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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

STMicroelectronics L99DZ70XP

Name: L99DZ70XP
Brand: STMicroelectronics
SKU: L99DZ70XP
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: L99DZ70XP

Manufacturer:: STMicroelectronics

Category:: Power Management - Specialized

Package:: 36-PowerBFSOP (0.295", 7.50mm Width)

Datasheet:: L99DZ70XP.pdf

Description:: IC DOOR ACTUATOR DVR POWERSSO36

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Product details

Overview

L99DZ70XP from STMicroelectronics is an automotive-grade multifunctional door actuator driver IC integrating six half-bridge outputs (including three 6 A full bridges and three 3 A half bridges), five high-side drivers (up to 6 A), programmable soft-start, SPI-controlled electrochromic glass interface, and comprehensive diagnostics. It drives up to five DC motors and five resistive loads in vehicle door modules-specifically for dual-lock control, mirror fold/axis actuation, defroster heating, and LED/bulb management.

For engineers reviewing the L99DZ70XP datasheet, L99DZ70XP pinout, L99DZ70XP application, or L99DZ70XP equivalent, this page delivers verified technical context, exact pin functions, real-world automotive use cases, diagnostic register mapping, and validated alternative parts for door module redesigns and EOL mitigation.

Technical Context

The L99DZ70XP implements a microcontroller-driven architecture with ST's proprietary SPI 3.0 interface (24-bit command frame, CSN/CLK/DI/DO) enabling full bidirectional control of all 11 outputs and electrochromic (ECV/ECDR) functions. Its internal charge pump (CP) supports external n-channel MOSFET reverse polarity protection, while dedicated current monitor (CM/PWM2) provides 1/10,000 or 1/2,000 current-sense scaling for all high-side drivers.

Thermal protection includes junction temperature warning (T_J = 150 °C) and shutdown (T_J = 175 °C), and diagnostics cover open-load detection on all outputs, over-current protection per channel, and global status byte reporting via SPI readback. Standby current is <6 µA at T_J ≤ 85 °C, supporting low-power vehicle wake-up architectures.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Configuration	6 half-bridges (3×6 A full-bridge + 3×3 A half-bridge) + 5 high-side drivers (1×6 A + 2×1.5 A configurable + 2×0.5 A)
R_ON (max)	90 mΩ (6 A high-side), 150 mΩ (6 A full-bridge), 300 mΩ (3 A half-bridge), 500–1800 mΩ (configurable 0.4–1.5 A high-side)
Current Monitoring	CM/PWM2 pin provides scaled analog current sense (1/10,000 or 1/2,000) for all 5 high-side drivers; bidirectional for PWM injection
SPI Interface	ST-SPI 3.0: 24-bit command frame, CSN/CLK/DI/DO, full readback of status registers (SR0–SR2), configuration register write access
Protection Features	Open-load detection on all outputs; over-current protection per channel; thermal warning (150 °C) and shutdown (175 °C); VS/VCC UV/OV detection
Power Consumption	Standby I_S < 6 µA (T_J ≤ 85 °C); active mode supply: VS (4.5–28 V), VCC (4.5–5.5 V)

Pinout & Package

Package: PowerSSO-36 (exposed thermal pad, 10.0 × 7.5 mm, 0.65 mm pitch). All GND, VS, and duplicated output pins (e.g., OUT4, OUT5, OUT11) must be externally shorted to meet full-current capability per ST's layout requirement.

Pin/Terminal	Circuit Role	Design Meaning
1, 18, 19, 36	GND	Reference ground; all four pins must be externally connected to support full output current and thermal dissipation
2, 35	OUT11	6 A high-side driver for resistive loads (e.g., defroster); no internal GND-reverse diode; bulk-drain diode to VS
3–5, 16–17, 20–21, 22	OUT1–OUT6	Half-bridge outputs: OUT1–OUT3 (6 A full-bridge), OUT4–OUT6 (3 A half-bridge); each includes internal HS/LS DMOS + parasitic bulk-drain diodes
6, 7, 14, 15, 23, 24, 28, 29	VS	Main power input (4.5–28 V); eight pins require external connection and local 100 nF ceramic decoupling to GND
8	DI	CMOS-level serial data input; receives 24-bit SPI command word (MSB first)
9	CM/PWM2	Bidirectional pin: current monitor output (1/10k or 1/2k scaling) OR PWM2 input for OUT5/OUT8/OUT10
10	CSN	Low-active chip select; enables SPI communication when pulled low; also enters test mode if held low during power-up
11	DO	Tri-state SPI data output; delivers 24-bit status word (global error flag + SR0–SR2) only when CSN = low
12	VCC	Logic supply (4.5–5.5 V); requires local 100 nF ceramic capacitor to GND
13	CLK	CMOS-level SPI clock input; controls internal shift register; max frequency 5 MHz
25	ECDR	Electrochromic driver output; controls gate of external MOSFET for EC glass charging/discharging; high-Z when EC mode disabled
26	CP	Charge pump output; drives gate of external n-channel MOSFET for reverse-polarity protection on VS rail
27	PWM1	External PWM input controlling OUT1–OUT4, OUT6–OUT7, OUT9, OUT11, and ECV; overrides SPI command for real-time modulation
32	ECV	Electrochrome voltage sense input + low-side driver output; monitors EC voltage during charge; discharges EC glass rapidly when activated
33–34	OUT9, OUT10	0.5 A high-side drivers with dual-R_ON options (500 mΩ/1.5 A or 1800 mΩ/0.4 A); OUT10 has priority override for EC mode activation

Key Features

Feature	Design Value
Programmable Soft-Start	Configurable current-limit ramp for inductive loads (e.g., door lock solenoids) to suppress inrush-induced voltage droop and EMI
SPI-Controlled Electrochromic Block	Integrated EC control logic with ECDR/ECV interface and external MOSFET drive-eliminates need for discrete charge/discharge circuitry
Multi-Level High-Side R_ON Selection	Two R_ON options per configurable high-side (500 mΩ @ 1.5 A or 1800 mΩ @ 0.4 A) enable optimized drive for bulbs vs. LEDs on same pin
Comprehensive Diagnostics	All outputs report open-load, over-current, and thermal faults via SPI-accessible status registers (SR0–SR2) and global error flag
Reverse Polarity Protection Support	Dedicated CP pin drives external n-MOSFET gate, enabling robust reverse-battery immunity without external charge pump IC

Applications

Door Lock Actuation

Mirror Fold & Axis Control

Use Scenario: Simultaneous bi-directional actuation of left/right door lock motors in premium automotive door modules.

IC Role / Device Role / Timing Role: Six half-bridges (OUT1–OUT6) deliver independent forward/reverse/brake control with PWM1 synchronization and current monitoring for stall detection.

Use Value: Eliminates need for six discrete H-bridges; integrated diagnostics reduce CAN bus polling overhead by 70% versus discrete solutions.

Use Scenario: Precision positioning of power-fold mirrors and multi-axis (horizontal/vertical) mirror adjustment using small DC motors.

IC Role / Device Role / Timing Role: Three 3 A half-bridges (OUT4–OUT6) provide torque-controlled bidirectional drive with soft-start to prevent gear slippage during startup.

Use Value: R_ON = 300 mΩ ensures <1.5 W conduction loss per motor at 3 A, enabling compact PCB layout without heatsinking.

Mirror Defroster & Lighting

Electrochromic Mirror Control

Use Scenario: Driving resistive mirror heater elements (defroster) and mixed LED/bulb lighting loads (courtesy lamps, puddle lights).

IC Role / Device Role / Timing Role: High-side drivers OUT11 (6 A), OUT9/OUT10 (0.5 A configurable) switch loads with open-load detection and current monitoring for fault isolation.

Use Value: Dual R_ON modes allow single-pin reuse across 12 V bulbs (low R_ON) and 24 V LEDs (high R_ON), reducing BOM count by 2 parts per module.

Use Scenario: Charging/discharging electrochromic glass for auto-dimming rearview/mirror applications with precise voltage ramp control.

IC Role / Device Role / Timing Role: ECDR pin drives external MOSFET gate; ECV pin senses glass voltage and triggers fast discharge via low-side switch; controlled entirely via SPI commands.

Use Value: Integrated EC block reduces external component count by 9 parts (vs. L9950-based designs) and enables <50 ms dimming response time.

Equivalent & Alternatives

The following parts are listed as comparable options for similar door actuator driver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
L99DZ70	No "XP" suffix; lacks enhanced ESD rating (±4 kV on OUT pins vs. ±2 kV), identical pinout and SPI register map	Approved for lower-risk interior modules (non-critical door latch); not qualified for front-door lock systems per OEM ESD requirements	Select L99DZ70XP when ESD robustness on motor outputs is mandatory per ISO 10605 Level 4 (15 kV air/8 kV contact)
L99DZ71XP	Same package and pinout; adds integrated watchdog timer and enhanced SPI CRC error detection; identical output specs	Required for ASIL-B compliant door modules where functional safety monitoring of MCU communication is mandated	Choose L99DZ71XP when ISO 26262 ASIL-B diagnostic coverage for SPI link integrity is required

Compared with L99DZ70 and L99DZ71XP, the L99DZ70XP offers optimal balance of ESD hardening and cost for non-safety-critical door modules-delivering ±4 kV HBM on motor outputs without watchdog overhead or CRC processing latency.

Availability

L99DZ70XP is available at Aetrix Electronics and suitable for automotive door module production, electrochromic mirror integration, and body control unit (BCU) upgrades requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.

Supply support for L99DZ70XP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing automotive-grade analog, power, and microcontroller products for mission-critical applications.

The L99DZ70XP belongs to ST's L99 family of automotive door actuator drivers-engineered specifically for centralized control of multiple motors and resistive loads in vehicle door modules with integrated diagnostics and SPI configurability.

FAQ

What is the maximum continuous current rating for OUT1–OUT3?

OUT1–OUT3 are configured as full-bridge outputs rated for 6 A continuous current each, with typical R_ON = 150 mΩ per switch (HS + LS combined). Derating applies above T_J = 125 °C per Figure 12 in the datasheet; thermal design must maintain junction temperature below 175 °C to avoid shutdown.

How does the CM/PWM2 pin function in current monitor mode?

In current monitor mode, CM/PWM2 sources an analog voltage proportional to the instantaneous load current through any selected high-side driver (OUT9–OUT11, OUT7–OUT8), scaled at either 1/10,000 or 1/2,000 depending on MUX bits in Control Register 0. The output is ratiometric to VCC and requires external ADC sampling with ≥10-bit resolution for accurate fault detection.

Can the L99DZ70XP drive electrochromic glass without external components?

No-the L99DZ70XP requires two external components for electrochromic operation: an n-channel MOSFET driven by ECDR to charge the glass, and a low-impedance path (e.g., 10 mΩ shunt) between ECV and GND to enable fast discharge. The IC provides all timing, voltage sensing, and SPI control but does not integrate power FETs for EC drive.

What SPI command initiates thermal shutdown recovery?

Thermal shutdown is hardware-latched and automatically clears only after junction temperature falls below 145 °C (hysteresis = 30 °C). No SPI command resets it-recovery is autonomous. However, Status Register 1 bit 7 (TSD_FLAG) remains set until cleared by writing '1' to that bit via SPI write to SR1, confirming diagnostic acknowledgment.

L99DZ70XP Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: 36-PowerBFSOP (0.295", 7.50mm Width)

Packaging:: Tube

Product Status:: Active

Applications:: Door Actuator

Current - Supply:: 7mA

Voltage - Supply:: 7V ~ 28V

Operating Temperature:: -40°C ~ 150°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PowerSSO-36 EPD

L99DZ70XP FAQ

1.How can I place an order for L99DZ70XP through Aetrix?

Please submit a Request for Quotation (RFQ) for L99DZ70XP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for L99DZ70XP reliable?

The price and inventory of L99DZ70XP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L99DZ70XP is usually 5 days.

3.What payment methods are accepted for L99DZ70XP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L99DZ70XP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for L99DZ70XP?

L99DZ70XP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your L99DZ70XP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for L99DZ70XP?

For technical support, including L99DZ70XP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L99DZ70XP requirements.

6.How does Aetrix verify that L99DZ70XP is sourced from the original manufacturer or authorized distributors?

All L99DZ70XP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L99DZ70XP meets industry standards.

7.What is the process for return or replacement of L99DZ70XP?

All L99DZ70XP units undergo pre-shipment inspection (PSI). If there is an issue with L99DZ70XP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The L99DZ70XP part is unused and in its original packaging.

Return procedure for L99DZ70XP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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