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STMicroelectronics L6747CTR

Part No.:
L6747CTR
Manufacturer:
STMicroelectronics
Category:
Gate Drivers
Package:
8-VDFN Exposed Pad
Datasheet:
AetrixL6747CTR.pdf
Description:
IC GATE DRVR HALF-BRIDGE 8VFDFPN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:846

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Product details

Overview

L6747CTR from STMicroelectronics is a dual high-current N-channel MOSFET driver for synchronous buck converters, featuring adaptive dead-time control, 5–12 V flexible gate-drive supply, preliminary overvoltage (OV) protection triggered at 1.8 V on PHASE, and HiZ shutdown via EN or PWM window detection. It drives high-side and low-side MOSFETs in CPU VRM/VRD and high-efficiency DC-DC applications up to multi-MHz switching frequencies.

For engineers reviewing the L6747CTR datasheet, L6747CTR pinout, L6747CTR application, or L6747CTR equivalent, key selection criteria include boot-capacitor design guidance, PHASE-pin-based OV threshold accuracy, propagation delay matching (25–45 ns), thermal resistance (RTHJC = 5 °C/W), and VFDFPN8 3×3 mm package layout constraints for high-current power stages.

Technical Context

The L6747CTR implements independent high-side (BOOT/PHASE-referenced) and low-side (VCC/GND-referenced) drivers with anti-shoot-through logic and adaptive dead-time adjustment based on PHASE voltage slew rate. Its HiZ management responds to either EN pin deassertion or PWM input held between 1.3 V–1.6 V for >120 ns.

Preliminary OV protection activates only after VCC exceeds UVLO (4.1 V) and while in HiZ state, latching LGATE ON if PHASE rises above 1.8 V - a hardware-level safeguard against high-side MOSFET failure during startup, independent of external PWM controller behavior.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 5 V to 12 V: Enables optimization of gate-drive voltage for efficiency across varied input bus voltages.
UGATE Source Current 3.5 A typ. @ BOOT–PHASE = 12 V: Supports fast turn-on of high-QG N-channel MOSFETs in high-frequency VRMs.
LGATE Source Current 3.5 A typ. @ CLGATE = 5.6 nF: Delivers robust low-side drive for synchronous rectification without external buffers.
Propagation Delay 25–45 ns: Tight timing control ensures precise dead-time management and minimizes body-diode conduction loss.
Pre-OV Threshold 1.7–1.8 V on PHASE pin: Hardware-triggered protection engages before CPU-safe voltage limits are exceeded.
RTHJC 5 °C/W: Low junction-to-case thermal resistance enables effective heat transfer to PCB thermal pad under 2.25 W max dissipation.
HiZ Hold-off Time 120 ns minimum: Prevents false HiZ entry from noise while allowing rapid system-level power-state transitions.

Pinout & Package

VFDFPN8 3×3 mm package with exposed thermal pad (TH.PAD) for direct connection to PGND plane; 0.5 mm pitch, 8-terminal leadless construction compliant with ECOPACK® environmental standards.

Pin/Terminal Circuit Role Design Meaning
1 BOOT High-side floating supply rail Connects via RBOOT–CBOOT network to PHASE; supplies high-side driver during HS conduction.
2 PWM Control input signal 5 V-compatible logic input; defines HS/LS switching states and triggers HiZ when held in 1.3–1.6 V window.
3 EN Enable/disable control Pull low to force all outputs OFF regardless of PWM; overrides all internal logic for hard shutdown.
4 VCC Low-side and logic supply 5–12 V input powering LS driver, logic, and internal bias; requires local MLCC bypass to GND.
5 LGATE Low-side gate driver output Direct connection to LS MOSFET gate; supports series resistor for EMI/slew control in high-freq designs.
6 GND Reference ground Common return for logic, LS driver, and internal circuitry; must connect to solid PCB ground plane.
7 PHASE HS source / sensing node Return path for HS driver; monitored for adaptive dead-time and pre-OV protection; connects to HS MOSFET source.
8 UGATE High-side gate driver output Drives HS MOSFET gate; requires minimal trace inductance to suppress ringing during fast transitions.

Key Features

Feature Design Value
Adaptive dead-time management Adjusts LS turn-on timing based on PHASE voltage fall rate, minimizing body-diode conduction without fixed delays.
Preliminary OV protection Hardware latch on LGATE activated by PHASE > 1.8 V during HiZ, protecting load before external controller detects fault.
Flexible gate-drive voltage Independent 5–12 V range for VCC and BOOT supplies allows tuning of LS/HS drive strength per MOSFET RDS(on).
HiZ management Dual-path shutdown: EN pin assertion or PWM window detection (1.3–1.6 V) both force full output disable with <120 ns latency.
Thermal performance 5 °C/W RTHJC + exposed TH.PAD enables >2 W continuous operation with proper PCB copper area and via count.

Applications

Desktop CPU VRM Server VRD Power Stage

Use Scenario: High-current, multi-phase buck converter supplying modern x86 CPUs with dynamic current demands up to 200 A.

IC Role / Device Role / Timing Role: Dual gate driver controlling parallel N-channel HS/LS MOSFETs per phase; provides adaptive dead-time to reduce conduction loss during light-load discontinuous conduction mode.

Use Value: Enables elimination of Schottky diodes and reduces total power loss by minimizing LS body-diode conduction time across load transients.

Use Scenario: 12 V input, 0.8–1.8 V output VRD module for dual-socket server motherboards with strict ripple and transient response requirements.

IC Role / Device Role / Timing Role: Synchronous rectifier driver synchronized to ST's multi-phase PWM controllers; supports >1 MHz switching with sub-50 ns propagation matching.

Use Value: Delivers stable regulation under rapid load steps (e.g., 50 A/μs) by maintaining precise timing alignment between phases and minimizing shoot-through risk.

Workstation GPU Power Delivery Industrial High-Efficiency DC-DC

Use Scenario: Compact, thermally constrained power stage for high-performance GPUs requiring >150 A at sub-1 V with tight thermal budget.

IC Role / Device Role / Timing Role: HS/LS driver with integrated HiZ control enabling coordinated power-rail sequencing and safe pre-bias startup.

Use Value: Prevents negative undershoot during shutdown via hardware-enforced HiZ, protecting sensitive GPU core logic from reverse current injection.

Use Scenario: Isolated or non-isolated 48 V–12 V intermediate bus converter in industrial automation systems requiring >95% peak efficiency.

IC Role / Device Role / Timing Role: Gate driver supporting discrete N-channel MOSFETs optimized for low QG/RDS(on); leverages 5–12 V VCC flexibility to match MOSFET gate thresholds.

Use Value: Reduces gate-drive losses by 30% vs. fixed 12 V drivers through optimized VGS, improving full-load efficiency without compromising switching speed.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
IR2110PbF Higher VBS rating (600 V), bootstrap-dependent only, no adaptive dead-time or pre-OV protection. Targeted at half-bridge motor drives and AC inverters, not CPU VRMs; lacks HiZ management and PHASE-sensing features. Select when high-voltage isolation and ruggedness outweigh need for precision timing and protection in low-voltage DC-DC.
LM5113MMX/NOPB Separate high-side/low-side inputs, 100 V VDD, no integrated dead-time control or PHASE monitoring. Designed for wide-input industrial DC-DC; requires external dead-time generator and OV comparator circuitry. Choose when system-level control logic handles timing/protection, and higher voltage tolerance (>60 V) is required.

Compared with IR2110PbF and LM5113MMX/NOPB, the L6747CTR delivers tightly coupled timing, hardware-based safety features (pre-OV, HiZ), and VRM-optimized drive strength - making it uniquely suited for high-current, low-voltage synchronous buck applications where reliability and efficiency are co-constrained.

Availability

L6747CTR is available at Aetrix Electronics and suitable for desktop CPU VRM, server VRD, and workstation GPU power delivery systems requiring stable component supply, long-term lifecycle support, and consistent thermal performance in compact 3×3 mm packages.

Supply support for L6747CTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader specializing in power management, analog, and microcontroller solutions for automotive, industrial, and computing markets.

The L6747CTR belongs to ST's high-performance power driver product line, engineered specifically for synchronous buck topologies in high-current CPU/GPU voltage regulator modules where timing precision, thermal efficiency, and hardware-level fault protection are critical.

FAQ

What is the function of the PHASE pin beyond being the high-side driver return path?

The PHASE pin serves three critical roles: (1) return path for the high-side driver, (2) input for adaptive dead-time control by sensing voltage slew rate during HS turn-off, and (3) sensing node for preliminary OV protection - triggering LGATE latch-on if voltage exceeds 1.8 V during HiZ. It directly connects to the high-side MOSFET source and must be routed with minimal inductance.

How does the L6747CTR implement "adaptive" dead-time, and how is it different from fixed dead-time drivers?

Adaptive dead-time is determined dynamically by monitoring the falling edge of the PHASE node voltage. When the HS MOSFET turns off, the driver waits until PHASE falls below a threshold before enabling the LS MOSFET - eliminating fixed delays and minimizing LS body-diode conduction time across varying load and temperature conditions. This contrasts with fixed dead-time drivers that use static timing, risking shoot-through or excessive conduction loss.

Can the L6747CTR operate with a 5 V-only supply, and what impact does this have on gate-drive strength?

Yes - the L6747CTR supports VCC and BOOT supplies independently from 5 V to 12 V. At 5 V, UGATE and LGATE peak source/sink currents reduce proportionally (e.g., ~1.5 A vs. 3.5 A at 12 V), but remain sufficient for low-RDS(on) MOSFETs used in 5 V-input VRMs. Drive strength scales with supply voltage, so 5 V operation trades some switching speed for lower gate-drive loss and improved compatibility with 5 V logic interfaces.

What layout practices are mandatory to ensure reliable operation of the VFDFPN8 package at high current?

Mandatory practices include: (1) connecting the exposed thermal pad (TH.PAD) to a dedicated PGND plane using ≥6 thermal vias, (2) placing 1 μF low-ESR MLCCs within 2 mm of VCC and BOOT pins, (3) routing UGATE/LGATE traces as short/wide as possible (<5 mm, ≥0.3 mm width), and (4) avoiding splits in the PHASE/GND return paths to prevent noise coupling into adaptive timing circuits.

L6747CTR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
8-VDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Synchronous
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
5V ~ 12V
Logic Voltage - VIL, VIH:
0.8V, 2V
Current - Peak Output (Source, Sink):
3.5A, -
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
41 V
Rise / Fall Time (Typ):
-
Operating Temperature:
0°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-VFDFPN (3x3)

L6747CTR FAQ

1.How can I place an order for L6747CTR through Aetrix?

Please submit a Request for Quotation (RFQ) for L6747CTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for L6747CTR reliable?

The price and inventory of L6747CTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L6747CTR is usually 5 days.

3.What payment methods are accepted for L6747CTR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L6747CTR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for L6747CTR?

L6747CTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your L6747CTR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for L6747CTR?

For technical support, including L6747CTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L6747CTR requirements.

6.How does Aetrix verify that L6747CTR is sourced from the original manufacturer or authorized distributors?

All L6747CTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L6747CTR meets industry standards.

7.What is the process for return or replacement of L6747CTR?

All L6747CTR units undergo pre-shipment inspection (PSI). If there is an issue with L6747CTR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The L6747CTR part is unused and in its original packaging.

Return procedure for L6747CTR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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