My Inquiry
My Account
STMicroelectronics L99DZ70XPTR
- Part No.:
- L99DZ70XPTR
- Manufacturer:
- STMicroelectronics
- Category:
- Power Management - Specialized
- Package:
- 36-PowerFSOP (0.295", 7.50mm Width)
- Datasheet:
-
L99DZ70XPTR.pdf
- Description:
- IC DOOR ACTUATOR DRVR POWERSSO36
- Quantity:
- Payment:
- Shipping:
Inventory:3,943
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
L99DZ70XPTR from STMicroelectronics is an automotive-grade multifunctional door actuator driver IC integrating six half-bridge outputs (including three 6 A full bridges and three 3 A half bridges), five high-side drivers (up to 6 A), programmable soft-start, current monitoring, open-load/over-current/thermal protection, and SPI-controlled electrochromic glass control. It drives up to five DC motors and five resistive loads in vehicle door modules for lock, mirror fold/axis, defroster, and lighting functions.
For engineers reviewing the L99DZ70XPTR datasheet, L99DZ70XPTR pinout, L99DZ70XPTR application, or L99DZ70XPTR equivalent, this device supports SPI-configurable motor direction/brake/Hi-Z states, real-time diagnostics via status registers, current-sense feedback on all high-side outputs, and reverse-polarity protection via external charge-pump MOSFET - critical for robust automotive body electronics design.
Technical Context
The L99DZ70XPTR implements a fully SPI-driven control architecture with 24-bit command frames, global status byte reporting, and eight configurable control/status registers enabling precise per-output state management (forward/reverse/brake/Hi-Z) and diagnostic readback. Its integrated electrochromic control block uses ECDR and ECV pins to drive external MOSFETs for charging/discharging smart mirror glass.
It features dual power domains (VS for power stage, VCC for logic), separated half-bridges dedicated to door lock motors, PWM input capability on multiple outputs, and cross-current protection. All 11 outputs include open-load detection, over-current shutdown, and thermal warning with automatic shutdown at Tj ≥ 175 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Configuration | Six half-bridges (3×6 A full bridge, 2×3 A, 1×0.75 A) + five high-side drivers (1×6 A, 2×1.5/0.4 A configurable, 2×0.5 A) |
| RON (max) | 90 mΩ (6 A high-side), 150 mΩ (6 A full bridge), 300 mΩ (3 A half-bridge), 1600 mΩ (0.75 A/0.5 A outputs) |
| Standby Current | <6 µA typical at Tj ≤ 85 °C - enables ultra-low-power vehicle sleep-mode compliance |
| Diagnostic Coverage | Open-load detection, over-current protection, temperature warning/shutdown, and current monitor output on all high-side drivers |
| SPI Interface | ST-SPI 3.0 compliant: 24-bit command frame, CSN/CLK/DI/DO, status register readback, error flag reporting |
| Package | PowerSSO-36 - thermally enhanced exposed-pad SO package with 36 pins, optimized for automotive under-hood thermal dissipation |
| Supply Range | VS: −0.3 V to 28 V (40 V transient); VCC: −0.3 V to 5.5 V - supports 12 V/24 V battery systems with reverse polarity tolerance |
Pinout & Package
Package: PowerSSO-36 - thermally optimized 36-pin exposed-pad surface-mount package with multiple GND, VS, and output pins paralleled for low-inductance, high-current routing in automotive door modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 1,18,19,36) | Ground reference | All four pins must be externally connected to minimize voltage drop and ensure full 6 A output capability |
| VS (Pins 6,7,14,15,23,24,28,29) | Main power supply input | Eight parallel pins required for low-impedance connection to battery rail; ceramic decoupling mandatory |
| OUT1–OUT6 | Half-bridge motor outputs | Configurable for bidirectional DC motor control (lock, mirror fold/axis); internal bulk-drain diodes enable freewheeling |
| OUT7–OUT11, ECV | High-side resistive load drivers | Drive bulbs, LEDs, defrosters; no internal GND-referenced diode - external flyback required for inductive loads |
| ECDR, ECV | Electrochromic control interface | ECDR drives gate of external N-MOS; ECV senses voltage and provides fast discharge path for smart mirror glass |
| CSN, CLK, DI, DO | SPI interface signals | CMOS-level serial interface for configuration, command, and diagnostic readback; tristate DO enables bus sharing |
| CM/PWM2 | Bidirectional current monitor / secondary PWM input | Provides 1/10,000 or 1/2,000 current-sense scaling; microcontroller can override as PWM input for OUT5/OUT8/OUT10 |
| CP | Charge pump output | Drives gate of external N-channel MOSFET for reverse-polarity protection - eliminates need for series diode loss |
Key Features
| Feature | Design Value |
|---|---|
| Programmable soft-start | Adjustable current-limit threshold during turn-on - prevents inrush tripping when driving high-inductance door lock solenoids |
| Integrated electrochromic controller | Dedicated ECDR/ECV interface with SPI-configurable charge/discharge timing - enables seamless integration of auto-dimming mirrors without external MCU GPIO overhead |
| Per-output diagnostic visibility | Real-time open-load, over-current, and thermal fault flags accessible via SPI status registers - eliminates need for discrete sense circuitry |
| Multi-rail power architecture | Independent VS (power stage) and VCC (logic) supplies - allows safe operation during battery brown-out while maintaining SPI communication |
| Reverse polarity protection support | On-chip charge pump (CP pin) drives external N-MOS - achieves <100 mΩ reverse-path resistance vs. >500 mΩ with Schottky diode solutions |
Applications
| Door Lock Actuation | Mirror Fold & Axis Control |
|---|---|
|
Use Scenario: Simultaneous bi-directional control of dual latch/unlatch solenoids in automotive front/rear doors. IC Role / Device Role / Timing Role: Six half-bridges (OUT1–OUT6) provide independent forward/reverse/brake states with cross-current protection and soft-start to manage 100 ms inrush peaks. Use Value: Eliminates need for six discrete H-bridges and associated gate drivers; reduces PCB area by 65% and BOM count by 22 components versus discrete solution. |
Use Scenario: Precision positioning of side-view mirror glass via two independent DC motors (fold-in/out and vertical/horizontal tilt). IC Role / Device Role / Timing Role: OUT1–OUT4 and OUT6–OUT7 configured as four half-bridges with PWM-controlled speed and SPI-monitored stall detection. Use Value: Enables closed-loop position control using current monitor feedback - improves mirror repeatability to ±0.5° without encoder. |
| Mirror Defroster & Lighting | Electrochromic Mirror Control |
|
Use Scenario: Driving 12 V/25 W resistive defroster grid and LED turn signal indicators on exterior mirrors. IC Role / Device Role / Timing Role: High-side drivers OUT9–OUT11 deliver 6 A/0.5 A loads with open-load detection and thermal derating above 125 °C junction. Use Value: Single-chip replacement for L9950; integrates bulb/LED drive with diagnostics - reduces thermal stress vs. linear regulators. |
Use Scenario: Charging/discharging electrochromic (EC) glass to achieve variable light transmission (1–30% visible light). IC Role / Device Role / Timing Role: ECDR drives external MOSFET gate; ECV monitors EC voltage and provides active discharge path - all SPI-timed with 10 ms resolution. Use Value: Achieves <500 ms full dimming transition with <±2% voltage regulation - meets UNECE R46 glare-reduction requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar door actuator driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| L99DZ70GXPTR | Same die, green (RoHS-compliant) variant with identical electrical specs and pinout | No functional difference; used where lead-free compliance is mandated | Select for automotive programs requiring ECOPACK® certification and Pb-free assembly |
| L99DZ71XPTR | Enhanced version with extended temperature range (−40 °C to 150 °C vs. −40 °C to 140 °C) and improved ESD rating (±6 kV HBM) | Required for engine bay or high-ambient zones; supports higher peak load cycling | Choose when operating ambient exceeds 105 °C or system-level ESD immunity >±4 kV is specified |
Compared with L99DZ70XPTR, L99DZ70GXPTR offers identical performance in RoHS-compliant manufacturing, while L99DZ71XPTR delivers extended thermal and ESD robustness at the cost of slightly higher quiescent current (8 µA vs. 6 µA) - selection depends strictly on compliance and environmental requirements.
Availability
L99DZ70XPTR is available at Aetrix Electronics and suitable for automotive door module production, electrochromic mirror subsystems, and body control unit (BCU) designs requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.
Supply support for L99DZ70XPTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in automotive, industrial, and power management ICs, with over 30 years of automotive qualification expertise and AEC-Q100-compliant manufacturing.
The L99DZ70XPTR belongs to ST's L99 family of automotive door actuator drivers, designed specifically to consolidate motor, resistive load, and electrochromic control into single-package solutions for next-generation vehicle body electronics.
FAQ
What is the maximum continuous current rating for OUT1–OUT3?
OUT1–OUT3 are rated for 6 A continuous DC current per channel at Tj ≤ 140 °C with adequate PCB copper pour and airflow. Their RON is 150 mΩ max, resulting in ≤540 mW conduction loss at 6 A. Derating to 5 A is recommended above 125 °C junction temperature per ST's thermal data in Section 2.3.
How does the electrochromic control block operate without external microcontroller intervention?
The electrochromic block operates autonomously once enabled via SPI configuration register bit. ECDR drives the external MOSFET gate using internally generated timing; ECV actively discharges the EC glass through its low-side switch. No continuous MCU polling is needed - only initial setup and periodic status reads.
Can CM/PWM2 be used simultaneously as current monitor and PWM input?
No - CM/PWM2 is time-multiplexed. When configured as current monitor (via MUX bits in Control Register 0), it outputs scaled current; when reconfigured as PWM2 input, it disables current sensing and accepts external PWM for OUT5/OUT8/OUT10. Switching requires SPI write and 10 µs settling.
Is external reverse polarity protection required despite the CP pin?
Yes - CP drives the gate of an external N-channel MOSFET, but the MOSFET itself and its gate-drive loop must be implemented externally. The CP pin provides regulated ~10 V output; no reverse-protection FET is integrated. Layout must minimize CP loop inductance to prevent oscillation.
L99DZ70XPTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 36-PowerFSOP (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Door Actuator
- Current - Supply:
- 7mA
- Voltage - Supply:
- 7V ~ 28V
- Operating Temperature:
- -40°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerSSO-36 EPD
L99DZ70XPTR FAQ
1.How can I place an order for L99DZ70XPTR through Aetrix?
Please submit a Request for Quotation (RFQ) for L99DZ70XPTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for L99DZ70XPTR reliable?
The price and inventory of L99DZ70XPTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L99DZ70XPTR is usually 5 days.
3.What payment methods are accepted for L99DZ70XPTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L99DZ70XPTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for L99DZ70XPTR?
L99DZ70XPTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your L99DZ70XPTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for L99DZ70XPTR?
For technical support, including L99DZ70XPTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L99DZ70XPTR requirements.
6.How does Aetrix verify that L99DZ70XPTR is sourced from the original manufacturer or authorized distributors?
All L99DZ70XPTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L99DZ70XPTR meets industry standards.
7.What is the process for return or replacement of L99DZ70XPTR?
All L99DZ70XPTR units undergo pre-shipment inspection (PSI). If there is an issue with L99DZ70XPTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The L99DZ70XPTR part is unused and in its original packaging.
Return procedure for L99DZ70XPTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
L99DZ70XPTR Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
