; requires external HV diode; lower dV/dt immunity (±50 V/ns not guaranteed over full temp range). | Suitable for lower-cost, non-critical 200–400 V applications where board space and leakage are less constrained. | Select when BOM cost is prioritized over layout simplicity and robustness in noisy environments. |
| UCC27201A | Higher drive current (4 A source/sink), but no internal deadtime or interlock; requires external logic for shoot-through prevention. | Better suited for high-power, high-frequency resonant converters where timing flexibility outweighs safety integration. | Choose only when design team implements custom deadtime generation and can validate interlock behavior across all operating conditions. |
Compared with IR2104S and UCC27201A, the L6399D provides unique value through its combination of integrated bootstrap diode, guaranteed dV/dt immunity over full temperature range, and hardware-enforced interlocking - reducing validation effort and improving field reliability in cost-sensitive motor control systems.
Availability
L6399D is available at Aetrix Electronics and suitable for HVAC compressor control, industrial AC drive inverters, and home appliance motor modules requiring stable component supply and long-lifecycle support.
Supply support for L6399D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, analog, MEMS, and microcontroller technologies for industrial, automotive, and consumer markets.
The L6399D belongs to ST's high-voltage gate driver product line, designed specifically for robust, compact, and cost-effective motor control in appliances and factory automation systems using N-channel power switches.
FAQ
What is the maximum allowable bootstrap capacitor (CBOOT) voltage drop during operation?
The L6399D's internal bootstrap diode introduces a voltage drop proportional to gate charge and charging time (Vdrop ≈ Qgate × RDS(on) / Tcharge). With typical RDS(on) = 120 Ω, a 30 nC MOSFET gate charge, and 5 µs charging window, drop is ~0.72 V. Designers must ensure remaining BOOT voltage exceeds 8.0 V (VBO UVLO threshold) after this drop to maintain high-side operation.
Can L6399D drive IGBTs with gate-emitter threshold voltages above 5 V?
Yes - the L6399D delivers 15 V gate drive (VCC = 15 V) with 430 mA sink capability, sufficient to rapidly discharge IGBT gates with VGE(th) up to 6 V. Its 75 ns rise time into 1 nF load ensures fast turn-on, and the 320 ns deadtime prevents overlap during commutation, critical for IGBT-based inverters operating at ≤800 kHz.
How does the interlocking function behave when both HIN and LIN are held high?
Per the truth table in the datasheet, simultaneous high states on HIN and LIN force both LVG and HVG outputs low - a hardware-level interlock independent of timing or software. This state persists until one input falls low, after which the corresponding output activates only after the internal deadtime expires, ensuring no shoot-through under fault or misconfigured logic conditions.
Is external bootstrap diode replacement ever necessary with L6399D?
Yes - when CBOOT charging time is insufficient (e.g., very low duty cycle or high-frequency operation where LVG on-time is too short), or when VOUT remains elevated for extended periods (e.g., synchronous rectification topologies). In such cases, an external 600 V fast-recovery diode (e.g., STTH1R06) may be added in parallel with the internal path to ensure reliable BOOT voltage replenishment.
L6399D Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- Half-Bridge
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- IGBT, N-Channel MOSFET
- Voltage - Supply:
- 10V ~ 20V
- Logic Voltage - VIL, VIH:
- 1.1V, 1.9V
- Current - Peak Output (Source, Sink):
- 290mA, 430mA
- Input Type:
- Inverting, Non-Inverting
- High Side Voltage - Max (Bootstrap):
- 600 V
- Rise / Fall Time (Typ):
- 75ns, 35ns
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
L6399D FAQ
1.How can I place an order for L6399D through Aetrix?
Please submit a Request for Quotation (RFQ) for L6399D on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for L6399D reliable?
The price and inventory of L6399D are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L6399D is usually 5 days.
3.What payment methods are accepted for L6399D?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L6399D transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for L6399D?
L6399D orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your L6399D order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for L6399D?
For technical support, including L6399D datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L6399D requirements.
6.How does Aetrix verify that L6399D is sourced from the original manufacturer or authorized distributors?
All L6399D products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L6399D meets industry standards.
7.What is the process for return or replacement of L6399D?
All L6399D units undergo pre-shipment inspection (PSI). If there is an issue with L6399D, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The L6399D part is unused and in its original packaging.
Return procedure for L6399D:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
L6399D Tags

-
ZXGD3009E6TA
Diodes Incorporated

-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments

-
MCP1416T-E/OT
Microchip Technology

-
MCP1402T-E/OT
Microchip Technology

-
MCP1415T-E/OT
Microchip Technology

-
MCP1401T-E/OT
Microchip Technology

-
IX4428NTR
Littelfuse Inc.

-
IRS2005STRPBF
Infineon Technologies

-
IRS2008STRPBF
Infineon Technologies

-
IX4310TTR
Littelfuse Inc.

-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

