STMicroelectronics L6747C
- Part No.:
- L6747C
- Manufacturer:
- STMicroelectronics
- Category:
- Gate Drivers
- Package:
- 8-VDFN Exposed Pad
- Datasheet:
-
L6747C.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 8VFDFPN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
L6747C from STMicroelectronics is a dual high-current N-channel MOSFET driver for synchronous buck converters, featuring adaptive dead-time control, 5–12 V flexible gate-drive voltage, preliminary overvoltage (OV) protection triggered at ~1.8 V on PHASE, and HiZ management via EN/PWM inputs. It drives both high-side and low-side MOSFETs in CPU VRM/VRD and high-efficiency DC-DC applications up to high switching frequencies.
For engineers reviewing the L6747C datasheet, L6747C pinout, L6747C application, or L6747C equivalent, key selection criteria include its 3.5 A peak source/sink capability per channel, VFDFPN8 3×3 mm thermal performance (RTHJC = 5 °C/W), anti-shoot-through logic, and boot-capacitor–dependent high-side drive architecture - all critical for stable high-current VRM design.
Technical Context
The L6747C implements independent high-side (BOOT/PHASE-referenced) and low-side (VCC/GND-referenced) drivers with integrated anti-shoot-through logic and adaptive dead-time adjustment based on PHASE voltage transitions. Its propagation delays are tightly specified (tprop_H = 30–45 ns, tprop_L = 25–35 ns) to support high-frequency operation above 1 MHz.
HiZ state is entered either by pulling EN low or by holding PWM within 1.3–1.6 V for >120 ns; during HiZ, preliminary OV protection monitors PHASE and latches LGATE ON if voltage exceeds ~1.8 V - a hardware-level safeguard active before controller initialization. UVLO thresholds (VCC turn-on = 4.1 V, turn-off = 3.5 V) ensure safe power-up sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply range | 5 V to 12 V on VCC; enables optimization of LS gate drive and compatibility with common VRM bias rails. |
| Peak output current | 3.5 A source/sink per channel; ensures fast switching of high-QG MOSFETs in high-current (>100 A) CPU VRMs. |
| Adaptive dead-time | Automatically adjusts timing between HS/LS turn-off/on based on PHASE voltage slew rate; minimizes LS body diode conduction loss. |
| Preliminary OV threshold | 1.7–1.8 V on PHASE pin; triggers immediate LGATE latch-on during HiZ to protect load from high-side MOSFET failure at startup. |
| Propagation delay | 25–45 ns (typ.); supports stable operation up to ≥2 MHz switching frequency with tight timing margin control. |
| Thermal resistance | RTHJC = 5 °C/W; enables efficient heat transfer from die to PCB thermal pad in VFDFPN8 package. |
| HiZ hold-off time | 120 ns minimum PWM dwell in 1.3–1.6 V window; prevents false HiZ entry from noise while enabling precise power-state coordination. |
Pinout & Package
Package: VFDFPN8 (Very thin Fine-pitch Dual Flat Package No-lead), 3 mm × 3 mm, 0.5 mm pitch, exposed thermal pad (TH.PAD) for enhanced thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 BOOT | High-side floating supply rail | Provides gate drive voltage for UGATE; requires external bootstrap capacitor (e.g., 220 nF) tied to PHASE to sustain HS conduction. |
| 2 PWM | Control input signal | 5 V–compatible logic input (clamped to 3.3 V internally); defines HS/LS switching states and enters HiZ when held 1.3–1.6 V ≥120 ns. |
| 3 EN | Enable/disable control | Pull low to force immediate HiZ (all MOSFETs OFF), overriding PWM; essential for system-level power sequencing and fault shutdown. |
| 4 VCC | Low-side and logic supply | Supplies LS driver and internal circuitry; bypass with low-ESR MLCC (≥1 µF) to GND for stable operation across 5–12 V range. |
| 5 LGATE | Low-side gate driver output | Direct drive output for N-channel MOSFET gate; capable of 3.5 A sink/source; series resistor optional for EMI/ringing control. |
| 6 GND | Reference ground | Common reference for logic, LS driver, and internal protections; must connect to solid PCB ground plane with low-inductance path. |
| 7 PHASE | HS source return & sensing node | Return path for HS driver; monitored for adaptive dead-time and preliminary OV detection; connects to HS MOSFET source. |
| 8 UGATE | High-side gate driver output | Drives HS MOSFET gate referenced to PHASE; requires careful layout to minimize boot loop inductance and ringing. |
Key Features
| Feature | Design Value |
|---|---|
| Flexible gate-drive voltage | 5–12 V VCC range allows tuning LS gate voltage for RDS(on) vs. switching loss trade-off in multi-phase VRMs. |
| Adaptive dead-time management | Dynamically shortens LS turn-on delay after HS turn-off based on PHASE dv/dt, reducing body diode conduction without fixed timing margins. |
| Preliminary OV protection | Hardware-level latch-on of LGATE when PHASE >1.8 V during HiZ; protects CPU load from catastrophic overvoltage due to HS short at startup. |
| HiZ management | Dual-entry HiZ (EN low or PWM in 1.3–1.6 V window) enables coordinated power-state transitions and pre-bias startup handling. |
| High-current drive capability | 3.5 A peak per channel with <2 Ω typical RDS(on) ensures <10 ns rise/fall times into 3.3 nF HS / 5.6 nF LS gate loads. |
Applications
| Desktop CPU VRM | Server VRD Power Stage |
|---|---|
|
Use Scenario: High-current (≥150 A), multi-phase buck converter supplying modern x86 CPUs with dynamic voltage scaling. IC Role / Device Role / Timing Role: Dual gate driver coordinating HS/LS MOSFET switching per phase; provides adaptive dead-time and shoot-through prevention under rapid load transients. Use Value: Enables elimination of Schottky catch diodes and reduces conduction losses by minimizing LS body diode conduction time during light-load conditions. |
Use Scenario: 3+ phase VRD module delivering >200 A at ≤1.2 V to enterprise server processors with strict efficiency and thermal requirements. IC Role / Device Role / Timing Role: High-current gate driver with robust thermal pad (VFDFPN8) and 5–12 V VCC flexibility to match optimized gate-drive voltages across phases. Use Value: Supports high-frequency operation (>1 MHz) while maintaining <45 ns total propagation delay, improving transient response and reducing output capacitance needs. |
| Workstation GPU Power Delivery | High-Efficiency Point-of-Load DC-DC |
|
Use Scenario: Compact, high-density buck converter powering discrete GPUs with aggressive thermal constraints and burst-mode operation. IC Role / Device Role / Timing Role: Dual driver with HiZ management enabling seamless transition between active, sleep, and deep-sleep power states without controller intervention. Use Value: Prevents negative undershoot during shutdown via controlled HiZ entry and maintains safe output regulation during pre-bias startup sequences. |
Use Scenario: Industrial or telecom POL converter requiring >90% efficiency at 12–48 V input, 3.3–5 V output, and 10–30 A load. IC Role / Device Role / Timing Role: Synchronous rectifier driver with preliminary OV protection activated during controller initialization to guard against input surge or MOSFET failure. Use Value: Provides hardware-level safety independent of upstream PWM controller, ensuring load protection even before controller firmware boots. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual high-current MOSFET driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR2110PbF | Higher VBS rating (600 V), but only 2 A peak drive; requires external bootstrap diode; no adaptive dead-time or preliminary OV. | Targeted at half-bridge motor drives and isolated DC-DC, not optimized for sub-2 V CPU VRM timing margins. | Select for high-voltage industrial half-bridges where isolation and voltage rating outweigh VRM-specific features. |
| LM5113MMX/NOPB | 3 A peak drive, 5–14 V supply, no integrated OV protection; uses separate HO/LO enable pins instead of EN+PWM HiZ scheme. | Designed for wide-input POL converters with programmable dead-time, lacking hardware-based startup OV latch. | Prefer for non-CPU applications needing adjustable dead-time and wider input voltage range, accepting software-managed protection. |
Compared with IR2110PbF and LM5113MMX/NOPB, the L6747C uniquely integrates adaptive dead-time, preliminary OV latching, and dual-path HiZ entry - making it purpose-built for high-reliability, high-current CPU VRM systems where startup safety and timing precision are non-negotiable.
Availability
L6747C is available at Aetrix Electronics and suitable for desktop CPU VRM, server VRD power stages, and high-efficiency point-of-load DC-DC converters requiring stable component supply, long-term lifecycle continuity, and traceable sourcing.
Supply support for L6747C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in power management, analog, microcontrollers, and automotive ICs with strong European manufacturing and R&D infrastructure.
The L6747C belongs to ST's high-performance power driver product line, engineered specifically for synchronous buck topologies in computing power delivery - emphasizing reliability, thermal efficiency, and hardware-level fault protection for mission-critical CPU/GPU supplies.
FAQ
What is the function of the PHASE pin beyond being the high-side return path?
The PHASE pin serves three critical roles: (1) return path for the high-side driver, (2) input for adaptive dead-time control by sensing voltage slew rate during HS turn-off, and (3) sensing node for preliminary OV protection - triggering LGATE latch-on if voltage exceeds 1.7–1.8 V during HiZ. It is not a passive node; internal clamp circuitry prevents leakage during disable states.
Can the L6747C operate with a 5 V-only supply, and what impact does that have on performance?
Yes, the L6747C operates with VCC = 5 V (minimum UVLO turn-on is 4.1 V). At 5 V, LS drive strength remains full (3.5 A), but HS gate voltage (BOOT–PHASE) is limited to ~5 V, increasing RDS(on) losses in high-current HS MOSFETs. For optimal efficiency in >100 A VRMs, 12 V VCC is recommended to maximize HS gate overdrive and reduce conduction loss.
How does the HiZ window (1.3–1.6 V on PWM) interact with standard 3.3 V or 5 V logic signals?
The HiZ window is intentionally narrow and centered below standard logic-high thresholds (VPWM_IH = 2 V min). It is not intended for general logic signaling but for dedicated HiZ coordination - e.g., a controller can pull PWM to 1.45 V using a resistor divider during soft shutdown. External noise filtering is required, as the 300 mV window demands clean, slew-controlled transitions to avoid spurious HiZ entry.
Is an external bootstrap diode required, and why does the datasheet omit it?
No external bootstrap diode is required: the L6747C integrates a charge-transfer diode between VCC and BOOT. This internal diode enables automatic bootstrap capacitor charging during LS conduction. The omission reflects integration - unlike legacy drivers (e.g., IR2110), the L6747C eliminates this discrete component, reducing BOM count and layout complexity while maintaining reliable high-side drive.
L6747C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-VDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Driven Configuration:
- Half-Bridge
- Channel Type:
- Synchronous
- Number of Drivers:
- 2
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 5V ~ 12V
- Logic Voltage - VIL, VIH:
- 0.8V, 2V
- Current - Peak Output (Source, Sink):
- 3.5A, -
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- 41 V
- Rise / Fall Time (Typ):
- -
- Operating Temperature:
- 0°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VFDFPN (3x3)
L6747C FAQ
1.How can I place an order for L6747C through Aetrix?
Please submit a Request for Quotation (RFQ) for L6747C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for L6747C reliable?
The price and inventory of L6747C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L6747C is usually 5 days.
3.What payment methods are accepted for L6747C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L6747C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for L6747C?
L6747C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your L6747C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for L6747C?
For technical support, including L6747C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L6747C requirements.
6.How does Aetrix verify that L6747C is sourced from the original manufacturer or authorized distributors?
All L6747C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L6747C meets industry standards.
7.What is the process for return or replacement of L6747C?
All L6747C units undergo pre-shipment inspection (PSI). If there is an issue with L6747C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The L6747C part is unused and in its original packaging.
Return procedure for L6747C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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